DE59712974D1 - Verfahren zur Herstellung von Bonddrahtverbindungen - Google Patents

Verfahren zur Herstellung von Bonddrahtverbindungen

Info

Publication number
DE59712974D1
DE59712974D1 DE59712974T DE59712974T DE59712974D1 DE 59712974 D1 DE59712974 D1 DE 59712974D1 DE 59712974 T DE59712974 T DE 59712974T DE 59712974 T DE59712974 T DE 59712974T DE 59712974 D1 DE59712974 D1 DE 59712974D1
Authority
DE
Germany
Prior art keywords
bonding wire
wire connections
producing bonding
producing
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59712974T
Other languages
English (en)
Inventor
Jens Dr Sabotke
Joachim Dr Schmidt
Frank-Dieter Hauschild
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of DE59712974D1 publication Critical patent/DE59712974D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DE59712974T 1997-01-31 1997-11-14 Verfahren zur Herstellung von Bonddrahtverbindungen Expired - Lifetime DE59712974D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997103639 DE19703639A1 (de) 1997-01-31 1997-01-31 Verfahren zur Herstellung von Bonddrahtverbindungen

Publications (1)

Publication Number Publication Date
DE59712974D1 true DE59712974D1 (de) 2008-11-27

Family

ID=7818941

Family Applications (2)

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DE1997103639 Withdrawn DE19703639A1 (de) 1997-01-31 1997-01-31 Verfahren zur Herstellung von Bonddrahtverbindungen
DE59712974T Expired - Lifetime DE59712974D1 (de) 1997-01-31 1997-11-14 Verfahren zur Herstellung von Bonddrahtverbindungen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1997103639 Withdrawn DE19703639A1 (de) 1997-01-31 1997-01-31 Verfahren zur Herstellung von Bonddrahtverbindungen

Country Status (4)

Country Link
US (1) US6232561B1 (de)
EP (1) EP0867932B1 (de)
JP (1) JPH10223673A (de)
DE (2) DE19703639A1 (de)

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US6657225B1 (en) * 1998-03-25 2003-12-02 Seiko Epson Corporation Semiconductor component, active matrix substrate for a liquid crystal display, and methods of manufacturing such component and substrate
JP2001015541A (ja) * 1999-06-28 2001-01-19 Sumitomo Electric Ind Ltd 半導体装置および半導体装置の製造方法
WO2001020669A2 (en) * 1999-09-16 2001-03-22 Koninklijke Philips Electronics N.V. Use of additional bonding finger rows to improve wire bond density
KR20010064907A (ko) * 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
US6429515B1 (en) * 2000-05-05 2002-08-06 Amkor Technology, Inc. Long wire IC package
KR100400032B1 (ko) * 2001-02-07 2003-09-29 삼성전자주식회사 와이어 본딩을 통해 기판 디자인을 변경하는 반도체 패키지
CN100401488C (zh) * 2001-03-23 2008-07-09 Nxp股份有限公司 具有小回路高度的接线连接的片状模块
US6908843B2 (en) * 2001-12-28 2005-06-21 Texas Instruments Incorporated Method and system of wire bonding using interposer pads
DE102009029040A1 (de) 2009-08-31 2011-03-03 Robert Bosch Gmbh Vorrichtung und Verfahren zur Herstellung einer Vorrichtung
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EP0867932B1 (de) 2008-10-15
EP0867932A3 (de) 2000-05-17
US6232561B1 (en) 2001-05-15
DE19703639A1 (de) 1998-08-06
EP0867932A2 (de) 1998-09-30
JPH10223673A (ja) 1998-08-21

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