DE60111330D1 - Lötstruktur und elektronische leiterplatte - Google Patents

Lötstruktur und elektronische leiterplatte

Info

Publication number
DE60111330D1
DE60111330D1 DE60111330T DE60111330T DE60111330D1 DE 60111330 D1 DE60111330 D1 DE 60111330D1 DE 60111330 T DE60111330 T DE 60111330T DE 60111330 T DE60111330 T DE 60111330T DE 60111330 D1 DE60111330 D1 DE 60111330D1
Authority
DE
Germany
Prior art keywords
conductor plate
electronic conductor
soldering structure
soldering
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60111330T
Other languages
English (en)
Other versions
DE60111330T2 (de
Inventor
Kenichiro Suetsugu
Masuo Koshi
Kenichiro Todoroki
Shunji Hibino
Hiroaki Takano
Mikiya Nakata
Yukio Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60111330D1 publication Critical patent/DE60111330D1/de
Publication of DE60111330T2 publication Critical patent/DE60111330T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
DE60111330T 2000-03-15 2001-03-14 Lötstruktur und elektronische leiterplatte Expired - Lifetime DE60111330T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000071637 2000-03-15
JP2000071635 2000-03-15
JP2000071637 2000-03-15
JP2000071635 2000-03-15
PCT/JP2001/001994 WO2001069990A1 (fr) 2000-03-15 2001-03-14 Structure liee et carte a circuit imprime electronique

Publications (2)

Publication Number Publication Date
DE60111330D1 true DE60111330D1 (de) 2005-07-14
DE60111330T2 DE60111330T2 (de) 2006-05-18

Family

ID=26587528

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60111330T Expired - Lifetime DE60111330T2 (de) 2000-03-15 2001-03-14 Lötstruktur und elektronische leiterplatte

Country Status (6)

Country Link
US (1) US6657135B2 (de)
EP (1) EP1206170B1 (de)
JP (3) JP4718091B2 (de)
KR (1) KR20020002495A (de)
DE (1) DE60111330T2 (de)
WO (1) WO2001069990A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547817B2 (ja) * 2000-03-15 2010-09-22 ソニー株式会社 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法
JP2002185120A (ja) * 2000-12-19 2002-06-28 Toshiba Corp 部品実装基板およびその製造方法
EP1367875A4 (de) * 2001-03-07 2008-07-30 Sony Corp "kontaktstellenteil einer leiterplatte, verfahren zur herstellung einer leiterplatte und leiterplattenanbringungsverfahren"
JP4554873B2 (ja) * 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
JP4143478B2 (ja) * 2002-10-02 2008-09-03 アルプス電気株式会社 はんだ接続構造および電子部品のはんだ接続方法
US20040155097A1 (en) * 2003-02-04 2004-08-12 Matsushita Electric Industrial Co., Ltd. Soldering method and method for manufacturing component mounting board
JP4910378B2 (ja) * 2005-03-01 2012-04-04 株式会社デンソー Ｘ線検査装置及びｘ線検査方法
US7718927B2 (en) * 2005-03-15 2010-05-18 Medconx, Inc. Micro solder pot
JP4580839B2 (ja) * 2005-08-05 2010-11-17 プライムアースＥｖエナジー株式会社 プリント配線板
JP2007235044A (ja) * 2006-03-03 2007-09-13 Tokai Rika Co Ltd スルーホールのはんだ付け構造
JP4650948B2 (ja) * 2006-05-08 2011-03-16 株式会社東海理化電機製作所 スルーホールのはんだ付け構造
US8569632B2 (en) * 2006-10-16 2013-10-29 Napra Co., Ltd. Wiring board having through hole or non-through hole, and method for producing the same
KR101319548B1 (ko) * 2006-12-26 2013-10-21 삼성전자주식회사 인쇄회로기판의 휨방지장치
JP4923275B2 (ja) * 2007-10-10 2012-04-25 Ｎｅｃアクセステクニカ株式会社 スルーホール構造及びそれを用いたプリント配線板
JP2009200411A (ja) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp はんだ接合部、プリント配線板およびはんだの接合方法
US8923007B2 (en) * 2008-10-02 2014-12-30 Oracle America, Inc. Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ
TWM435797U (en) * 2011-12-20 2012-08-11 Msi Computer Shenzhen Co Ltd Circuit board
JP2014011308A (ja) * 2012-06-29 2014-01-20 Mitsubishi Electric Corp プリント基板
JP6221440B2 (ja) * 2013-07-11 2017-11-01 オムロン株式会社 プリント配線基板、及びそれを備えた電動工具用スイッチ
JP2016149466A (ja) * 2015-02-12 2016-08-18 矢崎総業株式会社 バスバープレート、電子部品ユニット及びワイヤハーネス
JP2017183504A (ja) * 2016-03-30 2017-10-05 サンデン・オートモーティブコンポーネント株式会社 多層回路基板
CN105958240A (zh) * 2016-05-30 2016-09-21 努比亚技术有限公司 一种耳机插座固定结构及移动终端
DE202017006874U1 (de) 2017-09-20 2018-08-29 Ebm-Papst St. Georgen Gmbh & Co. Kg Leiterplatten-Baugruppe
JP2019095338A (ja) * 2017-11-24 2019-06-20 ミネベアミツミ株式会社 ひずみゲージ、センサモジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242719A (en) * 1979-06-01 1980-12-30 Interconnection Technology, Inc. Solder-weld P.C. board apparatus
JPH08163407A (ja) * 1994-11-30 1996-06-21 Victor Co Of Japan Ltd リンギング低減装置
JPH08181424A (ja) * 1994-12-26 1996-07-12 Sony Corp プリント基板及びその半田付け方法
US5637835A (en) * 1995-05-26 1997-06-10 The Foxboro Company Automatic test detection of unsoldered thru-hole connector leads
JPH11186712A (ja) * 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
JP2000165047A (ja) 1998-11-26 2000-06-16 Nippon Carbide Ind Co Inc プリント配線板の製造方法
JP2000307223A (ja) * 1999-04-22 2000-11-02 Matsushita Electronics Industry Corp 電子回路用基板及びそれを用いた電子回路の製造方法
JP2001264667A (ja) * 2000-03-15 2001-09-26 Sony Corp 光スキャニング装置

Also Published As

Publication number Publication date
DE60111330T2 (de) 2006-05-18
WO2001069990A1 (fr) 2001-09-20
JP4718091B2 (ja) 2011-07-06
JP4463319B2 (ja) 2010-05-19
EP1206170B1 (de) 2005-06-08
KR20020002495A (ko) 2002-01-09
JP2009088573A (ja) 2009-04-23
EP1206170A1 (de) 2002-05-15
US6657135B2 (en) 2003-12-02
US20020187689A1 (en) 2002-12-12
JP2008252134A (ja) 2008-10-16
EP1206170A4 (de) 2003-06-04
JP4669535B2 (ja) 2011-04-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP