DE60103930D1 - Elektrostatischevorrichtung zur greifen eines wafers - Google Patents

Elektrostatischevorrichtung zur greifen eines wafers

Info

Publication number
DE60103930D1
DE60103930D1 DE60103930T DE60103930T DE60103930D1 DE 60103930 D1 DE60103930 D1 DE 60103930D1 DE 60103930 T DE60103930 T DE 60103930T DE 60103930 T DE60103930 T DE 60103930T DE 60103930 D1 DE60103930 D1 DE 60103930D1
Authority
DE
Germany
Prior art keywords
wafer
support
gripping
planar
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60103930T
Other languages
English (en)
Other versions
DE60103930T2 (de
Inventor
David Ferreres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semco Engineering SA
Original Assignee
Semco Engineering SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Engineering SA filed Critical Semco Engineering SA
Publication of DE60103930D1 publication Critical patent/DE60103930D1/de
Application granted granted Critical
Publication of DE60103930T2 publication Critical patent/DE60103930T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Elimination Of Static Electricity (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE60103930T 2000-12-12 2001-12-12 Elektrostatischevorrichtung zur greifen eines wafers Expired - Lifetime DE60103930T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0016154 2000-12-12
FR0016154A FR2818050B1 (fr) 2000-12-12 2000-12-12 Dispositif de prehension electrostatique d'une tranche de composant electronique
PCT/FR2001/003954 WO2002049200A1 (fr) 2000-12-12 2001-12-12 Dispositif de prehension electrostatique d'une tranche de composant electronique

Publications (2)

Publication Number Publication Date
DE60103930D1 true DE60103930D1 (de) 2004-07-22
DE60103930T2 DE60103930T2 (de) 2005-06-23

Family

ID=8857544

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103930T Expired - Lifetime DE60103930T2 (de) 2000-12-12 2001-12-12 Elektrostatischevorrichtung zur greifen eines wafers

Country Status (11)

Country Link
US (1) US7133273B2 (de)
EP (1) EP1342311B1 (de)
JP (1) JP4155823B2 (de)
KR (1) KR100589796B1 (de)
AT (1) ATE269601T1 (de)
AU (1) AU2002217253A1 (de)
DE (1) DE60103930T2 (de)
DK (1) DK1342311T3 (de)
ES (1) ES2220668T3 (de)
FR (1) FR2818050B1 (de)
WO (1) WO2002049200A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE526745C2 (sv) * 2003-04-17 2005-11-01 Nobel Biocare Ab Fixtur för förankring i käkben
KR101515184B1 (ko) 2010-06-11 2015-04-24 가부시키가이샤 리코 정보 저장 장치, 탈착 장치, 현상제 용기 및 화상 형성 장치
US9293356B2 (en) 2011-06-03 2016-03-22 Tel Nexx, Inc. Parallel single substrate processing system
FR2980994B1 (fr) 2011-10-07 2015-11-27 Semco Engineering Prehenseur multi-plaquettes.
JP6011965B2 (ja) * 2012-09-19 2016-10-25 パナソニックＩｐマネジメント株式会社 プラズマダイシング方法及びプラズマダイシング装置
CN104526698B (zh) * 2014-12-04 2016-06-01 北京七星华创电子股份有限公司 一种高强度的机械手臂、控制方法以及机械手装置
US20210159056A1 (en) * 2018-04-26 2021-05-27 Kyocera Corporation Focus-ring conveying member and plasma processing device including focus-ring conveying member
KR102242812B1 (ko) 2018-05-17 2021-04-22 세메스 주식회사 반송 유닛 및 이를 갖는 기판 처리 장치
US11121019B2 (en) 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck
EP3614422A1 (de) 2018-08-22 2020-02-26 Meyer Burger AG Elektrostatische haltevorrichtung
US11437257B2 (en) * 2019-05-08 2022-09-06 Samsung Electronics Co., Ltd. Robot hand, wafer transfer robot, and wafer transfer apparatus
US11696821B2 (en) 2021-03-31 2023-07-11 Toyota Motor Engineering & Manufacturing North America, Inc. Asymmetric electrode insulation for artificial muscles

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443215A (en) * 1973-11-07 1976-07-21 Mullard Ltd Electrostatically clamping a semiconductor wafer during device manufacture
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JPH01303079A (ja) * 1988-05-30 1989-12-06 Abisare:Kk フレキシブル差込み端子を有する静電吸着板
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
DE19523229A1 (de) * 1995-06-27 1997-01-02 Riad Dipl Ing Salim Mikrogreifer für die Mikromontage
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
DE19715083A1 (de) * 1997-04-11 1997-08-28 Univ Ilmenau Tech Mechanischer Greifer, insbesondere zum Greifen kleiner Objekte
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
JPH11157953A (ja) 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
US6174011B1 (en) * 1999-04-14 2001-01-16 Arthur Keigler Method of and apparatus for handling thin and flat workpieces and the like

Also Published As

Publication number Publication date
DK1342311T3 (da) 2004-10-18
FR2818050B1 (fr) 2006-08-11
JP2004516660A (ja) 2004-06-03
AU2002217253A1 (en) 2002-06-24
ES2220668T3 (es) 2004-12-16
DE60103930T2 (de) 2005-06-23
FR2818050A1 (fr) 2002-06-14
ATE269601T1 (de) 2004-07-15
US20040070914A1 (en) 2004-04-15
KR100589796B1 (ko) 2006-06-14
WO2002049200A1 (fr) 2002-06-20
KR20030064812A (ko) 2003-08-02
EP1342311A1 (de) 2003-09-10
JP4155823B2 (ja) 2008-09-24
US7133273B2 (en) 2006-11-07
EP1342311B1 (de) 2004-06-16

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