DE60032660D1 - Verfahren zur Herstellung einer planaren Heterostruktur - Google Patents
Verfahren zur Herstellung einer planaren HeterostrukturInfo
- Publication number
- DE60032660D1 DE60032660D1 DE60032660T DE60032660T DE60032660D1 DE 60032660 D1 DE60032660 D1 DE 60032660D1 DE 60032660 T DE60032660 T DE 60032660T DE 60032660 T DE60032660 T DE 60032660T DE 60032660 D1 DE60032660 D1 DE 60032660D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- planar heterostructure
- heterostructure
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/1812—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table including only AIVBIV alloys, e.g. SiGe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/122—Single quantum well structures
- H01L29/125—Quantum wire structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
- H01L31/035254—Superlattices; Multiple quantum well structures including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table, e.g. Si-SiGe superlattices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/34—Materials of the light emitting region containing only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0207—Substrates having a special shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/021—Silicon based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
- H01S5/2234—Buried stripe structure with inner confining structure between the active layer and the lower electrode having a structured substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3223—IV compounds
- H01S5/3224—Si
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Element Separation (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9904052A FR2791810B1 (fr) | 1999-03-31 | 1999-03-31 | Procede de fabrication d'une heterostructure planaire |
FR9904052 | 1999-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60032660D1 true DE60032660D1 (de) | 2007-02-15 |
DE60032660T2 DE60032660T2 (de) | 2007-10-04 |
Family
ID=9543881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60032660T Expired - Lifetime DE60032660T2 (de) | 1999-03-31 | 2000-03-14 | Verfahren zur Herstellung einer planaren Heterostruktur |
Country Status (5)
Country | Link |
---|---|
US (1) | US6399502B1 (de) |
EP (2) | EP1772905A1 (de) |
JP (1) | JP5008786B2 (de) |
DE (1) | DE60032660T2 (de) |
FR (1) | FR2791810B1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6967140B2 (en) * | 2000-03-01 | 2005-11-22 | Intel Corporation | Quantum wire gate device and method of making same |
DE10152087A1 (de) * | 2001-10-23 | 2003-05-08 | Infineon Technologies Ag | Verfahren zur Erzeugung eines Substrats für die Herstellung einer Halbleiter-Struktur und Verfahren zur Herstellung einer Halbleiter-Struktur unter Verwendung eines solchen Substrats |
EP1363393A3 (de) * | 2002-05-15 | 2003-12-10 | Infineon Technologies AG | Mischerschaltung |
WO2004001811A2 (en) * | 2002-06-25 | 2003-12-31 | Massachusetts Institute Of Technology | A method for improving hole mobility enhancement in strained silicon p-type mosfet |
FR2853451B1 (fr) * | 2003-04-03 | 2005-08-05 | St Microelectronics Sa | Couches monocristallines heteroatomiques |
CN1795592A (zh) * | 2003-05-29 | 2006-06-28 | 应用材料股份有限公司 | 掺杂质基底的波导检测器 |
CN1856860A (zh) * | 2003-05-29 | 2006-11-01 | 应用材料股份有限公司 | 埋置式波导检测器 |
KR100531177B1 (ko) * | 2004-08-07 | 2005-11-29 | 재단법인서울대학교산학협력재단 | 격자 변형된 반도체 박막 형성 방법 |
FR2914489A1 (fr) * | 2007-04-02 | 2008-10-03 | St Microelectronics Crolles 2 | Procede de fabrication de composants electroniques |
FR2914783A1 (fr) | 2007-04-03 | 2008-10-10 | St Microelectronics Sa | Procede de fabrication d'un dispositif a gradient de concentration et dispositif correspondant. |
FR2942739B1 (fr) | 2009-03-03 | 2011-05-13 | Commissariat Energie Atomique | Procede de fabrication d'un moule pour la lithographie par nano-impression |
FR2942738B1 (fr) | 2009-03-03 | 2016-04-15 | Commissariat A L'energie Atomique | Procede de fabrication d'un moule pour la lithographie par nano-impression |
US8278741B2 (en) * | 2009-06-30 | 2012-10-02 | Intel Corporation | Sidewall photodetector |
US8227339B2 (en) | 2009-11-02 | 2012-07-24 | International Business Machines Corporation | Creation of vias and trenches with different depths |
US8580690B2 (en) | 2011-04-06 | 2013-11-12 | Nanya Technology Corp. | Process of planarizing a wafer with a large step height and/or surface area features |
US10204793B2 (en) * | 2016-05-17 | 2019-02-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical mechanical polishing slurry, method for chemical mechanical polishing and manufacturing method of semiconductor structure |
CN111029417A (zh) * | 2019-12-02 | 2020-04-17 | 上海集成电路研发中心有限公司 | 一种光电探测器及其制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5885584A (ja) * | 1981-11-16 | 1983-05-21 | Nec Corp | 半導体レ−ザ |
DE3570557D1 (en) * | 1984-11-27 | 1989-06-29 | American Telephone & Telegraph | Trench transistor |
JPH02264489A (ja) * | 1989-04-05 | 1990-10-29 | Mitsubishi Electric Corp | 埋込型半導体装置の製造方法 |
JPH081949B2 (ja) * | 1989-05-30 | 1996-01-10 | 三菱電機株式会社 | 赤外線撮像装置及びその製造方法 |
JPH04336465A (ja) * | 1991-05-14 | 1992-11-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2582519B2 (ja) * | 1992-07-13 | 1997-02-19 | インターナショナル・ビジネス・マシーンズ・コーポレイション | バイポーラ・トランジスタおよびその製造方法 |
US5275974A (en) * | 1992-07-30 | 1994-01-04 | Northern Telecom Limited | Method of forming electrodes for trench capacitors |
US5362669A (en) * | 1993-06-24 | 1994-11-08 | Northern Telecom Limited | Method of making integrated circuits |
US5541427A (en) * | 1993-12-03 | 1996-07-30 | International Business Machines Corporation | SRAM cell with capacitor |
JPH07249833A (ja) * | 1994-03-10 | 1995-09-26 | Daido Hoxan Inc | 発光素子 |
JPH08306906A (ja) * | 1995-03-09 | 1996-11-22 | Fujitsu Ltd | 量子半導体装置およびその製造方法 |
JP2000508474A (ja) * | 1996-04-10 | 2000-07-04 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | 改善された平坦化方法を伴う半導体トレンチアイソレーション |
US5906951A (en) * | 1997-04-30 | 1999-05-25 | International Business Machines Corporation | Strained Si/SiGe layers on insulator |
JPH10326906A (ja) * | 1997-05-26 | 1998-12-08 | Hamamatsu Photonics Kk | 光検出素子及び撮像素子 |
JPH1146014A (ja) * | 1997-07-25 | 1999-02-16 | Hitachi Ltd | 4族系半導体装置、半導体光装置、および半導体高発光部材 |
-
1999
- 1999-03-31 FR FR9904052A patent/FR2791810B1/fr not_active Expired - Fee Related
-
2000
- 2000-03-14 EP EP06026986A patent/EP1772905A1/de not_active Withdrawn
- 2000-03-14 DE DE60032660T patent/DE60032660T2/de not_active Expired - Lifetime
- 2000-03-14 EP EP00400703A patent/EP1041639B1/de not_active Expired - Lifetime
- 2000-03-29 JP JP2000091660A patent/JP5008786B2/ja not_active Expired - Fee Related
- 2000-03-31 US US09/540,188 patent/US6399502B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60032660T2 (de) | 2007-10-04 |
FR2791810B1 (fr) | 2001-06-22 |
FR2791810A1 (fr) | 2000-10-06 |
US6399502B1 (en) | 2002-06-04 |
JP2000315807A (ja) | 2000-11-14 |
JP5008786B2 (ja) | 2012-08-22 |
EP1041639B1 (de) | 2007-01-03 |
EP1772905A1 (de) | 2007-04-11 |
EP1041639A1 (de) | 2000-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: FAHRENHEIT THERMOSCOPE LLC, LAS VEGAS, NEV., US |
|
8364 | No opposition during term of opposition |