DE60003109T2 - Strahlmittel und Strahlverfahren - Google Patents
Strahlmittel und Strahlverfahren Download PDFInfo
- Publication number
- DE60003109T2 DE60003109T2 DE60003109T DE60003109T DE60003109T2 DE 60003109 T2 DE60003109 T2 DE 60003109T2 DE 60003109 T DE60003109 T DE 60003109T DE 60003109 T DE60003109 T DE 60003109T DE 60003109 T2 DE60003109 T2 DE 60003109T2
- Authority
- DE
- Germany
- Prior art keywords
- abrasives
- blasting processes
- blasting
- processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8634399 | 1999-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60003109D1 DE60003109D1 (de) | 2003-07-10 |
DE60003109T2 true DE60003109T2 (de) | 2004-01-29 |
Family
ID=13884226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60003109T Expired - Lifetime DE60003109T2 (de) | 1999-03-29 | 2000-03-28 | Strahlmittel und Strahlverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US6478878B1 (de) |
EP (1) | EP1040892B1 (de) |
JP (2) | JP2000343435A (de) |
DE (1) | DE60003109T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009017231A1 (de) * | 2009-04-09 | 2010-10-14 | Epcos Ag | Horde und Verfahren zum Sandstrahlen von elektrischen Bauelementen |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000343435A (ja) * | 1999-03-29 | 2000-12-12 | Asahi Glass Co Ltd | ブラストメディア及びブラスト方法 |
JP3840632B2 (ja) | 2000-05-08 | 2006-11-01 | 三井造船株式会社 | ナトリウム系脱塩剤および廃棄物処理装置 |
US6817927B2 (en) * | 2001-10-19 | 2004-11-16 | Eastman Kodak Company | Method of removing material from an external surface using core/shell particles |
JP3941573B2 (ja) * | 2002-04-24 | 2007-07-04 | 宇部興産株式会社 | フレキシブル両面基板の製造方法 |
JP2004148414A (ja) * | 2002-10-28 | 2004-05-27 | Seiko Epson Corp | 研削材及び研削材の製造方法並びに製造装置 |
JP4367623B2 (ja) * | 2004-01-14 | 2009-11-18 | 住友電気工業株式会社 | 多孔質延伸ポリテトラフルオロエチレンシート製または多孔質延伸ポリテトラフルオロエチレンフィルム製の電気回路部品の製造方法、及び電気回路部品 |
DE102004003420B4 (de) * | 2004-01-23 | 2006-10-26 | Dr.Ing.H.C. F. Porsche Ag | Verfahren zur Behandlung von Aluminiumgussteilen |
JP4947510B2 (ja) * | 2004-12-24 | 2012-06-06 | Nltテクノロジー株式会社 | アクティブマトリクス型表示装置及びその製造方法 |
US20070111642A1 (en) * | 2005-11-14 | 2007-05-17 | Davis Ian M | Apparatus and methods for slurry cleaning of etch chambers |
US20080017734A1 (en) * | 2006-07-10 | 2008-01-24 | Micheli Paul R | System and method of uniform spray coating |
DE102006035260A1 (de) * | 2006-07-26 | 2008-01-31 | Martin GmbH für Umwelt- und Energietechnik | Verfahren und Vorrichtung zum Trennen von Reststoffen |
WO2010038532A1 (ja) | 2008-09-30 | 2010-04-08 | イビデン株式会社 | 多層プリント配線板、及び、多層プリント配線板の製造方法 |
JP2012069854A (ja) * | 2010-09-27 | 2012-04-05 | Cmk Corp | 多層プリント配線板とその製造方法 |
US10294019B2 (en) * | 2016-08-17 | 2019-05-21 | Raritan Pharmaceuticals Inc. | System for preparing medicinal beverages using cartridge-type beverage brewers |
CN111050478B (zh) * | 2019-12-25 | 2021-03-02 | 浙江振有电子股份有限公司 | 一种环氧基板微米级细孔去渣方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL93572A (en) | 1989-03-14 | 1993-06-10 | Church & Dwight Co Inc | Process for removing coatings from sensitive substrates and blasting media useful therein |
WO1993018863A1 (en) | 1992-03-20 | 1993-09-30 | Church & Dwight Company, Inc. | Abrasive coating remover and process for using same |
US5308404A (en) * | 1993-01-21 | 1994-05-03 | Church & Dwight Co., Inc. | Less aggressive blast media formed from compacted particles |
US6010546A (en) | 1997-07-24 | 2000-01-04 | Asahi Glass Company, Ltd. | Blasting medium and blasting method employing such medium |
US5827114A (en) * | 1996-09-25 | 1998-10-27 | Church & Dwight Co., Inc. | Slurry blasting process |
JPH11246217A (ja) * | 1998-03-04 | 1999-09-14 | Asahi Glass Co Ltd | ナトリウム塩の製造方法 |
JP2000343435A (ja) * | 1999-03-29 | 2000-12-12 | Asahi Glass Co Ltd | ブラストメディア及びブラスト方法 |
-
2000
- 2000-03-09 JP JP2000064754A patent/JP2000343435A/ja active Pending
- 2000-03-28 US US09/536,682 patent/US6478878B1/en not_active Expired - Fee Related
- 2000-03-28 EP EP00106027A patent/EP1040892B1/de not_active Expired - Lifetime
- 2000-03-28 DE DE60003109T patent/DE60003109T2/de not_active Expired - Lifetime
-
2010
- 2010-03-15 JP JP2010058094A patent/JP2010158770A/ja not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009017231A1 (de) * | 2009-04-09 | 2010-10-14 | Epcos Ag | Horde und Verfahren zum Sandstrahlen von elektrischen Bauelementen |
Also Published As
Publication number | Publication date |
---|---|
US6478878B1 (en) | 2002-11-12 |
DE60003109D1 (de) | 2003-07-10 |
EP1040892B1 (de) | 2003-06-04 |
JP2010158770A (ja) | 2010-07-22 |
EP1040892A1 (de) | 2000-10-04 |
JP2000343435A (ja) | 2000-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |