DE4293174T1 - Laserstrahlbearbeitungsanlage und -Verfahren - Google Patents
Laserstrahlbearbeitungsanlage und -VerfahrenInfo
- Publication number
- DE4293174T1 DE4293174T1 DE4293174T DE4293174T DE4293174T1 DE 4293174 T1 DE4293174 T1 DE 4293174T1 DE 4293174 T DE4293174 T DE 4293174T DE 4293174 T DE4293174 T DE 4293174T DE 4293174 T1 DE4293174 T1 DE 4293174T1
- Authority
- DE
- Germany
- Prior art keywords
- laser beam
- processing plant
- beam processing
- plant
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3252529A JP2846160B2 (ja) | 1991-09-30 | 1991-09-30 | レーザ加工装置及びレーザ加工方法 |
JP4173289A JP2823745B2 (ja) | 1992-06-30 | 1992-06-30 | レーザ加工システムにおけるワークの処理方法及びその装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4293174T1 true DE4293174T1 (de) | 1994-01-13 |
Family
ID=26495330
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4293174T Pending DE4293174T1 (de) | 1991-09-30 | 1992-09-30 | Laserstrahlbearbeitungsanlage und -Verfahren |
DE4293174A Expired - Fee Related DE4293174C2 (de) | 1991-09-30 | 1992-09-30 | Laserstrahlbearbeitungsanlage mit einem Palettenspeicher |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4293174A Expired - Fee Related DE4293174C2 (de) | 1991-09-30 | 1992-09-30 | Laserstrahlbearbeitungsanlage mit einem Palettenspeicher |
Country Status (3)
Country | Link |
---|---|
US (1) | US5500507A (de) |
DE (2) | DE4293174T1 (de) |
WO (1) | WO1993006963A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997003787A1 (de) * | 1995-07-20 | 1997-02-06 | Thyssen Industrie Ag | Verfahren zum schneiden und/oder verschweissen von blechen und bearbeitungsanlage zur durchführung des verfahrens |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5748691A (en) * | 1996-03-11 | 1998-05-05 | General Electric Company | Apparatus and methods for sealing end plugs for nuclear fuel rods |
JP3832682B2 (ja) * | 1997-03-12 | 2006-10-11 | ヤマザキマザック株式会社 | レーザ加工設備 |
DE19853366B4 (de) * | 1998-11-19 | 2007-07-19 | Schuler Pressen Gmbh & Co. Kg | Vorrichtung und Verfahren zum Umformen |
DE19950079B4 (de) * | 1999-10-18 | 2004-08-19 | Thyssenkrupp Technologies Ag | Verfahren und Vorrichtung zum Bearbeiten von Bauteilen |
US6531675B2 (en) * | 2001-01-31 | 2003-03-11 | Unova Ip Corp. | Laser welding method and apparatus |
DE10119229B4 (de) * | 2001-04-19 | 2004-04-15 | Rohwedder Microtech Gmbh & Co. Kg | Werkstückträger-Wechseleinrichtung und Wechselverfahren für Werkstückträger |
JP4215677B2 (ja) * | 2003-08-25 | 2009-01-28 | 日立ビアメカニクス株式会社 | レーザ加工機及びレーザ加工方法 |
ITTO20050016A1 (it) * | 2005-01-13 | 2006-07-14 | Prima Ind Spa | Macchina operatrice laser |
WO2008081239A2 (en) | 2007-01-02 | 2008-07-10 | Fameccanica.Data, S.P.A. | Improvements in devices for treating film material, for instance for manufacturing sanitary products |
US20100126320A1 (en) * | 2008-11-21 | 2010-05-27 | Trumpf, Inc. | Vacuum based part separation |
JP5377086B2 (ja) * | 2009-06-04 | 2013-12-25 | 株式会社日立ハイテクノロジーズ | レーザ加工方法、レーザ加工装置及びソーラパネル製造方法 |
JP6104661B2 (ja) * | 2012-04-03 | 2017-03-29 | 日本車輌製造株式会社 | ワーク固定治具 |
CN102723302B (zh) * | 2012-04-23 | 2014-08-20 | 吴周令 | 激光加工半导体晶片用全自动上下料装置及其使用方法 |
DE102012009061A1 (de) * | 2012-05-09 | 2013-11-14 | Thyssenkrupp System Engineering Gmbh | Bearbeitungsanlage für Baueinheiten |
CN102820248B (zh) * | 2012-08-15 | 2014-10-01 | 先进光电器材(深圳)有限公司 | 固晶机进料*** |
JP5829777B1 (ja) * | 2014-09-03 | 2015-12-09 | 三菱電機株式会社 | レーザ加工装置 |
DE102020103183A1 (de) * | 2020-02-07 | 2021-08-12 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Maschinelle Anordnung und maschinelles Verfahren für die Blechfertigung |
CN114643597A (zh) * | 2020-12-17 | 2022-06-21 | 极光飞行科学公司 | 用于加工工件的制造***和方法 |
CN113247601A (zh) * | 2021-04-25 | 2021-08-13 | 惠州市诚业家具有限公司 | 一种支架杆输送装置及其输送方法 |
CN113369208B (zh) * | 2021-05-12 | 2023-01-03 | 兰州兰石集团有限公司 | 一种稀土金属检测用自动检测线及检测方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59102282U (ja) * | 1982-12-27 | 1984-07-10 | 進和貿易株式会社 | 被加工物搬入出装置 |
JPS6030596A (ja) * | 1983-07-28 | 1985-02-16 | Shibuya Kogyo Co Ltd | レ−ザ加工装置 |
JPS60247422A (ja) * | 1984-04-18 | 1985-12-07 | Murata Mach Ltd | 板金の加工ラインシステム |
JPS628957A (ja) * | 1985-07-05 | 1987-01-16 | Minolta Camera Co Ltd | 複写機 |
JPS6221434A (ja) * | 1985-07-19 | 1987-01-29 | Toyota Motor Corp | プレス機へのワ−ク搬出入装置 |
JPH0653333B2 (ja) * | 1985-07-19 | 1994-07-20 | キヤノン株式会社 | 物品等の自動供給装置 |
EP0438615A1 (de) * | 1990-01-23 | 1991-07-31 | Thyssen Industrie Ag Maschinenbau | Einrichtung zum Verbinden von mindestens zwei Blechen durch wenigstens eine durch eine Laserstrahlschweissvorrichtung hergestellte Schweissnaht |
ATE111793T1 (de) * | 1990-07-04 | 1994-10-15 | Bystronic Laser Ag | Anlage zum schneiden eines werkstücks und verfahren zur steuerung derselben. |
EP0483652A1 (de) * | 1990-10-31 | 1992-05-06 | Yamazaki Mazak Kabushiki Kaisha | Laserbearbeitungsstation |
US5229571A (en) * | 1991-07-08 | 1993-07-20 | Armco Steel Co., L.P. | High production laser welding assembly and method |
-
1992
- 1992-09-30 WO PCT/JP1992/001256 patent/WO1993006963A1/ja active Application Filing
- 1992-09-30 US US08/066,154 patent/US5500507A/en not_active Expired - Lifetime
- 1992-09-30 DE DE4293174T patent/DE4293174T1/de active Pending
- 1992-09-30 DE DE4293174A patent/DE4293174C2/de not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997003787A1 (de) * | 1995-07-20 | 1997-02-06 | Thyssen Industrie Ag | Verfahren zum schneiden und/oder verschweissen von blechen und bearbeitungsanlage zur durchführung des verfahrens |
DE19526466C2 (de) * | 1995-07-20 | 2002-04-04 | Thyssenkrupp Ind Ag | Verfahren zum Schneiden und/oder Verschweißen von Blechen und Bearbeitungsanlage zur Durchführung des Verfahrens |
Also Published As
Publication number | Publication date |
---|---|
WO1993006963A1 (en) | 1993-04-15 |
US5500507A (en) | 1996-03-19 |
DE4293174C2 (de) | 1998-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE4293174T1 (de) | Laserstrahlbearbeitungsanlage und -Verfahren | |
DE69115464D1 (de) | Laserstrahlbearbeitungsverfahren | |
DE4192063T1 (de) | Laserbearbeitungsverfahren- und Ausrüstung-Zusammenfassung | |
DE69301759D1 (de) | Laserstrahltaster | |
EP0458199A3 (en) | Laser processing device and laser processing method | |
DE69230450D1 (de) | Programmverarbeitungssystem und -verfahren | |
DE69310681D1 (de) | Laserstrahlschneidverfahren | |
DE69220253D1 (de) | Laserstrahlabtaster | |
DE69323356D1 (de) | Bearbeitungsexcimerlaserverfahren und -vorrichtung | |
DE59407111D1 (de) | Laserverstärkersystem | |
DE69124232D1 (de) | Laser und laserschweissenverfahren | |
EP0502670A3 (en) | Laser diode array and method of fabrication thereof | |
DE3750013D1 (de) | Laserstrahlabtastverfahren und -vorrichtung. | |
DE59410441D1 (de) | Laserverstärkersystem | |
DE69122674D1 (de) | Laserstrahlbearbeitungssystem und Laserstrahlmaschinendecke | |
KR880701612A (ko) | 레이저 가공방법 | |
KR920700095A (ko) | 레이저 로봇에 있어서의 레이저광 오조사 방지 방법 | |
EP0491192A3 (en) | Laser processing apparatus and laser processing method | |
DE69115353D1 (de) | Laserbearbeitungsgerät und dessen Verfahren | |
DE69213281D1 (de) | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung | |
EP0411635A3 (en) | Method of stabilizing the laser beam and apparatus utilizing the same | |
DE68924460D1 (de) | Laserabtastmikroskop und Anwendungsverfahren. | |
DE69402315D1 (de) | Laserstrahlschneidverfahren | |
NO932829L (no) | Selvinnrettende intrakavitet-raman-laser | |
DK0626106T3 (da) | Laserkontrolfremgangsmåde og -apparatur |