DE60021476D1 - Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten - Google Patents

Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten

Info

Publication number
DE60021476D1
DE60021476D1 DE60021476T DE60021476T DE60021476D1 DE 60021476 D1 DE60021476 D1 DE 60021476D1 DE 60021476 T DE60021476 T DE 60021476T DE 60021476 T DE60021476 T DE 60021476T DE 60021476 D1 DE60021476 D1 DE 60021476D1
Authority
DE
Germany
Prior art keywords
coating composition
insulating layers
film production
film
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60021476T
Other languages
English (en)
Other versions
DE60021476T2 (de
Inventor
Michinori Nishikawa
Kinji Yamada
Mayumi Kakuta
Yasutake Inoue
Masahiko Ebisawa
Satoko Hakamatsuka
Kentarou Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSP Corp
Original Assignee
JSP Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15867499A external-priority patent/JP2000345041A/ja
Priority claimed from JP35286299A external-priority patent/JP2001164113A/ja
Application filed by JSP Corp filed Critical JSP Corp
Application granted granted Critical
Publication of DE60021476D1 publication Critical patent/DE60021476D1/de
Publication of DE60021476T2 publication Critical patent/DE60021476T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
DE60021476T 1999-06-04 2000-05-31 Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten Expired - Lifetime DE60021476T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP15867499A JP2000345041A (ja) 1999-06-04 1999-06-04 膜形成用組成物、膜形成用組成物の製造方法および絶縁膜形成用材料
JP15867499 1999-06-04
JP35286299A JP2001164113A (ja) 1999-12-13 1999-12-13 膜形成用組成物および絶縁膜形成用材料
JP35286299 1999-12-13

Publications (2)

Publication Number Publication Date
DE60021476D1 true DE60021476D1 (de) 2005-09-01
DE60021476T2 DE60021476T2 (de) 2006-05-24

Family

ID=26485713

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60021476T Expired - Lifetime DE60021476T2 (de) 1999-06-04 2000-05-31 Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten

Country Status (5)

Country Link
US (1) US6376634B1 (de)
EP (1) EP1058274B1 (de)
KR (1) KR100685333B1 (de)
DE (1) DE60021476T2 (de)
TW (1) TWI232468B (de)

Families Citing this family (29)

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US6300379B2 (en) * 1999-03-22 2001-10-09 S. C. Johnson & Son, Inc. Production of stable hydrolyzable organosilane solutions
KR100677782B1 (ko) 2000-01-17 2007-02-05 제이에스알 가부시끼가이샤 절연막 형성용 재료의 제조 방법
EP1148105B1 (de) * 2000-04-17 2006-10-04 JSR Corporation Beschichtungszusammensetzung für die Filmherstellung, Verfahren zur Filmherstellung und Silica-Filme
JP2002012638A (ja) * 2000-06-30 2002-01-15 Dow Corning Toray Silicone Co Ltd 高エネルギー線硬化性組成物および樹脂成形体
US6484299B1 (en) * 2000-07-07 2002-11-19 Micron Technology, Inc. Method and apparatus for PCB array with compensated signal propagation
KR100382702B1 (ko) * 2000-09-18 2003-05-09 주식회사 엘지화학 유기실리케이트 중합체의 제조방법
US6624092B2 (en) * 2001-06-28 2003-09-23 Macronix International Co., Ltd. Method for forming low dielectric constant insulating layer with foamed structure
US7122880B2 (en) * 2002-05-30 2006-10-17 Air Products And Chemicals, Inc. Compositions for preparing low dielectric materials
JP2004161877A (ja) * 2002-11-13 2004-06-10 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁膜及び半導体装置
JP2004161876A (ja) * 2002-11-13 2004-06-10 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁膜及び半導体装置
JP2004161875A (ja) * 2002-11-13 2004-06-10 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁間膜及び半導体装置
JP3884699B2 (ja) * 2002-11-13 2007-02-21 信越化学工業株式会社 多孔質膜形成用組成物、多孔質膜とその製造方法、層間絶縁膜及び半導体装置
JP4139710B2 (ja) * 2003-03-10 2008-08-27 信越化学工業株式会社 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2004269693A (ja) * 2003-03-10 2004-09-30 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物及びその製造方法、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2004292641A (ja) * 2003-03-27 2004-10-21 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
JP2004307692A (ja) * 2003-04-09 2004-11-04 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜及び半導体装置
JP2004307694A (ja) * 2003-04-09 2004-11-04 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜及び半導体装置。
JP2004307693A (ja) * 2003-04-09 2004-11-04 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、多孔質膜の製造方法、多孔質膜、層間絶縁膜、及び半導体装置
TWI287530B (en) * 2003-04-24 2007-10-01 Mitsui Chemicals Inc Coating solutions for forming porous silica
US20050196974A1 (en) * 2004-03-02 2005-09-08 Weigel Scott J. Compositions for preparing low dielectric materials containing solvents
US20050196535A1 (en) * 2004-03-02 2005-09-08 Weigel Scott J. Solvents and methods using same for removing silicon-containing residues from a substrate
US7629396B2 (en) * 2005-02-23 2009-12-08 E.I. Du Pont De Nemours And Company Silicon-containing polytrimethylene homo- for copolyether composition
US7446055B2 (en) * 2005-03-17 2008-11-04 Air Products And Chemicals, Inc. Aerosol misted deposition of low dielectric organosilicate films
EP1942150B1 (de) * 2005-10-28 2018-08-22 Toray Industries, Inc. Siloxanharzzusammensetzung und herstellungsverfahren dafür
KR101139052B1 (ko) * 2005-12-06 2012-04-30 삼성전자주식회사 불소를 포함하는 유기절연체 조성물 및 이를 이용한 유기박막 트랜지스터
US20080185041A1 (en) * 2007-02-02 2008-08-07 Guardian Industries Corp. Method of making a photovoltaic device with antireflective coating containing porous silica and resulting product
TWI452069B (zh) * 2007-11-06 2014-09-11 Braggone Oy 用於抗反射性塗層之碳矽烷聚合物組成物
JP5617476B2 (ja) 2010-09-22 2014-11-05 Jsr株式会社 シロキサンポリマー組成物、硬化膜及び硬化膜の形成方法
WO2020036074A1 (ja) * 2018-08-17 2020-02-20 信越化学工業株式会社 オルガノポリシロキサン化合物を含有する組成物、その製造方法、コーティング剤及び被覆物品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083074B2 (ja) * 1986-11-18 1996-01-17 東京応化工業株式会社 シリカ系被膜形成用塗布液
US5089303A (en) * 1989-04-24 1992-02-18 Akzo America Inc. Blend of solvent and photocurable arylsiloxane materials
JPH0320377A (ja) * 1989-06-16 1991-01-29 Hitachi Chem Co Ltd 酸化物被膜形成用塗布液および酸化物被膜の形成方法
EP0489470A1 (de) * 1990-12-03 1992-06-10 Akzo Nobel N.V. Hybridbinder mit niedrigem organischen Lösungsmittelgehalt, insbesondere für feurfeste Formen
JPH04320337A (ja) * 1991-04-19 1992-11-11 Fujitsu Ltd 絶縁膜形成用塗布液
JP3320440B2 (ja) * 1992-03-17 2002-09-03 触媒化成工業株式会社 被膜形成用塗布液およびその製造方法
US5520952A (en) * 1993-07-16 1996-05-28 Tokyo Ohka Kogyo Co., Ltd. Method for forming a protective coating film on electronic parts and devices
US5840821A (en) * 1994-03-11 1998-11-24 Kawasaki Steel Corporation Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution
US5426214A (en) * 1994-04-29 1995-06-20 Shiny Chemical Industrial Co., Ltd. Propylene glycol monomethyl ether butyrates and isomers, and the process for the preparation thereof
JPH08130247A (ja) * 1994-10-31 1996-05-21 Nippon Zeon Co Ltd シロキサン系ポリマー含有塗布液及びその製造方法
JP3824334B2 (ja) * 1995-08-07 2006-09-20 東京応化工業株式会社 シリカ系被膜形成用塗布液及び被膜形成方法
JPH1150007A (ja) * 1997-08-07 1999-02-23 Catalysts & Chem Ind Co Ltd 低誘電率シリカ系被膜形成用塗布液および被膜付基材
US6126733A (en) * 1997-10-31 2000-10-03 Alliedsignal Inc. Alcohol based precursors for producing nanoporous silica thin films

Also Published As

Publication number Publication date
DE60021476T2 (de) 2006-05-24
KR20010049482A (ko) 2001-06-15
EP1058274B1 (de) 2005-07-27
TWI232468B (en) 2005-05-11
US6376634B1 (en) 2002-04-23
KR100685333B1 (ko) 2007-02-23
EP1058274A1 (de) 2000-12-06

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