DE3844114A1 - Kontaktierdraht aus einer bleilegierung zur verwendung in einer supraleitervorrichtung und supraleitervorrichtung - Google Patents

Kontaktierdraht aus einer bleilegierung zur verwendung in einer supraleitervorrichtung und supraleitervorrichtung

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Publication number
DE3844114A1
DE3844114A1 DE3844114A DE3844114A DE3844114A1 DE 3844114 A1 DE3844114 A1 DE 3844114A1 DE 3844114 A DE3844114 A DE 3844114A DE 3844114 A DE3844114 A DE 3844114A DE 3844114 A1 DE3844114 A1 DE 3844114A1
Authority
DE
Germany
Prior art keywords
wire
alloy
superconductor
lead
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3844114A
Other languages
English (en)
Other versions
DE3844114C2 (de
DE3844114C3 (de
Inventor
Toshinori Ogashiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62335113A external-priority patent/JPH0221628A/ja
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to DE3844879A priority Critical patent/DE3844879C3/de
Priority claimed from DE3844879A external-priority patent/DE3844879C3/de
Publication of DE3844114A1 publication Critical patent/DE3844114A1/de
Publication of DE3844114C2 publication Critical patent/DE3844114C2/de
Application granted granted Critical
Publication of DE3844114C3 publication Critical patent/DE3844114C3/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Description

Die Erfindung betrifft einen Kontaktierdraht aus einer Bleilegierung, der in Verbindung mit einer Supraleitervorrichtung dazu verwendet wird, einen Supraleiterchip und einen externen Leiter oder einen Supraleiterchip und einen anderen Supraleiterchip untereinander über ein Draht-Kontaktierverfahren, und insbesondere über ein Nagelkopf-Kontaktierverfahren oder ein Keil- Kontaktierverfahren elektrisch zu verbinden, und eine Supraleitervorrichtung, die davon Gebrauch macht.
Bislang wurde zum Anschließen einer Supraleitervorrichtung ein Aluminiumdraht als Kontaktierdraht verwendet, um die Vorrichtung an einen externen Leiter anzuschließen.
Dieser Stand der Technik besitzt jedoch den Nachteil, daß, da Al noch nicht in einen supraleitenden Zustand (kritische Temperatur von Aluminium beträgt 1,2 K) bei einer Arbeitstemperatur von 4,2 K (flüssige Heliumtemperatur) einer Supraleitervorrichtung überführt ist, der verbleibende Widerstand eine Ursache für einen Energieverlust eines Mikrosignals bedeutet. Dies erweist sich als ein Hauptgrund für die Verringerung der Zuverlässigkeit einer Supraleitervorrichtung.
Um diesen Nachteil zu überwinden, könnte man sofort an die Verwendung von Nb (9 K) oder Pb (7 K) oder an eine Legierung aus diesen Elementen, die jeweils eine kritische Temperatur von 4,2 K oder mehr besitzen, denken. Jedoch ist Nb zu hart und neigt dazu, während des Kontaktierens Chipbrüche zu erzeugen,und ist dadurch als Kontaktierdraht ungeeignet.
Im Falle von einem Draht aus reinem Blei oder einer Legierung davon tritt die Schwierigkeit auf, diese in einen dünnen Draht zu überführen. Des weiteren bestehen Probleme dahingehend, daß nach dem Kontaktieren der schleifenbildende Zustand nicht zufriedenstellend ist.
Die vorliegende Erfindung wurde durchgeführt, um die oben erwähnten Nachteile und/oder Probleme, die im Stand der Technik vorhanden sind, zu überwinden.
Es ist daher eine Aufgabe der vorliegenden Erfindung, einen Kontaktierdraht aus einer Bleilegierung zu schaffen, der geeignet ist, um die Drahtziehbearbeitbarkeit zu verbessern und um einen zufriedenstellenden Schleifenbildungszustand zu bewirken.
Eine weitere Aufgabe der Erfindung ist es, eine hochzuverlässige Supraleitervorrichtung zu schaffen.
Um die obigen Aufgaben zu lösen, wird im wesentlichen ein Kontaktierdraht aus einer Bleilegierung für eine Supraleitervorrichtung geschaffen, der hergestellt wurde, indem man eine Legierung, die sich aus Blei als Hauptelement und einem Zusatzelement, das hinzugegeben wurde, zusammensetzt, in eine dünne Drahtform über ein Flüssigabschreckverfahren überführt. Unter dem anderen Aspekt der Erfindung wird auch als wesentlich eine Supraleitervorrichtung zur Verfügung gestellt, die einen Supraleiterchip und einen externen Leiter oder Supraleiterchips, die untereinander über einen dünnen Legierungsdraht, der sich aus Blei als Hauptelement zusammensetzt, über ein Flüssigabschreckverfahren verbunden sind, umfaßt.
Das Zusatzelement schliesst mindestens ein Element aus der Reihe Cu, Ga, Ge, Se, Ag, In, Sn, Sb, Te, Au, Tl, Bi, Pd und Pt ein. Durch die Zugabe des Zusatzelementes oder der Zusatzelemente wird der Bleidraht in seiner Zugfestigkeit gesteigert, um günstige Kontaktiereigenschaften zu erhalten, und zusätzlich wird eine Spannung, bedingt durch thermische Verzerrung, unterdrückt, wenn er von Raumtemperatur auf 4,2°K abgekühlt oder von 4,2°K auf Raumtemperatur erwärmt wird.
Die obigen und weitere Aufgaben, kennzeichnenden Merkmale und Vorteile der vorliegenden Erfindung werden dem Fachmann deutlicher durch die Offenbarung bevorzugter Ausführungsformen der Erfindung in der folgenden Beschreibung und durch die begleitenden Zeichnungen werden.
Fig. 1 ist ein Querschnitt einer Supraleitervorrichtung gemäß einer Ausführungsform der vorliegenden Erfindung;
Fig. 2 ist ein Längsschnitt eines Teiles davon, das als A bezeichnet wird;
und
Fig. 3 ist ein Querschnitt einer veränderten Ausführungsform der Fig. 1.
Fig. 1 zeigt eine Supraleitervorrichtung der vorliegenden Erfindung. In der Figur bezeichnet (1) eine Kunststoff- oder keramische Grundplatte, (2) einen Supraleiterchip, (3) externe Leiter und (4) einen Legierungsdraht zum Kontaktieren.
Der Draht (4) wird hergestellt, indem man eine Legierung, die sich aus Blei als ein Hauptelement und einem dazugegebenen Zusatzelement zusammensetzt, über ein Flüssigabschreckverfahren erzeugt,und dann die Legierung in einen dünnen Draht über ein Drahtziehverfahren überführt. Der Durchmesser des Drahtes (4) ist 30 bis 50 µm.
Der Draht (4) ist an einem Ende mit dem Chip (2) und am anderen Ende mit dem externen Leiter (3) in solch einer Weise verbunden, daß durch ein Keil-Kontaktierverfahren eine Schleife gebildet wird. Der Chip (2) besitzt eine laminare Struktur aus einer Si-Schicht und einer Nb-Schicht, die einen Schaltkreis bilden. Ein verbindender Teil des Drahtes (4) ist mit einer Oberflächenmetallschicht (5) aus dem gleichen Material wie das des Drahtes (4) versehen. Der externe Leiter (3) ist auch mit einer Oberflächenmetallschicht (6) versehen. In Fig. 2 bezeichnet (7) eine Schutzschicht, die aus einem Isoliermaterial gebildet wird. Das Oberflächenmetall aus dem gleichen Material wie das des Drahtes (4) bedeutet, daß in dem Fall, in dem der Draht (4) Pb-In-Au ist, Pb-In-Au auch für die Oberflächenmetallschichten (5, 6) verwendet wird. In ähnlicher Weise wird in dem Fall, in dem der Draht (4) Pb-In-Ag, Pb-In-Cu, Pb-Bi und Pb-Sb ist, eine Legierung ausder gleichen Gruppen dieser Elemente verwendet.
Für den Fall, daß der Draht (4) Pb-In-Au ist, wird z.B. PbIn 12 Au4 für die Oberflächenmetallschichten (5, 6) eingesetzt.
Pb-In und Au können auch für die Oberflächenmetallschichten (5, 6) verwendet werden.
In diesem Fall kann jede der Legierungen Pb-In-Au, Pb-In-Ag, Pb-In-Cu, Pb-Bi und Pb-Sb mit zufriedenstellenden Ergebnissen für den Draht (4) angewandt werden.
Um den Kontakt mit der Nb-Schicht zu verstärken, und um ein Abschälen zu verhindern, wird Gold für die Oberflächenmetallschicht (5) verwendet.
Cu wird im allgemeinen für den externen Leiter (3) eingesetzt. In diesem Fall ist es bei der Oberflächenmetallschicht (6) nicht unbedingt erforderlich, das gleicheMaterial wie das des Drahtes (4) zu verwenden.
In der Ausführungsform der Fig. 1 wird ein Fall dargestellt, bei dem der Supraleiterchip (2) und der externe Leiter (3) untereinander über den Legierungsdraht (4) verbunden sind. Jedoch sind in einer Supraleitervorrichtung, in der die Grundplatte (1) mit einer Vielzahl von Supraleiterchips versehen ist, manchmal die Supraleiterchips (2, 2) untereinander über den Legierungsdraht (4) verbunden (siehe Fig. 3).
Obwohl in der Fig. 3 zwei Supraleiterchips gezeigt sind, können viel mehr Supraleiterchips gemäß der Notwendigkeit zur Verfügung gestellt werden.
Beispiele für die Drähte der vorliegenden Erfindung, die durch ein Flüssigabschreckverfahren hergestellt werden, sind in der folgenden Tabelle gezeigt. Die Tabelle zeigt die kritische Temperatur (Tc), die Zugfestigkeit, die Dehnung, gute oder schlechte Eigenschaften hinsichtlich des Schleifenbildungszustandes und der Drahtziehbearbeitbarkeit von Beispielen gemäß der vorliegenden Erfindung und von Gegenbeispielen.
Jeder der Drähte wurde in einen dünnen Draht mit einem Durchmesser von 40 µm über eine Drahtziehvorrichtung gezogen. Die Zeichen o in den Bewertungsspalte hinsichtlich der Drahtziehbearbeitbarkeit zeigen an, daß der Draht zu einem Durchmesser von 40 µm gezogen wurde, ohne einen Bruch des Drahtes zu erzeugen, wohingegen die Zeichen x bedeuten, daß ein Bruch des Drahtes während der Drahtziehbehandlung eintrat.
Die Funktion und Wirkung der vorliegenden Erfindung wird im folgenden beschrieben.
(1) Ein Draht aus einer Bleilegierung gemäß der vorliegenden Erfindung zeigt die folgenden Eigenschaften im Vergleich zu einem Draht, der über ein übliches Verfestigungsverfahren hergestellt wurde.
(a) Einführung einer Reihe von Matrixdefekten;
(b) Miniaturisierung der Kristallkörner;
(c) Miniaturisierung und Dispersion einer Verbindungsphase;
(d) Erzeugung einer metastabilen Phase;
(e) Struktur mit einer erzwungenen, festen Lösung zwischen den Elementen;
(f) bedeutende Verbesserung der Zugfestigkeit.
Dadurch konnten Kontaktiereigenschaften erreicht werden, bei denen die Drahtziehbearbeitbarkeit eines Bleidrahtes verbessert wird, und der Draht kann dünner gestaltet werden, so daß er für den Zweck des Kontaktierens gut genug ist, und der Schleifenbildungszustand wird nach dem Kontaktieren zufriedenstellend.
(2) Bei der Arbeitstemperatur (4,2 K) der Supraleitervorrichtung wird auch der Bleidraht in einen supraleitenden Zustand überführt, und als ein Ergebnis davon sind der Supraleiterchip und der externe Leiter oder ein Supraleiterchip und ein anderer Supraleiterchip untereinander in dem supraleitenden Zustand verbunden. Deshalb besteht kein Energieverlust von Mikrosignalen, und damit ist die Zuverlässigkeit der Supraleitervorrichtung wesentlich gesteigert.

Claims (12)

1. Kontaktierdraht aus einer Bleilegierung zur Verwendung in einer Supraleitervorrichtung, der dadurch hergestellt wird, indem man eine Legierung, die sich aus Blei als Hauptelement und einem weiteren Element, das zu diesem hinzugegeben wurde, zusammensetzt, in eine dünne Drahtform über ein Flüssigabschreckverfahren überführt.
2. Kontaktierdraht aus einer Bleilegierung nach Anspruch 1, wobei das zusätzliche Element mindestens ein Element aus der Reihe Cu, Ga, Ge, Se, Ag, In, Sn, Sb, Te, Au, Tl, Bi, Pd und Pt einschließt.
3. Kontaktierdraht aus einer Bleilegierung nach Anspruch 2, wobei die Bleilegierung Pb-In-Au ist.
4. Kontaktierdraht aus einer Bleilegierung nach Anspruch 2, wobei die Bleilegierung Pb-In-Ag ist.
5. Kontaktierdraht aus einer Bleilegierung nach Anspruch 2, wobei die Bleilegierung Pb-In-Cu ist.
6. Kontaktierdraht aus einer Bleilegierung nach Anspruch 2, wobei die Bleilegierung Pb-Bi ist.
7. Kontaktierdraht aus einer Bleilegierung nach Anspruch 2, wobei die Bleilegierung Pb-Sb ist.
8. Supraleitervorrichtung, die einen Supraleiterchip und einen externen Leiter, oder Supraleiterchips, die miteinander über einen dünnen Legierungsdraht, der sich aus Blei als Hauptelement zusammensetzt, durch ein Flüssigabschreckverfahren verbunden sind, umfaßt.
9. Supraleitervorrichtung nach Anspruch 8, wobei das zusätzliche Element, das zu dem Legierungsdraht hinzugegeben wird, mindestens ein Element aus der Reihe Cu, Ga, Ge, Se, Ag, In, Sn, Sb, Te, Au, Tl, Bi, Pd und Pt einschließt.
10. Supraleitervorrichtung nach Anspruch 9, wobei ein Oberflächenmetall an der Seite des Supraleiterchips, die mit dem Legierungsdraht verbunden ist, eine Legierung des gleichen Materials wie das des Legierungsdrahtes ist.
11. Supraleitervorrichtung nach Anspruch 9, wobei ein Oberflächenmetall an der Seite des Supraleiterchips, die mit dem Legierungsdraht verbunden ist, Pb-In ist.
12. Supraleitervorrichtung nach Anspruch 9, wobei der Supraleiterchip eine laminare Struktur besitzt, die eine Si-Schicht und eine Nb-Schicht und ein Oberflächenmetall an der Seite des Supraleiterchips, die mit dem Legierungsdraht verbunden ist, aus Au umfaßt.
DE3844114A 1987-12-28 1988-12-28 Verwendung eines Kontaktierdrahtes aus einer Bleilegierung in einer Supraleitervorrichtung Expired - Fee Related DE3844114C3 (de)

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JP62335113A JPH0221628A (ja) 1987-12-28 1987-12-28 超電導素子用ボンディングｐｂ合金線及び超電導装置
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EP0497183A2 (de) * 1991-01-31 1992-08-05 Siemens Aktiengesellschaft Lötbare, supraleitende Leitung und Verwendung der Leitung

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GB1458017A (en) * 1972-11-14 1976-12-08 Allied Chem Method of and apparatus for spinning metallic filaments
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Publication number Priority date Publication date Assignee Title
EP0497183A2 (de) * 1991-01-31 1992-08-05 Siemens Aktiengesellschaft Lötbare, supraleitende Leitung und Verwendung der Leitung
EP0497183A3 (en) * 1991-01-31 1992-12-30 Siemens Aktiengesellschaft Solderable superconducting wire and its application

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DE3844114C3 (de) 1999-03-18

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