DE4293174T1 - Laserstrahlbearbeitungsanlage und -Verfahren - Google Patents

Laserstrahlbearbeitungsanlage und -Verfahren

Info

Publication number
DE4293174T1
DE4293174T1 DE4293174T DE4293174T DE4293174T1 DE 4293174 T1 DE4293174 T1 DE 4293174T1 DE 4293174 T DE4293174 T DE 4293174T DE 4293174 T DE4293174 T DE 4293174T DE 4293174 T1 DE4293174 T1 DE 4293174T1
Authority
DE
Germany
Prior art keywords
laser beam
processing plant
beam processing
plant
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE4293174T
Other languages
English (en)
Other versions
DE4293174C2 (de
Inventor
Yoshiaki Banzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippei Toyama Corp
Original Assignee
Nippei Toyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3252529A external-priority patent/JP2846160B2/ja
Priority claimed from JP4173289A external-priority patent/JP2823745B2/ja
Application filed by Nippei Toyama Corp filed Critical Nippei Toyama Corp
Publication of DE4293174T1 publication Critical patent/DE4293174T1/de
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
DE4293174T 1991-09-30 1992-09-30 Laserstrahlbearbeitungsanlage und -Verfahren Pending DE4293174T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3252529A JP2846160B2 (ja) 1991-09-30 1991-09-30 レーザ加工装置及びレーザ加工方法
JP4173289A JP2823745B2 (ja) 1992-06-30 1992-06-30 レーザ加工システムにおけるワークの処理方法及びその装置

Publications (1)

Publication Number Publication Date
DE4293174T1 true DE4293174T1 (de) 1994-01-13

Family

ID=26495330

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4293174T Pending DE4293174T1 (de) 1991-09-30 1992-09-30 Laserstrahlbearbeitungsanlage und -Verfahren
DE4293174A Expired - Fee Related DE4293174C2 (de) 1991-09-30 1992-09-30 Laserstrahlbearbeitungsanlage mit einem Palettenspeicher

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE4293174A Expired - Fee Related DE4293174C2 (de) 1991-09-30 1992-09-30 Laserstrahlbearbeitungsanlage mit einem Palettenspeicher

Country Status (3)

Country Link
US (1) US5500507A (de)
DE (2) DE4293174T1 (de)
WO (1) WO1993006963A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003787A1 (de) * 1995-07-20 1997-02-06 Thyssen Industrie Ag Verfahren zum schneiden und/oder verschweissen von blechen und bearbeitungsanlage zur durchführung des verfahrens

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748691A (en) * 1996-03-11 1998-05-05 General Electric Company Apparatus and methods for sealing end plugs for nuclear fuel rods
JP3832682B2 (ja) * 1997-03-12 2006-10-11 ヤマザキマザック株式会社 レーザ加工設備
DE19853366B4 (de) * 1998-11-19 2007-07-19 Schuler Pressen Gmbh & Co. Kg Vorrichtung und Verfahren zum Umformen
DE19950079B4 (de) * 1999-10-18 2004-08-19 Thyssenkrupp Technologies Ag Verfahren und Vorrichtung zum Bearbeiten von Bauteilen
US6531675B2 (en) * 2001-01-31 2003-03-11 Unova Ip Corp. Laser welding method and apparatus
DE10119229B4 (de) * 2001-04-19 2004-04-15 Rohwedder Microtech Gmbh & Co. Kg Werkstückträger-Wechseleinrichtung und Wechselverfahren für Werkstückträger
JP4215677B2 (ja) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 レーザ加工機及びレーザ加工方法
ITTO20050016A1 (it) * 2005-01-13 2006-07-14 Prima Ind Spa Macchina operatrice laser
WO2008081239A2 (en) 2007-01-02 2008-07-10 Fameccanica.Data, S.P.A. Improvements in devices for treating film material, for instance for manufacturing sanitary products
US20100126320A1 (en) * 2008-11-21 2010-05-27 Trumpf, Inc. Vacuum based part separation
JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
JP6104661B2 (ja) * 2012-04-03 2017-03-29 日本車輌製造株式会社 ワーク固定治具
CN102723302B (zh) * 2012-04-23 2014-08-20 吴周令 激光加工半导体晶片用全自动上下料装置及其使用方法
DE102012009061A1 (de) * 2012-05-09 2013-11-14 Thyssenkrupp System Engineering Gmbh Bearbeitungsanlage für Baueinheiten
CN102820248B (zh) * 2012-08-15 2014-10-01 先进光电器材(深圳)有限公司 固晶机进料***
JP5829777B1 (ja) * 2014-09-03 2015-12-09 三菱電機株式会社 レーザ加工装置
DE102020103183A1 (de) * 2020-02-07 2021-08-12 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Maschinelle Anordnung und maschinelles Verfahren für die Blechfertigung
CN114643597A (zh) * 2020-12-17 2022-06-21 极光飞行科学公司 用于加工工件的制造***和方法
CN113247601A (zh) * 2021-04-25 2021-08-13 惠州市诚业家具有限公司 一种支架杆输送装置及其输送方法
CN113369208B (zh) * 2021-05-12 2023-01-03 兰州兰石集团有限公司 一种稀土金属检测用自动检测线及检测方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102282U (ja) * 1982-12-27 1984-07-10 進和貿易株式会社 被加工物搬入出装置
JPS6030596A (ja) * 1983-07-28 1985-02-16 Shibuya Kogyo Co Ltd レ−ザ加工装置
JPS60247422A (ja) * 1984-04-18 1985-12-07 Murata Mach Ltd 板金の加工ラインシステム
JPS628957A (ja) * 1985-07-05 1987-01-16 Minolta Camera Co Ltd 複写機
JPS6221434A (ja) * 1985-07-19 1987-01-29 Toyota Motor Corp プレス機へのワ−ク搬出入装置
JPH0653333B2 (ja) * 1985-07-19 1994-07-20 キヤノン株式会社 物品等の自動供給装置
EP0438615A1 (de) * 1990-01-23 1991-07-31 Thyssen Industrie Ag Maschinenbau Einrichtung zum Verbinden von mindestens zwei Blechen durch wenigstens eine durch eine Laserstrahlschweissvorrichtung hergestellte Schweissnaht
ATE111793T1 (de) * 1990-07-04 1994-10-15 Bystronic Laser Ag Anlage zum schneiden eines werkstücks und verfahren zur steuerung derselben.
EP0483652A1 (de) * 1990-10-31 1992-05-06 Yamazaki Mazak Kabushiki Kaisha Laserbearbeitungsstation
US5229571A (en) * 1991-07-08 1993-07-20 Armco Steel Co., L.P. High production laser welding assembly and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003787A1 (de) * 1995-07-20 1997-02-06 Thyssen Industrie Ag Verfahren zum schneiden und/oder verschweissen von blechen und bearbeitungsanlage zur durchführung des verfahrens
DE19526466C2 (de) * 1995-07-20 2002-04-04 Thyssenkrupp Ind Ag Verfahren zum Schneiden und/oder Verschweißen von Blechen und Bearbeitungsanlage zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
WO1993006963A1 (en) 1993-04-15
US5500507A (en) 1996-03-19
DE4293174C2 (de) 1998-07-02

Similar Documents

Publication Publication Date Title
DE4293174T1 (de) Laserstrahlbearbeitungsanlage und -Verfahren
DE69115464D1 (de) Laserstrahlbearbeitungsverfahren
DE4192063T1 (de) Laserbearbeitungsverfahren- und Ausrüstung-Zusammenfassung
DE69301759D1 (de) Laserstrahltaster
EP0458199A3 (en) Laser processing device and laser processing method
DE69230450D1 (de) Programmverarbeitungssystem und -verfahren
DE69310681D1 (de) Laserstrahlschneidverfahren
DE69220253D1 (de) Laserstrahlabtaster
DE69323356D1 (de) Bearbeitungsexcimerlaserverfahren und -vorrichtung
DE59407111D1 (de) Laserverstärkersystem
DE69124232D1 (de) Laser und laserschweissenverfahren
EP0502670A3 (en) Laser diode array and method of fabrication thereof
DE3750013D1 (de) Laserstrahlabtastverfahren und -vorrichtung.
DE59410441D1 (de) Laserverstärkersystem
DE69122674D1 (de) Laserstrahlbearbeitungssystem und Laserstrahlmaschinendecke
KR880701612A (ko) 레이저 가공방법
KR920700095A (ko) 레이저 로봇에 있어서의 레이저광 오조사 방지 방법
EP0491192A3 (en) Laser processing apparatus and laser processing method
DE69115353D1 (de) Laserbearbeitungsgerät und dessen Verfahren
DE69213281D1 (de) Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung
EP0411635A3 (en) Method of stabilizing the laser beam and apparatus utilizing the same
DE68924460D1 (de) Laserabtastmikroskop und Anwendungsverfahren.
DE69402315D1 (de) Laserstrahlschneidverfahren
NO932829L (no) Selvinnrettende intrakavitet-raman-laser
DK0626106T3 (da) Laserkontrolfremgangsmåde og -apparatur