DE102013003542B4 - Process for producing a functionalized and formed thermoplastic film and plastic film processed according to this process - Google Patents
Process for producing a functionalized and formed thermoplastic film and plastic film processed according to this process Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 21
- 239000002985 plastic film Substances 0.000 title claims abstract description 20
- 229920006255 plastic film Polymers 0.000 title claims abstract description 19
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000642 polymer Polymers 0.000 claims abstract description 8
- 230000004913 activation Effects 0.000 claims abstract description 7
- 238000001746 injection moulding Methods 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 238000003856 thermoforming Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 13
- 239000011888 foil Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
Verfahren zur Herstellung einer funktionalisierten und umgeformten thermoplastischen Kunststofffolie, gekennzeichnet durch die Abfolge folgender Verfahrensschritte in folgender Reihenfolge:
a) Vorkonditionierung einer Kunststofffolie aus einem thermoplastischen Polymer durch Erwärmung der Folie bis an die Glasübertragungstemperatur des eingesetzten thermoplastischen Polymers,
b) Ausbildung einer Struktur durch Applikation einer nichtleitenden Palladium-Polymer-Paste im Siebdruckverfahren auf die Kunststofffolie,
c) Aushärtung der applizierten Paste,
d) Tiefziehen des thermoplastischen Polymers und Aktivierung der Oberfläche mit einer anschließenden außenstromlose galvanische Verkupferung der Struktur in einem chemisch-reduktiven Kupferbad oder Aktivierung der Oberfläche mit einer anschließenden außenstromlose galvanischen Verkupferung der Struktur in einem chemisch-reduktiven Kupferbad und Tiefziehen des thermoplastischen Polymers,
e) Vereinzelung und Hinterspritzung der geformten Kunststofffolie in einer Spritzgussanlage.
a) Preconditioning of a plastic film made of a thermoplastic polymer by heating the film to the glass transition temperature of the thermoplastic polymer used,
b) Formation of a structure by applying a non-conductive palladium polymer paste to the plastic film using a screen printing process,
c) Curing of the applied paste,
d) deep drawing of the thermoplastic polymer and activation of the surface with subsequent electroless galvanic copper plating of the structure in a chemical-reductive copper bath or activation of the surface with subsequent electroless galvanic copper plating of the structure in a chemical-reductive copper bath and deep drawing of the thermoplastic polymer,
e) Separation and back-injection of the formed plastic film in an injection moulding system.
Description
Als funktionalisierte Kunststofffolien werden Folien aus thermoplastischen Polymeren bezeichnet, auf die elektrisch wirksame metallische Strukturen, wie Leiterbahnen, Sensorflächen oder ähnliches, aufgebracht sind.Functionalized plastic films are films made of thermoplastic polymers onto which electrically active metallic structures, such as conductor tracks, sensor surfaces or similar, are applied.
Ein Kunststoffformteil und eine flexible Folie mit einer geschützten Leiterbahn ist aus
Die Verwendung von umgeformten funktionalisierten Folien nimmt besonders im Automobilbereich zur Gestaltung von Bedienoberflächen immer weiter zu. Üblich dabei ist die Verwendung von Silberleitpasten, mit denen leitende Strukturen auf thermoplastischen Polymeren realisiert werden. Mit zunehmenden Rohstoffkosten, insbesondere für Edelmetalle, wird die Herstellung derartiger Folien jedoch immer kostenaufwendiger.The use of reshaped, functionalized films is becoming increasingly common, particularly in the automotive sector, for designing user interfaces. The usual method is to use silver conductive pastes to create conductive structures on thermoplastic polymers. However, with increasing raw material costs, especially for precious metals, the production of such films is becoming increasingly expensive.
Der Versuch, Silberleitpasten durch kostengünstigere Kupferstrukturen zu ersetzen, stößt auf Schwierigkeiten, wenn die Folie in einem Tiefziehprozess zu einem dreidimensionalen Körper geformt werden soll und Leiterstrukturen in den umgeformten Bereichen der Folie vorgesehen sind.The attempt to replace silver conductive pastes with more cost-effective copper structures encounters difficulties when the foil is to be formed into a three-dimensional body in a deep-drawing process and conductor structures are planned in the formed areas of the foil.
Die Anwendung eines entsprechenden Tiefziehprozesses bei einem thermoplastischen Kunststoff wird beispielsweise in der Patentschrift
Das Tiefziehen von thermoplastischen Polymeren mit leitenden Strukturen aus Silberleitpasten ist ein bekannter Prozess, der zur Herstellung funktionalisierter Folien bereits erfolgreich eingesetzt wird. Der Ansatz, diese leitenden Strukturen als Kupferbahnen zu realisieren führt aber unweigerlich zu einem Problem beim Tiefziehen. Das Kupfer ist nicht duktil genug, um den Umformgeometrien standzuhalten.The application of a corresponding deep-drawing process for a thermoplastic material is described, for example, in the patent specification
Deep drawing of thermoplastic polymers with conductive structures made of silver conductive pastes is a well-known process that has already been used successfully to produce functionalized films. However, the approach of realizing these conductive structures as copper tracks inevitably leads to a problem during deep drawing. The copper is not ductile enough to withstand the forming geometries.
Es ergab sich die Aufgabe, ein kostengünstiges Verfahren zur Herstellung funktionalisierter und umgeformter Folien zu schaffen und ein verfahrensgemäß hergestelltes Produkt zur Verfügung zu stellen.The task arose to create a cost-effective process for the production of functionalized and formed films and to provide a product manufactured according to the process.
Diese Aufgabe wird durch das im Anspruch 1 beschriebene Verfahren und das im Anspruch 3 genannte Verfahrensprodukt gelöst.This object is achieved by the method described in claim 1 and the method product mentioned in claim 3.
Die erfindungsgemäße Lösung sieht vor, Kupferstrukturen nicht in Pastenform auf eine Folie aufzubringen, sondern zunächst eine in einem Tiefziehverfahren formbare Paste aufzubringen, welche anschließend verkupfert wird. Nach dem Applizieren und Trocknen einer solchen Paste oder eines entsprechenden Systems aus mehreren Pasten, wird die Folie mit der aufgebrachten Paste in ein chemisch-reduktives Kupferbad gebracht und dort in einem außenstromlosen galvanischen Prozess mit Kupfer beschichtet.The solution according to the invention does not provide for applying copper structures to a foil in paste form, but rather first applying a paste that can be formed in a deep-drawing process, which is then copper-plated. After applying and drying such a paste or a corresponding system of several pastes, the foil with the applied paste is placed in a chemical-reductive copper bath and coated with copper in an electroplating process without external current.
Die außenstromlose galvanische Verkupferung kann dabei vor oder nach dem Umformen der Folie vorgesehen werden. Sollen durch den Umformprozess Leiterstrukturen mit sehr engen Radien erzeugt werden, so ist es vorteilhaft, die Folie zunächst mit der aufgebrachten Paste zu formen und erst nach dem Umformprozess die galvanische Verkupferung vorzunehmen, da so die Kupferbeschichtung keinen mechanischen Belastungen durch den Tiefziehprozess ausgesetzt wird.The electroless copper plating can be carried out before or after the foil is formed. If the forming process is intended to produce conductor structures with very tight radii, it is advantageous to first form the foil with the applied paste and only carry out the electrolytic copper plating after the forming process, as this means that the copper coating is not exposed to any mechanical stresses caused by the deep-drawing process.
Das erfindungsgemäße Verfahren ist in der einzigen Figur in einem Flussdiagramm dargestellt und besteht aus der Abfolge folgender Verfahrensschritte in folgender Reihenfolge:
- a) Vorkonditionierung einer Kunststofffolie aus einem thermoplastischen Polymer durch Erwärmung der Folie bis an die Glasübertragungstemperatur des eingesetzten thermoplastischen Polymers,
- b) Ausbildung einer Struktur durch Applikation einer nichtleitenden Palladium-Polymer-Paste im Siebdruckverfahren auf die Kunststofffolie,
- c) Aushärtung der applizierten Paste,
- d) Tiefziehen des thermoplastischen Polymers und Aktivierung der Oberfläche mit einer anschließenden stromlose galvanische Verkupferung der Struktur in einem chemisch-reduktiven Kupferbad oder Aktivierung der Oberfläche mit einer anschließenden stromlose galvanische Verkupferung der Struktur in einem chemisch-reduktiven Kupferbad und Tiefziehen des thermoplastischen Polymers,
- e) Vereinzelung und Hinterspritzung der geformten Kunststofffolie in einer Spritzgussanlage.
- a) Preconditioning of a plastic film made of a thermoplastic polymer by heating the film to the glass transition temperature of the thermoplastic polymer used,
- b) Formation of a structure by applying a non-conductive palladium polymer paste to the plastic film using a screen printing process,
- c) Curing of the applied paste,
- d) deep drawing of the thermoplastic polymer and activation of the surface with subsequent electroless galvanic copper plating of the structure in a chemical-reductive copper bath or activation of the surface with subsequent electroless galvanic copper plating of the structure in a chemical-reductive copper bath and deep drawing of the thermoplastic polymer,
- e) Separation and back-injection of the formed plastic film in an injection moulding system.
Die Vorkonditionierung der Kunststofffolie im Verfahrensschritt a) findet vorzugsweise in einem Umluftofen, einem IR-Ofen oder in deren Kombination statt. Die Temperaturen müssen bis an die Glasübergangstemperatur des eingesetzten thermoplastischen Polymers gehen, um Eigenspannungen des Halbzeuges und damit das Schwindungsverhalten zu vermindern.The preconditioning of the plastic film in process step a) preferably takes place in a circulating air oven, an IR oven or a combination of these. The temperatures must reach the glass transition temperature of the thermoplastic polymer used in order to reduce the internal stresses of the semi-finished product and thus the shrinkage behavior.
Im Verfahrensschritt b) wird die vorkonditionierte Folie einem Siebdrucker samt Carrier zugeführt. Bevor die Bedruckung beginnt, muss die zu verarbeitende Palladium-Polymer-Paste zuerst homogenisiert werden, bevor sie darauffolgend auf ein Sieb aufgetragen werden. Die eingestellten Siebdruckparameter müssen an die eingesetzte Paste angepasst werden.In process step b), the preconditioned film is fed to a screen printer including carrier. Before printing begins, the palladium polymer paste to be processed must first be homogenized before it is then applied to a screen. The set screen printing parameters must be adapted to the paste used.
Um beispielsweise nach dem Trocknen eine Schichtdicke von 4 bis 6 µm zu erreichen, muss eine Nass-Schichtdicke von 15 bis 18 µm aufgebracht werden. Die nassbedruckte Folie wird anschließend in einem Umluftofen oder einem IR-Ofen getrocknet, um die Paste auszuhärten.
Der Verfahrensschritt d) sieht vor, dass die nichtleitende zweidimensionale Pastenstruktur aktiviert und damit für die elektrochemische Kupferabscheidung vorbereitet wird. Danach erfolgt eine Kupferabscheidung bis eine Schichtdicke von beispielsweise 1 µm bis 3 µm erreicht ist. Die galvanische Abscheidung erfolgt in einem chemisch-reduktiven Kupferbad ohne Verwendung einer äußeren Stromquelle.For example, to achieve a layer thickness of 4 to 6 µm after drying, a wet layer thickness of 15 to 18 µm must be applied. The wet-printed film is then dried in a convection oven or an IR oven to harden the paste.
Process step d) involves activating the non-conductive two-dimensional paste structure and thus preparing it for electrochemical copper deposition. Copper is then deposited until a layer thickness of, for example, 1 µm to 3 µm is reached. The electroplating takes place in a chemical-reductive copper bath without the use of an external power source.
Die Wahl der Prozessparameter wird in Abhängigkeit der eingesetzten Kunststofffolie getroffen. Die Parameter Badtemperatur, Abscheiderate, Expositionszeit und die daraus resultierende Schichtdicke sind variabel und können den Anforderungen angepasst werden.The choice of process parameters depends on the plastic film used. The parameters bath temperature, deposition rate, exposure time and the resulting layer thickness are variable and can be adapted to requirements.
Im Anschluss wird die Kunststofffolie, durch einen Tiefziehprozess, vorzugsweise Thermoformen oder High-Pressure-Forming, in die Endgeometrie umgeformt. Die Reihenfolge der Prozessschritte Aktivierung/Verkupferung und Thermoformung kann auch umgekehrt werden. The plastic film is then formed into the final geometry using a deep-drawing process, preferably thermoforming or high-pressure forming. The order of the activation/copper plating and thermoforming process steps can also be reversed.
Im Verfahrensschritt e) wird die umgeformte Kunststofffolie mittels einer Laservorrichtung ausgeschnitten oder durch eine Stanzprozess vereinzelt und anschließend in einer Spritzgussanlage hinterspritzt.In process step e), the formed plastic film is cut out using a laser device or separated by a punching process and then back-injected in an injection molding system.
Die nach dem beschriebenen Verfahren gefertigte Kunststofffolie kann als Bestandteil einer Bedienoberfläche oder eines elektronischen Gerätes zur Anwendung kommen und insbesondere in einem Kraftfahrzeug verwendet werden.The plastic film produced according to the described process can be used as a component of a user interface or an electronic device and can be used in particular in a motor vehicle.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013003542.2A DE102013003542B4 (en) | 2013-03-02 | 2013-03-02 | Process for producing a functionalized and formed thermoplastic film and plastic film processed according to this process |
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| DE102013003542.2A DE102013003542B4 (en) | 2013-03-02 | 2013-03-02 | Process for producing a functionalized and formed thermoplastic film and plastic film processed according to this process |
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| DE102013003542A1 DE102013003542A1 (en) | 2014-09-04 |
| DE102013003542B4 true DE102013003542B4 (en) | 2024-04-18 |
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| CN110660529A (en) * | 2019-09-16 | 2020-01-07 | 信利光电股份有限公司 | Manufacturing method of conductive circuit and conductive circuit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3743780A1 (en) | 1987-12-23 | 1989-07-06 | Bayer Ag | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
| DE3840542C1 (en) | 1988-12-01 | 1989-11-02 | Curt 8122 Penzberg De Niebling | Process for producing a thin-walled, thermoformed plastic moulding and its use |
| DE4036592A1 (en) | 1990-11-16 | 1992-05-21 | Bayer Ag | INJECTION MOLDED CIRCUITS BY INJECTING FLEXIBLE CIRCUITS WITH THERMOPLASTIC MATERIALS |
| DE19812880A1 (en) | 1998-03-24 | 1999-09-30 | Bayer Ag | Shaped part and flexible film with protected conductor track and process for its production |
-
2013
- 2013-03-02 DE DE102013003542.2A patent/DE102013003542B4/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3743780A1 (en) | 1987-12-23 | 1989-07-06 | Bayer Ag | METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES |
| DE3840542C1 (en) | 1988-12-01 | 1989-11-02 | Curt 8122 Penzberg De Niebling | Process for producing a thin-walled, thermoformed plastic moulding and its use |
| DE4036592A1 (en) | 1990-11-16 | 1992-05-21 | Bayer Ag | INJECTION MOLDED CIRCUITS BY INJECTING FLEXIBLE CIRCUITS WITH THERMOPLASTIC MATERIALS |
| DE19812880A1 (en) | 1998-03-24 | 1999-09-30 | Bayer Ag | Shaped part and flexible film with protected conductor track and process for its production |
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| DE102013003542A1 (en) | 2014-09-04 |
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