DE3773570D1 - Realisierungsverfahren einer elektronischen speicher-karte und durch dieses verfahren erhaltene karte. - Google Patents

Realisierungsverfahren einer elektronischen speicher-karte und durch dieses verfahren erhaltene karte.

Info

Publication number
DE3773570D1
DE3773570D1 DE8787401697T DE3773570T DE3773570D1 DE 3773570 D1 DE3773570 D1 DE 3773570D1 DE 8787401697 T DE8787401697 T DE 8787401697T DE 3773570 T DE3773570 T DE 3773570T DE 3773570 D1 DE3773570 D1 DE 3773570D1
Authority
DE
Germany
Prior art keywords
card
implementing
electronic memory
received
memory card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE8787401697T
Other languages
English (en)
Inventor
Alain Rebjock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9337706&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3773570(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger SA filed Critical Schlumberger SA
Application granted granted Critical
Publication of DE3773570D1 publication Critical patent/DE3773570D1/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49792—Dividing through modified portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8787401697T 1986-07-24 1987-07-21 Realisierungsverfahren einer elektronischen speicher-karte und durch dieses verfahren erhaltene karte. Revoked DE3773570D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8610753 1986-07-24

Publications (1)

Publication Number Publication Date
DE3773570D1 true DE3773570D1 (de) 1991-11-14

Family

ID=9337706

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787401697T Revoked DE3773570D1 (de) 1986-07-24 1987-07-21 Realisierungsverfahren einer elektronischen speicher-karte und durch dieses verfahren erhaltene karte.

Country Status (5)

Country Link
US (1) US4996411A (de)
EP (1) EP0254640B1 (de)
JP (1) JPS6399996A (de)
DE (1) DE3773570D1 (de)
ES (1) ES2026926T3 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940003375B1 (ko) * 1986-05-21 1994-04-21 가부시끼가이샤 히다찌세이사꾸쇼 반도체 장치 및 그 제조 방법
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
US5084802A (en) * 1989-05-16 1992-01-28 At&T Bell Laboratories Method for manufacture of EMI reducing circuit card apparatus
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2647571B1 (fr) * 1989-05-26 1994-07-22 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
US5508231A (en) * 1994-03-07 1996-04-16 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
DE4441931C1 (de) * 1994-04-27 1995-07-27 Siemens Ag Chipkarte
US5917705A (en) * 1994-04-27 1999-06-29 Siemens Aktiengesellschaft Chip card
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
DE4431754C1 (de) * 1994-09-06 1995-11-23 Siemens Ag Trägerelement
DE19512191C2 (de) * 1995-03-31 2000-03-09 Siemens Ag Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
US5677521A (en) * 1995-06-29 1997-10-14 Garrou; Elizabeth B. Personal identification and credit information system and method of performing transaction
EP0839344A1 (de) * 1995-07-20 1998-05-06 Dallas Semiconductor Corporation Mikroschaltung mit durch hardware und software geschütztem speicher
DE19536464C2 (de) * 1995-09-29 1998-06-04 Siemens Ag Transponder und Verfahren zu seiner Herstellung
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
DE69737742T2 (de) * 1996-03-12 2008-01-31 Koninklijke Philips Electronics N.V. Herstellungsmethode einer hybriden integrierten schaltung
FR2746531B1 (fr) * 1996-03-19 1998-05-22 Leroux Gilles Sa Machine de personnalisation a haute cadence
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
DE19631387A1 (de) * 1996-08-02 1997-08-14 Siemens Ag Chipkarten und Verfahren zu ihrer Herstellung
DE19639025C2 (de) 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
EP0998725A1 (de) 1998-03-27 2000-05-10 Koninklijke Philips Electronics N.V. Datenträger mit implantierten modul basierend auf einem metall-leiterrahmen
ATE383620T1 (de) 1998-03-27 2008-01-15 Nxp Bv Datenträger mit einem auf leiterrahmen basierten modul mit doppelseitiger chip-abdeckung
FR2781068B1 (fr) * 1998-07-07 2000-10-13 Rue Cartes Et Systemes De Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue
US6910635B1 (en) * 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
FR2852190B1 (fr) * 2003-03-03 2005-09-23 Procede de fabrication d'un composant ou d'un module electronique et composant ou module correspondant
US9195929B2 (en) * 2013-08-05 2015-11-24 A-Men Technology Corporation Chip card assembling structure and method thereof
US20160232438A1 (en) * 2015-02-06 2016-08-11 American Express Travel Related Services Company, Inc. Ceramic-containing transaction cards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
US4578573A (en) * 1983-03-23 1986-03-25 Datakey, Inc. Portable electronic information devices and method of manufacture
JPS6115289A (ja) * 1984-06-29 1986-01-23 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede

Also Published As

Publication number Publication date
EP0254640B1 (de) 1991-10-09
JPS6399996A (ja) 1988-05-02
EP0254640A1 (de) 1988-01-27
ES2026926T3 (es) 1992-05-16
US4996411A (en) 1991-02-26

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation