DE3882393D1 - Laser-markierungs-vorrichtung und verfahren. - Google Patents

Laser-markierungs-vorrichtung und verfahren.

Info

Publication number
DE3882393D1
DE3882393D1 DE8888103066T DE3882393T DE3882393D1 DE 3882393 D1 DE3882393 D1 DE 3882393D1 DE 8888103066 T DE8888103066 T DE 8888103066T DE 3882393 T DE3882393 T DE 3882393T DE 3882393 D1 DE3882393 D1 DE 3882393D1
Authority
DE
Germany
Prior art keywords
marking device
laser marking
laser
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888103066T
Other languages
English (en)
Other versions
DE3882393T2 (de
Inventor
Kouji Kuwabara
Makoto Yano
Takao Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3882393D1 publication Critical patent/DE3882393D1/de
Publication of DE3882393T2 publication Critical patent/DE3882393T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67282Marking devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B7/00Machines, apparatus or hand tools for branding, e.g. using radiant energy such as laser beams
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/1065Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using liquid crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/007Marks, e.g. trade marks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
  • Laser Beam Printer (AREA)
DE88103066T 1987-03-02 1988-03-01 Laser-Markierungs-Vorrichtung und Verfahren. Expired - Fee Related DE3882393T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4525187 1987-03-02

Publications (2)

Publication Number Publication Date
DE3882393D1 true DE3882393D1 (de) 1993-08-26
DE3882393T2 DE3882393T2 (de) 1994-02-03

Family

ID=12714052

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88103066T Expired - Fee Related DE3882393T2 (de) 1987-03-02 1988-03-01 Laser-Markierungs-Vorrichtung und Verfahren.

Country Status (3)

Country Link
US (1) US4818835A (de)
EP (1) EP0281068B1 (de)
DE (1) DE3882393T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2652480B1 (fr) * 1989-09-22 1994-05-06 Merlin Gerin Procede et dispositif de marquage laser de boitiers moules d'appareillages electriques.
JPH03248784A (ja) * 1990-02-28 1991-11-06 Hitachi Ltd レーザマーキングシステム
US5231263A (en) * 1990-03-09 1993-07-27 Hitachi, Ltd. Liquid crystal mask type laser marking system
JP3150322B2 (ja) * 1990-05-18 2001-03-26 株式会社日立製作所 レーザによる配線切断加工方法及びレーザ加工装置
JP2526717B2 (ja) * 1990-06-21 1996-08-21 日本電気株式会社 レ―ザ加工装置
JP3126368B2 (ja) * 1990-06-22 2001-01-22 株式会社日立製作所 画像縮小拡大投影装置
JPH0484686A (ja) * 1990-07-27 1992-03-17 Advantest Corp レーザ加工装置
TW225050B (de) * 1990-11-30 1994-06-11 Hitachi Ltd
WO1992021050A1 (en) * 1991-05-21 1992-11-26 Seiko Epson Corporation Optical device and optical machining system using the optical device
TW245844B (de) * 1993-01-29 1995-04-21 Komatsu Mfg Co Ltd
US5463200A (en) * 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US5896163A (en) * 1993-05-07 1999-04-20 Kabushiki Kaisha Komatsu Seisakusho Laser liquid crystal marker and method for judging deterioration of liquid crystal
KR960704672A (ko) * 1993-09-30 1996-10-09 안자키 사토루 투과형 액정마스크마커(transmission type liqutd crystal mask marker)
JP3263516B2 (ja) * 1994-02-08 2002-03-04 株式会社小松製作所 液晶マスクマーカの画像表示方法
JP3263517B2 (ja) * 1994-02-08 2002-03-04 株式会社小松製作所 液晶マスクマーカの駆動方法
US5937270A (en) * 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
JPH09277069A (ja) * 1996-04-12 1997-10-28 Komatsu Ltd 液晶マスク、液晶式レーザマーカ及びそれを用いた刻印方法
US5986805A (en) * 1998-02-12 1999-11-16 Trw Inc. Polarizer/modulator assembly for lasers
NL1009359C2 (nl) * 1998-06-10 1999-12-13 Rudolf Jacobus Antonius Marie Werkwijze en inrichting voor het aanbrengen van een patroon van informatie-kenmerken in een materiaaloppervlak met behulp van een laserbundel.
US6417484B1 (en) 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
US6262388B1 (en) 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
JP3429463B2 (ja) * 1999-10-22 2003-07-22 サンクス株式会社 レーザマーカ
JP2001212797A (ja) * 2000-02-03 2001-08-07 Canon Inc 露光装置およびレーザ加工方法
US6528760B1 (en) 2000-07-14 2003-03-04 Micron Technology, Inc. Apparatus and method using rotational indexing for laser marking IC packages carried in trays
US6524881B1 (en) * 2000-08-25 2003-02-25 Micron Technology, Inc. Method and apparatus for marking a bare semiconductor die
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
JP6720156B2 (ja) * 2014-07-01 2020-07-08 キオヴァ 材料をパターニングするためのマイクロマシニング方法及びシステム、並びに1つのこのようなマイクロマシニングシステムを使用する方法。

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
US4614954A (en) * 1984-01-23 1986-09-30 Casio Computer Co., Ltd. Recording apparatus
US4559546A (en) * 1984-09-04 1985-12-17 Xerox Corporation Intensity control for the imaging beam of a raster scanner

Also Published As

Publication number Publication date
DE3882393T2 (de) 1994-02-03
EP0281068A3 (en) 1989-12-13
US4818835A (en) 1989-04-04
EP0281068B1 (de) 1993-07-21
EP0281068A2 (de) 1988-09-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee