DE60041350D1 - Verfahren und gerät zur steuerung eines plasmavolumens - Google Patents

Verfahren und gerät zur steuerung eines plasmavolumens

Info

Publication number
DE60041350D1
DE60041350D1 DE60041350T DE60041350T DE60041350D1 DE 60041350 D1 DE60041350 D1 DE 60041350D1 DE 60041350 T DE60041350 T DE 60041350T DE 60041350 T DE60041350 T DE 60041350T DE 60041350 D1 DE60041350 D1 DE 60041350D1
Authority
DE
Germany
Prior art keywords
magnetic
magnetic field
process chamber
plasma
bucket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60041350T
Other languages
English (en)
Inventor
Andrew D Bailey
Alan M Schoepp
Nicolas Bright
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60041350D1 publication Critical patent/DE60041350D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32688—Multi-cusp fields

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
DE60041350T 1999-11-15 2000-11-14 Verfahren und gerät zur steuerung eines plasmavolumens Expired - Lifetime DE60041350D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/439,759 US6322661B1 (en) 1999-11-15 1999-11-15 Method and apparatus for controlling the volume of a plasma
PCT/US2000/042158 WO2001037311A2 (en) 1999-11-15 2000-11-14 Method and apparatus for controlling the volume of a plasma

Publications (1)

Publication Number Publication Date
DE60041350D1 true DE60041350D1 (de) 2009-02-26

Family

ID=23746030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60041350T Expired - Lifetime DE60041350D1 (de) 1999-11-15 2000-11-14 Verfahren und gerät zur steuerung eines plasmavolumens

Country Status (10)

Country Link
US (1) US6322661B1 (de)
EP (1) EP1230667B1 (de)
JP (1) JP5331283B2 (de)
KR (1) KR100778258B1 (de)
CN (2) CN1225005C (de)
AT (1) ATE420455T1 (de)
AU (1) AU3082201A (de)
DE (1) DE60041350D1 (de)
TW (1) TW530523B (de)
WO (1) WO2001037311A2 (de)

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US6320320B1 (en) 1999-11-15 2001-11-20 Lam Research Corporation Method and apparatus for producing uniform process rates
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US7422654B2 (en) * 2003-02-14 2008-09-09 Applied Materials, Inc. Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor
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WO2008024392A2 (en) 2006-08-22 2008-02-28 Valery Godyak Inductive plasma source with high coupling efficiency
US8992725B2 (en) 2006-08-28 2015-03-31 Mattson Technology, Inc. Plasma reactor with inductie excitation of plasma and efficient removal of heat from the excitation coil
US8092605B2 (en) * 2006-11-28 2012-01-10 Applied Materials, Inc. Magnetic confinement of a plasma
US7824519B2 (en) * 2007-05-18 2010-11-02 Lam Research Corporation Variable volume plasma processing chamber and associated methods
MX345403B (es) 2009-05-13 2017-01-30 Sio2 Medical Products Inc Revestimiento por pecvd utilizando un precursor organosilícico.
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US20120160806A1 (en) * 2009-08-21 2012-06-28 Godyak Valery A Inductive plasma source
JP5367522B2 (ja) 2009-09-24 2013-12-11 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッド
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
CN102573258B (zh) * 2010-12-15 2014-11-05 北京北方微电子基地设备工艺研究中心有限责任公司 感应耦合等离子体装置
JP5661513B2 (ja) 2011-03-03 2015-01-28 東京エレクトロン株式会社 プラズマ処理装置
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
JP5870568B2 (ja) * 2011-05-12 2016-03-01 東京エレクトロン株式会社 成膜装置、プラズマ処理装置、成膜方法及び記憶媒体
EP2776603B1 (de) 2011-11-11 2019-03-06 SiO2 Medical Products, Inc. Passivierungs-, ph-schutz- oder schmierbeschichtung für arzneimittelverpackung, beschichtungsverfahren und vorrichtung
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
CA2887352A1 (en) 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
EP2914762B1 (de) 2012-11-01 2020-05-13 SiO2 Medical Products, Inc. Verfahren zur inspektion einer beschichtung
US9903782B2 (en) 2012-11-16 2018-02-27 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
WO2014085348A2 (en) 2012-11-30 2014-06-05 Sio2 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
JP5939147B2 (ja) 2012-12-14 2016-06-22 東京エレクトロン株式会社 成膜装置、基板処理装置及び成膜方法
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
KR102472240B1 (ko) 2013-03-11 2022-11-30 에스아이오2 메디컬 프로덕츠, 인크. 코팅된 패키징
WO2014144926A1 (en) 2013-03-15 2014-09-18 Sio2 Medical Products, Inc. Coating method
US11066745B2 (en) 2014-03-28 2021-07-20 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
US11077233B2 (en) 2015-08-18 2021-08-03 Sio2 Medical Products, Inc. Pharmaceutical and other packaging with low oxygen transmission rate
US20220102119A1 (en) * 2020-09-25 2022-03-31 Tokyo Electron Limited Plasma processing apparatus
CN113735632B (zh) * 2021-09-03 2022-05-17 重庆大学 一种磁控式空气等离子体制备氮肥***

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US5032205A (en) * 1989-05-05 1991-07-16 Wisconsin Alumni Research Foundation Plasma etching apparatus with surface magnetic fields
US5421891A (en) 1989-06-13 1995-06-06 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5122251A (en) 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5091049A (en) 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
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US4990229A (en) 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
JP3126405B2 (ja) * 1991-04-30 2001-01-22 株式会社日立製作所 スパッタデポジション装置
US5226967A (en) 1992-05-14 1993-07-13 Lam Research Corporation Plasma apparatus including dielectric window for inducing a uniform electric field in a plasma chamber
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5484485A (en) * 1993-10-29 1996-01-16 Chapman; Robert A. Plasma reactor with magnet for protecting an electrostatic chuck from the plasma
FR2715019B1 (fr) * 1994-01-13 1996-04-05 Plasmion Dispositif pour former un plasma par application de micro-ondes afin de produire un faisceau d'ions.
JP3365067B2 (ja) 1994-02-10 2003-01-08 ソニー株式会社 プラズマ装置およびこれを用いたプラズマ処理方法
US5587038A (en) 1994-06-16 1996-12-24 Princeton University Apparatus and process for producing high density axially extending plasmas
US5540800A (en) 1994-06-23 1996-07-30 Applied Materials, Inc. Inductively coupled high density plasma reactor for plasma assisted materials processing
US5811022A (en) * 1994-11-15 1998-09-22 Mattson Technology, Inc. Inductive plasma reactor
JP3585578B2 (ja) * 1995-05-30 2004-11-04 アネルバ株式会社 プラズマ処理装置
US5810932A (en) 1995-11-22 1998-09-22 Nec Corporation Plasma generating apparatus used for fabrication of semiconductor device
TW303480B (en) * 1996-01-24 1997-04-21 Applied Materials Inc Magnetically confined plasma reactor for processing a semiconductor wafer
US6054013A (en) 1996-02-02 2000-04-25 Applied Materials, Inc. Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density
US5669975A (en) 1996-03-27 1997-09-23 Sony Corporation Plasma producing method and apparatus including an inductively-coupled plasma source
US6048435A (en) * 1996-07-03 2000-04-11 Tegal Corporation Plasma etch reactor and method for emerging films
US5824607A (en) * 1997-02-06 1998-10-20 Applied Materials, Inc. Plasma confinement for an inductively coupled plasma reactor
US6189484B1 (en) 1999-03-05 2001-02-20 Applied Materials Inc. Plasma reactor having a helicon wave high density plasma source
JP2001093699A (ja) * 1999-09-22 2001-04-06 Hitachi Kokusai Electric Inc プラズマ処理装置
US6341574B1 (en) 1999-11-15 2002-01-29 Lam Research Corporation Plasma processing systems

Also Published As

Publication number Publication date
WO2001037311A2 (en) 2001-05-25
AU3082201A (en) 2001-05-30
ATE420455T1 (de) 2009-01-15
KR100778258B1 (ko) 2007-11-22
EP1230667A2 (de) 2002-08-14
CN100437897C (zh) 2008-11-26
CN1423828A (zh) 2003-06-11
JP2003514386A (ja) 2003-04-15
JP5331283B2 (ja) 2013-10-30
US6322661B1 (en) 2001-11-27
CN1747133A (zh) 2006-03-15
TW530523B (en) 2003-05-01
CN1225005C (zh) 2005-10-26
KR20020053854A (ko) 2002-07-05
EP1230667B1 (de) 2009-01-07
WO2001037311A3 (en) 2001-10-11

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