DE60022860D1 - Waferbearbeitungssystem - Google Patents

Waferbearbeitungssystem

Info

Publication number
DE60022860D1
DE60022860D1 DE60022860T DE60022860T DE60022860D1 DE 60022860 D1 DE60022860 D1 DE 60022860D1 DE 60022860 T DE60022860 T DE 60022860T DE 60022860 T DE60022860 T DE 60022860T DE 60022860 D1 DE60022860 D1 DE 60022860D1
Authority
DE
Germany
Prior art keywords
processing system
wafer processing
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60022860T
Other languages
English (en)
Other versions
DE60022860T2 (de
Inventor
Hiromitsu Kuribayashi
Sik Yoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WaferMasters Inc
Original Assignee
WaferMasters Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WaferMasters Inc filed Critical WaferMasters Inc
Application granted granted Critical
Publication of DE60022860D1 publication Critical patent/DE60022860D1/de
Publication of DE60022860T2 publication Critical patent/DE60022860T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60022860T 1999-11-30 2000-11-30 Waferbearbeitungssystem Expired - Fee Related DE60022860T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US451677 1999-11-30
US09/451,677 US6410455B1 (en) 1999-11-30 1999-11-30 Wafer processing system
PCT/US2000/032866 WO2001041197A1 (en) 1999-11-30 2000-11-30 Wafer processing system

Publications (2)

Publication Number Publication Date
DE60022860D1 true DE60022860D1 (de) 2005-11-03
DE60022860T2 DE60022860T2 (de) 2006-06-29

Family

ID=23793247

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60022860T Expired - Fee Related DE60022860T2 (de) 1999-11-30 2000-11-30 Waferbearbeitungssystem

Country Status (7)

Country Link
US (2) US6410455B1 (de)
EP (1) EP1145288B1 (de)
JP (1) JP2003515951A (de)
KR (1) KR100438502B1 (de)
DE (1) DE60022860T2 (de)
TW (2) TW529058B (de)
WO (1) WO2001041197A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6073366A (en) * 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US6410455B1 (en) * 1999-11-30 2002-06-25 Wafermasters, Inc. Wafer processing system
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
KR100960773B1 (ko) * 2000-09-15 2010-06-01 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 더블 이중 슬롯 로드록
US20020102859A1 (en) * 2001-01-31 2002-08-01 Yoo Woo Sik Method for ultra thin film formation
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
US7129694B2 (en) * 2002-05-23 2006-10-31 Applied Materials, Inc. Large substrate test system
US6869263B2 (en) * 2002-07-22 2005-03-22 Brooks Automation, Inc. Substrate loading and unloading station with buffer
US7677859B2 (en) * 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
CN101894779B (zh) * 2003-08-29 2013-05-01 交叉自动控制公司 用于半导体处理的方法和装置
US6897162B2 (en) * 2003-10-20 2005-05-24 Wafermasters, Inc. Integrated ashing and implant annealing method
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US20060021869A1 (en) * 2004-07-28 2006-02-02 Advantech Global, Ltd System for and method of ensuring accurate shadow mask-to-substrate registration in a deposition process
US20060182530A1 (en) * 2005-01-05 2006-08-17 Min-Hsu Wang Wafer loadlock chamber and wafer holder
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
KR100679269B1 (ko) * 2006-01-04 2007-02-06 삼성전자주식회사 멀티 챔버형 반도체 제조 장치
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
JP4975605B2 (ja) * 2007-12-26 2012-07-11 東京エレクトロン株式会社 処理システム、処理システムの制御方法およびソフトウェアのバージョンアップ方法
CN102714171A (zh) * 2010-01-22 2012-10-03 应用材料公司 具有基板冷却的传送机械手
ITBO20120686A1 (it) * 2012-12-19 2014-06-20 Marchesini Group Spa Sistema di carico e di alimentazione di articoli per una apparecchiatura di confezionamento operante in ambiente sterile
JP6397307B2 (ja) * 2014-10-29 2018-09-26 東京エレクトロン株式会社 凹部を充填する方法
JP6804398B2 (ja) * 2017-06-28 2020-12-23 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
KR101779322B1 (ko) 2017-08-01 2017-10-10 강성찬 동작패턴이 개선된 웨이퍼 세정장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4952299A (en) * 1988-10-31 1990-08-28 Eaton Corporation Wafer handling apparatus
US5254170A (en) 1989-08-07 1993-10-19 Asm Vt, Inc. Enhanced vertical thermal reactor system
JP3320539B2 (ja) * 1993-12-17 2002-09-03 東京エレクトロン株式会社 被処理体の搬入、搬出装置
JPH07321047A (ja) * 1994-05-23 1995-12-08 Tokyo Electron Ltd 真空処理装置
JPH0917705A (ja) * 1995-06-28 1997-01-17 Tokyo Electron Ltd 連続熱処理方法
JPH09104982A (ja) * 1995-08-05 1997-04-22 Kokusai Electric Co Ltd 基板処理装置
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US5820366A (en) 1996-07-10 1998-10-13 Eaton Corporation Dual vertical thermal processing furnace
JPH10139159A (ja) 1996-11-13 1998-05-26 Tokyo Electron Ltd カセットチャンバ及びカセット搬入搬出機構
US5944857A (en) * 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
JPH11176908A (ja) * 1997-12-15 1999-07-02 Tokyo Electron Ltd 容器の搬入出装置
JP3966594B2 (ja) * 1998-01-26 2007-08-29 東京エレクトロン株式会社 予備真空室およびそれを用いた真空処理装置
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP4302817B2 (ja) * 1999-05-13 2009-07-29 東京エレクトロン株式会社 真空処理システム
US6410455B1 (en) * 1999-11-30 2002-06-25 Wafermasters, Inc. Wafer processing system

Also Published As

Publication number Publication date
EP1145288A1 (de) 2001-10-17
US20020119634A1 (en) 2002-08-29
DE60022860T2 (de) 2006-06-29
TW507254B (en) 2002-10-21
EP1145288B1 (de) 2005-09-28
JP2003515951A (ja) 2003-05-07
US6410455B1 (en) 2002-06-25
TW529058B (en) 2003-04-21
US6602797B2 (en) 2003-08-05
KR20010110290A (ko) 2001-12-12
WO2001041197A1 (en) 2001-06-07
KR100438502B1 (ko) 2004-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee