DE60103964D1 - Verfahren und Vorrichtung zur Ermittlung von Aberrationen in einem optischen System - Google Patents
Verfahren und Vorrichtung zur Ermittlung von Aberrationen in einem optischen SystemInfo
- Publication number
- DE60103964D1 DE60103964D1 DE60103964T DE60103964T DE60103964D1 DE 60103964 D1 DE60103964 D1 DE 60103964D1 DE 60103964 T DE60103964 T DE 60103964T DE 60103964 T DE60103964 T DE 60103964T DE 60103964 D1 DE60103964 D1 DE 60103964D1
- Authority
- DE
- Germany
- Prior art keywords
- optical system
- determining aberrations
- aberrations
- determining
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/729,695 US6753954B2 (en) | 2000-12-06 | 2000-12-06 | Method and apparatus for detecting aberrations in a projection lens utilized for projection optics |
US729695 | 2000-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60103964D1 true DE60103964D1 (de) | 2004-07-29 |
DE60103964T2 DE60103964T2 (de) | 2005-07-14 |
Family
ID=24932190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60103964T Expired - Fee Related DE60103964T2 (de) | 2000-12-06 | 2001-12-04 | Verfahren und Vorrichtung zur Ermittlung von Aberrationen in einem optischen System |
Country Status (6)
Country | Link |
---|---|
US (2) | US6753954B2 (de) |
EP (1) | EP1213618B1 (de) |
JP (1) | JP3910065B2 (de) |
KR (1) | KR100483515B1 (de) |
DE (1) | DE60103964T2 (de) |
TW (1) | TWI239434B (de) |
Families Citing this family (68)
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US20050136340A1 (en) * | 2000-07-21 | 2005-06-23 | Asml Netherlands B.V. | Lithographic apparatus and methods, patterning structure and method for making a patterning structure, device manufacturing method, and device manufactured thereby |
US7099011B2 (en) * | 2000-12-08 | 2006-08-29 | Litel Instruments | Method and apparatus for self-referenced projection lens distortion mapping |
DE10224363A1 (de) * | 2002-05-24 | 2003-12-04 | Zeiss Carl Smt Ag | Verfahren zur Bestimmung von Wellenfrontaberrationen |
JP2004079778A (ja) * | 2002-08-19 | 2004-03-11 | Nikon Corp | 露光装置、露光システム、および露光方法 |
AU2003299606A1 (en) * | 2002-12-13 | 2004-07-09 | Bruce W. Smith | Method for aberration detection and measurement |
US7768648B2 (en) * | 2002-12-13 | 2010-08-03 | Smith Bruce W | Method for aberration evaluation in a projection system |
US7318214B1 (en) | 2003-06-19 | 2008-01-08 | Invarium, Inc. | System and method for reducing patterning variability in integrated circuit manufacturing through mask layout corrections |
CN1910516B (zh) | 2004-01-29 | 2011-01-12 | 克拉-坦科技术股份有限公司 | 用于检测标线设计数据中的缺陷的计算机实现方法 |
JP2007520755A (ja) | 2004-02-05 | 2007-07-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | マスク検査装置及び方法 |
US9188974B1 (en) | 2004-02-13 | 2015-11-17 | Kla-Tencor Technologies Corp. | Methods for improved monitor and control of lithography processes |
DE102004010379A1 (de) * | 2004-03-03 | 2005-09-22 | Schott Ag | Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile |
US7266800B2 (en) * | 2004-06-04 | 2007-09-04 | Invarium, Inc. | Method and system for designing manufacturable patterns that account for the pattern- and position-dependent nature of patterning processes |
US7148144B1 (en) | 2004-09-13 | 2006-12-12 | Spansion Llc | Method of forming copper sulfide layer over substrate |
US7135396B1 (en) | 2004-09-13 | 2006-11-14 | Spansion Llc | Method of making a semiconductor structure |
JP4904034B2 (ja) | 2004-09-14 | 2012-03-28 | ケーエルエー−テンカー コーポレイション | レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体 |
US7588868B2 (en) * | 2004-10-06 | 2009-09-15 | Cadence Design Systems, Inc. | Method and system for reducing the impact of across-wafer variations on critical dimension measurements |
US20060113524A1 (en) * | 2004-12-01 | 2006-06-01 | Colin Bill | Polymer-based transistor devices, methods, and systems |
US7579631B2 (en) * | 2005-03-22 | 2009-08-25 | Spansion Llc | Variable breakdown characteristic diode |
US7145824B2 (en) * | 2005-03-22 | 2006-12-05 | Spansion Llc | Temperature compensation of thin film diode voltage threshold in memory sensing circuit |
US20060245235A1 (en) * | 2005-05-02 | 2006-11-02 | Advanced Micro Devices, Inc. | Design and operation of a resistance switching memory cell with diode |
US7361586B2 (en) * | 2005-07-01 | 2008-04-22 | Spansion Llc | Preamorphization to minimize void formation |
US20070025166A1 (en) * | 2005-07-27 | 2007-02-01 | Spansion Llc | Program/erase waveshaping control to increase data retention of a memory cell |
US7355179B1 (en) * | 2005-07-30 | 2008-04-08 | Rockwell Collins, Inc. | Scene imaging system integrity monitor and method thereof |
US7769225B2 (en) * | 2005-08-02 | 2010-08-03 | Kla-Tencor Technologies Corp. | Methods and systems for detecting defects in a reticle design pattern |
US7632706B2 (en) * | 2005-10-21 | 2009-12-15 | Spansion Llc | System and method for processing an organic memory cell |
US7676077B2 (en) | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US8041103B2 (en) | 2005-11-18 | 2011-10-18 | Kla-Tencor Technologies Corp. | Methods and systems for determining a position of inspection data in design data space |
KR101368601B1 (ko) * | 2005-12-23 | 2014-02-27 | 칼 짜이스 에스엠테 게엠베하 | 결상 오차 결정부를 갖춘 광학 결상 장치 |
DE102005062618B4 (de) | 2005-12-23 | 2008-05-08 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung und Abbildungsverfahren mit Bestimmung von Abbildungsfehlern |
US7902086B2 (en) * | 2006-12-08 | 2011-03-08 | Spansion Llc | Prevention of oxidation of carrier ions to improve memory retention properties of polymer memory cell |
WO2008077100A2 (en) * | 2006-12-19 | 2008-06-26 | Kla-Tencor Corporation | Systems and methods for creating inspection recipes |
WO2008086282A2 (en) | 2007-01-05 | 2008-07-17 | Kla-Tencor Corporation | Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions |
US7962863B2 (en) | 2007-05-07 | 2011-06-14 | Kla-Tencor Corp. | Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer |
US7738093B2 (en) | 2007-05-07 | 2010-06-15 | Kla-Tencor Corp. | Methods for detecting and classifying defects on a reticle |
US8213704B2 (en) | 2007-05-09 | 2012-07-03 | Kla-Tencor Corp. | Methods and systems for detecting defects in a reticle design pattern |
JP4551913B2 (ja) * | 2007-06-01 | 2010-09-29 | 株式会社東芝 | 半導体装置の製造方法 |
US7796804B2 (en) | 2007-07-20 | 2010-09-14 | Kla-Tencor Corp. | Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer |
US7711514B2 (en) | 2007-08-10 | 2010-05-04 | Kla-Tencor Technologies Corp. | Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan |
US7975245B2 (en) | 2007-08-20 | 2011-07-05 | Kla-Tencor Corp. | Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects |
US8715909B2 (en) * | 2007-10-05 | 2014-05-06 | Infineon Technologies Ag | Lithography systems and methods of manufacturing using thereof |
US8139844B2 (en) | 2008-04-14 | 2012-03-20 | Kla-Tencor Corp. | Methods and systems for determining a defect criticality index for defects on wafers |
KR101623747B1 (ko) | 2008-07-28 | 2016-05-26 | 케이엘에이-텐코어 코오포레이션 | 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들 |
DE102008048660B4 (de) * | 2008-09-22 | 2015-06-18 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zur Vermessung von Strukturen auf Photolithographiemasken |
US8161422B2 (en) * | 2009-01-06 | 2012-04-17 | International Business Machines Corporation | Fast and accurate method to simulate intermediate range flare effects |
US8775101B2 (en) | 2009-02-13 | 2014-07-08 | Kla-Tencor Corp. | Detecting defects on a wafer |
US8204297B1 (en) | 2009-02-27 | 2012-06-19 | Kla-Tencor Corp. | Methods and systems for classifying defects detected on a reticle |
US8112241B2 (en) | 2009-03-13 | 2012-02-07 | Kla-Tencor Corp. | Methods and systems for generating an inspection process for a wafer |
US8588508B2 (en) * | 2010-05-28 | 2013-11-19 | Nikon Corporation | Method or matching high-numerical aperture scanners |
US8699781B1 (en) | 2010-06-14 | 2014-04-15 | Rockwell Collins, Inc. | Embedded symbology for use with scene imaging system |
US8781781B2 (en) | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
US9170211B2 (en) | 2011-03-25 | 2015-10-27 | Kla-Tencor Corp. | Design-based inspection using repeating structures |
US9087367B2 (en) | 2011-09-13 | 2015-07-21 | Kla-Tencor Corp. | Determining design coordinates for wafer defects |
US8831334B2 (en) | 2012-01-20 | 2014-09-09 | Kla-Tencor Corp. | Segmentation for wafer inspection |
US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
US9189844B2 (en) | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
US9053527B2 (en) | 2013-01-02 | 2015-06-09 | Kla-Tencor Corp. | Detecting defects on a wafer |
US9134254B2 (en) | 2013-01-07 | 2015-09-15 | Kla-Tencor Corp. | Determining a position of inspection system output in design data space |
US9311698B2 (en) | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
US9092846B2 (en) | 2013-02-01 | 2015-07-28 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific and multi-channel information |
US9865512B2 (en) | 2013-04-08 | 2018-01-09 | Kla-Tencor Corp. | Dynamic design attributes for wafer inspection |
US9310320B2 (en) | 2013-04-15 | 2016-04-12 | Kla-Tencor Corp. | Based sampling and binning for yield critical defects |
CN103217871B (zh) * | 2013-04-19 | 2014-11-26 | 中国科学院上海光学精密机械研究所 | 基于相位环空间像主成分分析的投影物镜波像差检测方法 |
US9258274B2 (en) | 2014-07-09 | 2016-02-09 | Shape Security, Inc. | Using individualized APIs to block automated attacks on native apps and/or purposely exposed APIs |
US10451564B2 (en) * | 2017-10-27 | 2019-10-22 | Applied Materials, Inc. | Empirical detection of lens aberration for diffraction-limited optical system |
WO2019091678A1 (en) | 2017-11-07 | 2019-05-16 | Asml Netherlands B.V. | Metrology apparatus and a method of determining a characteristic of interest |
CN113008522A (zh) * | 2021-03-08 | 2021-06-22 | 苏州长光华芯光电技术股份有限公司 | 激光器寿命老化测试装置 |
KR20230062343A (ko) | 2021-10-29 | 2023-05-09 | 고려대학교 산학협력단 | 고심도 초고해상도 이미징을 위한 파면 측정 방식의 적응광학에 기반하는 현미경 시스템 및 그 동작방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US5300786A (en) * | 1992-10-28 | 1994-04-05 | International Business Machines Corporation | Optical focus phase shift test pattern, monitoring system and process |
US5677091A (en) * | 1994-11-01 | 1997-10-14 | International Business Machines Corporation | Lithographic print bias/overlay target and applied metrology |
TW357262B (en) | 1996-12-19 | 1999-05-01 | Nikon Corp | Method for the measurement of aberration of optical projection system, a mask and a exposure device for optical project system |
JP3634550B2 (ja) * | 1997-04-03 | 2005-03-30 | 株式会社ルネサステクノロジ | 投影レンズの収差測定方法 |
JP3256678B2 (ja) | 1998-02-19 | 2002-02-12 | 株式会社東芝 | レンズの収差測定方法 |
WO1999047981A1 (en) | 1998-03-17 | 1999-09-23 | Asml Masktools Netherlands B.V. | METHOD OF PATTERNING SUB-0.25μ LINE FEATURES WITH HIGH TRANSMISSION, 'ATTENUATED' PHASE SHIFT MASKS |
JP4032501B2 (ja) | 1998-04-22 | 2008-01-16 | 株式会社ニコン | 投影光学系の結像特性計測方法及び投影露光装置 |
JP2000146758A (ja) * | 1998-11-18 | 2000-05-26 | Hitachi Ltd | レンズ収差測定方法およびそれに用いるホトマスクならびに半導体装置の製造方法 |
US6248486B1 (en) * | 1998-11-23 | 2001-06-19 | U.S. Philips Corporation | Method of detecting aberrations of an optical imaging system |
JP2001174615A (ja) * | 1999-04-15 | 2001-06-29 | Nikon Corp | 回折光学素子、該素子の製造方法、該素子を備える照明装置、投影露光装置、露光方法、及び光ホモジナイザー、該光ホモジナイザーの製造方法 |
JP3999910B2 (ja) * | 1999-04-30 | 2007-10-31 | 住友化学株式会社 | 押出成形装置とこれを用いる成形体の製造方法 |
WO2001051993A1 (en) * | 2000-01-14 | 2001-07-19 | Advanced Micro Devices, Inc. | System, method and photomask for compensating aberrations in a photolithography patterning system |
-
2000
- 2000-12-06 US US09/729,695 patent/US6753954B2/en not_active Expired - Lifetime
-
2001
- 2001-11-15 TW TW090128361A patent/TWI239434B/zh not_active IP Right Cessation
- 2001-12-04 US US10/001,196 patent/US6788400B2/en not_active Expired - Lifetime
- 2001-12-04 KR KR10-2001-0076289A patent/KR100483515B1/ko not_active IP Right Cessation
- 2001-12-04 EP EP01310139A patent/EP1213618B1/de not_active Expired - Lifetime
- 2001-12-04 JP JP2001402407A patent/JP3910065B2/ja not_active Expired - Lifetime
- 2001-12-04 DE DE60103964T patent/DE60103964T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1213618B1 (de) | 2004-06-23 |
US20030098970A1 (en) | 2003-05-29 |
US6753954B2 (en) | 2004-06-22 |
TWI239434B (en) | 2005-09-11 |
JP3910065B2 (ja) | 2007-04-25 |
DE60103964T2 (de) | 2005-07-14 |
KR100483515B1 (ko) | 2005-04-15 |
EP1213618A1 (de) | 2002-06-12 |
US6788400B2 (en) | 2004-09-07 |
US20020088951A1 (en) | 2002-07-11 |
KR20020045536A (ko) | 2002-06-19 |
JP2002231626A (ja) | 2002-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |