DE3871357D1 - METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYMID SURFACES. - Google Patents
METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYMID SURFACES.Info
- Publication number
- DE3871357D1 DE3871357D1 DE8888120876T DE3871357T DE3871357D1 DE 3871357 D1 DE3871357 D1 DE 3871357D1 DE 8888120876 T DE8888120876 T DE 8888120876T DE 3871357 T DE3871357 T DE 3871357T DE 3871357 D1 DE3871357 D1 DE 3871357D1
- Authority
- DE
- Germany
- Prior art keywords
- polymid
- adhesivity
- improving
- metal layers
- deposited metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Activation of polyimide surfaces, to improve the adhesion of electroless metal plating, is carried out with an activator formulation contg. binder, without etching. The formulation contains 0.03-4.00 (wt.)% organo-metallic noble metal cpd. (I) as activator, 3-40% polyimide (II), 1-30% filler and 45-90% solvent. Pref (I) is a sub-gp. I or VIII metal. (II) is obtd. by condensing cyclic polycarboxylic anhydrides, polycarboxylic acid anhydrides, polycarboxylic acids or polycarboxylate esters with polyamines, polyamides, polyisocyanates or polycarbomate esters; or is an aliphatic-aromatic polyamide-imide obtd. by condensing trimellitic anhydride with polyisocyanates and lactams or polyamides.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8888120876T DE3871357D1 (en) | 1987-12-23 | 1988-12-14 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYMID SURFACES. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873743780 DE3743780A1 (en) | 1987-12-23 | 1987-12-23 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
DE8888120876T DE3871357D1 (en) | 1987-12-23 | 1988-12-14 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYMID SURFACES. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3871357D1 true DE3871357D1 (en) | 1992-06-25 |
Family
ID=6343412
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873743780 Withdrawn DE3743780A1 (en) | 1987-12-23 | 1987-12-23 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
DE8888120876T Expired - Lifetime DE3871357D1 (en) | 1987-12-23 | 1988-12-14 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYMID SURFACES. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873743780 Withdrawn DE3743780A1 (en) | 1987-12-23 | 1987-12-23 | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
Country Status (6)
Country | Link |
---|---|
US (1) | US4910045A (en) |
EP (1) | EP0322641B1 (en) |
JP (1) | JP2588600B2 (en) |
AT (1) | ATE76447T1 (en) |
CA (1) | CA1317824C (en) |
DE (2) | DE3743780A1 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182135A (en) * | 1986-08-12 | 1993-01-26 | Bayer Aktiengesellschaft | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
US5322976A (en) * | 1987-02-24 | 1994-06-21 | Polyonics Corporation | Process for forming polyimide-metal laminates |
US5200272A (en) * | 1988-04-29 | 1993-04-06 | Miles Inc. | Process for metallizing substrate surfaces |
US5238702A (en) * | 1988-10-27 | 1993-08-24 | Henning Giesecke | Electrically conductive patterns |
NL8902886A (en) * | 1989-11-22 | 1991-06-17 | Akzo Nv | LAMINATE FOR THE PROCESS OF STREAMLESS METALLIZATION, A PRINTED CIRCUIT PROVIDED THEREOF, AND A METHOD OF MANUFACTURING SUCH LAMINATE. |
US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
DE4036591A1 (en) * | 1990-11-16 | 1992-05-21 | Bayer Ag | PRIMER FOR METALLIZING SUBSTRATE SURFACES |
DE4036592A1 (en) * | 1990-11-16 | 1992-05-21 | Bayer Ag | INJECTION MOLDED CIRCUITS BY INJECTING FLEXIBLE CIRCUITS WITH THERMOPLASTIC MATERIALS |
GB9113437D0 (en) * | 1991-06-21 | 1991-08-07 | Gore W L & Ass Uk | Improvements in security enclosures |
DE4235019C1 (en) * | 1992-10-16 | 1994-04-21 | Ame Gmbh | Printed circuit board manufacture as well as assembly and contacting processes for components by electroless metal deposition |
DE4209708A1 (en) * | 1992-03-25 | 1993-09-30 | Bayer Ag | Process for improving the adhesive strength of electrolessly deposited metal layers |
DE4417245A1 (en) * | 1994-04-23 | 1995-10-26 | Lpkf Cad Cam Systeme Gmbh | High resolution structured metallisation prodn. |
DE4418016A1 (en) * | 1994-05-24 | 1995-11-30 | Wilfried Neuschaefer | Metallisation of articles made of non-conductive materials |
EP0727925A1 (en) * | 1995-02-14 | 1996-08-21 | Lpkf Cad/Cam Systeme Gmbh | Process for structured metallizing of the surface of substrates |
DE19624071A1 (en) * | 1996-06-17 | 1997-12-18 | Bayer Ag | Process for the production of sheet-like metal-coated foils |
JPH1197840A (en) * | 1997-09-16 | 1999-04-09 | Electro Kemi:Kk | Manufacture of printed wiring board |
DE19812880A1 (en) | 1998-03-24 | 1999-09-30 | Bayer Ag | Shaped part and flexible film with protected conductor track and process for its production |
US6374831B1 (en) * | 1999-02-04 | 2002-04-23 | Applied Materials, Inc. | Accelerated plasma clean |
US8002948B2 (en) * | 2002-04-24 | 2011-08-23 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
US7261920B2 (en) * | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
TWI268813B (en) * | 2002-04-24 | 2006-12-21 | Sipix Imaging Inc | Process for forming a patterned thin film conductive structure on a substrate |
US7156945B2 (en) * | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
WO2006103720A1 (en) * | 2005-03-25 | 2006-10-05 | Mitsubishi Denki Kabushiki Kaisha | Electroless plating preprocessing solution and metal conductor layer forming method using such solution |
TWI388122B (en) * | 2009-04-20 | 2013-03-01 | Unimicron Technology Corp | Method for forming circuit board structure of composite material |
DE102013003542B4 (en) * | 2013-03-02 | 2024-04-18 | Kostal Automobil Elektrik Gmbh & Co. Kg | Process for producing a functionalized and formed thermoplastic film and plastic film processed according to this process |
KR101581041B1 (en) | 2013-12-28 | 2015-12-29 | 전자부품연구원 | Hybrid Composite materials capable of fabrication of selective conducting pattern by Laser for 3D printing, manufacturing method of 3D electronic devices with the selective conducting pattern and 3D electronic devices thereby |
JP6175517B2 (en) * | 2014-01-16 | 2017-08-02 | ユニチカ株式会社 | Polyamideimide solution, porous polyamideimide film, and method for producing the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1543792A (en) * | 1966-12-29 | 1900-01-01 | Ibm | Metallization of plastics |
BE792310A (en) * | 1971-12-08 | 1973-06-05 | Kalle Ag | PROCESS FOR DEPOSITING COPPER COATS ON MOLDED PARTS OF POLYIMIDES |
JPS5722985A (en) * | 1979-05-28 | 1982-02-06 | Mitsubishi Heavy Ind Ltd | Hatch cover |
JPS5614554A (en) * | 1979-07-13 | 1981-02-12 | Kanegafuchi Chem Ind Co Ltd | Heat resistant resin composition |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
JPS5968108A (en) * | 1982-10-08 | 1984-04-18 | 日立化成工業株式会社 | Insulated wire |
DE3150985A1 (en) * | 1981-12-23 | 1983-06-30 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION |
US4604303A (en) * | 1983-05-11 | 1986-08-05 | Nissan Chemical Industries, Ltd. | Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition |
DE3332032A1 (en) * | 1983-09-06 | 1985-03-21 | Bayer Ag, 5090 Leverkusen | SPECIAL POLYAMIDIMIDES |
DE3332031A1 (en) * | 1983-09-06 | 1985-03-21 | Bayer Ag, 5090 Leverkusen | USE OF POLYAMIDIMIDES AS A THERMOPLASTIC |
DE3412447A1 (en) * | 1984-03-31 | 1985-11-28 | Schering AG, 1000 Berlin und 4709 Bergkamen | METHOD FOR PRODUCING PRINTED CIRCUITS |
-
1987
- 1987-12-23 DE DE19873743780 patent/DE3743780A1/en not_active Withdrawn
-
1988
- 1988-12-02 US US07/278,874 patent/US4910045A/en not_active Expired - Lifetime
- 1988-12-14 EP EP88120876A patent/EP0322641B1/en not_active Expired - Lifetime
- 1988-12-14 AT AT88120876T patent/ATE76447T1/en not_active IP Right Cessation
- 1988-12-14 DE DE8888120876T patent/DE3871357D1/en not_active Expired - Lifetime
- 1988-12-19 JP JP63318715A patent/JP2588600B2/en not_active Expired - Fee Related
- 1988-12-21 CA CA000586555A patent/CA1317824C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA1317824C (en) | 1993-05-18 |
EP0322641A2 (en) | 1989-07-05 |
ATE76447T1 (en) | 1992-06-15 |
EP0322641B1 (en) | 1992-05-20 |
EP0322641A3 (en) | 1990-04-04 |
US4910045A (en) | 1990-03-20 |
DE3743780A1 (en) | 1989-07-06 |
JP2588600B2 (en) | 1997-03-05 |
JPH01205080A (en) | 1989-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: I & T INNOVATION TECHNOLOGY ENTWICKLUNGS- UND HOLD |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: VOSSIUS & PARTNER, 81675 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |