DE3687585D1 - Zusammensetzung und verfahren zur herstellung eines musters von klebemitteln. - Google Patents

Zusammensetzung und verfahren zur herstellung eines musters von klebemitteln.

Info

Publication number
DE3687585D1
DE3687585D1 DE8686870020T DE3687585T DE3687585D1 DE 3687585 D1 DE3687585 D1 DE 3687585D1 DE 8686870020 T DE8686870020 T DE 8686870020T DE 3687585 T DE3687585 T DE 3687585T DE 3687585 D1 DE3687585 D1 DE 3687585D1
Authority
DE
Germany
Prior art keywords
pattern
blend
adhesive
resin
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686870020T
Other languages
English (en)
Other versions
DE3687585T2 (de
Inventor
Patricia A Fricano
Howard P Cordts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UCB SA
Original Assignee
UCB SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UCB SA filed Critical UCB SA
Publication of DE3687585D1 publication Critical patent/DE3687585D1/de
Application granted granted Critical
Publication of DE3687585T2 publication Critical patent/DE3687585T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
DE8686870020T 1985-02-19 1986-02-18 Zusammensetzung und verfahren zur herstellung eines musters von klebemitteln. Expired - Fee Related DE3687585T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70257385A 1985-02-19 1985-02-19

Publications (2)

Publication Number Publication Date
DE3687585D1 true DE3687585D1 (de) 1993-03-11
DE3687585T2 DE3687585T2 (de) 1993-06-09

Family

ID=24821782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686870020T Expired - Fee Related DE3687585T2 (de) 1985-02-19 1986-02-18 Zusammensetzung und verfahren zur herstellung eines musters von klebemitteln.

Country Status (5)

Country Link
EP (1) EP0195767B1 (de)
JP (1) JPS61194441A (de)
AT (1) ATE85138T1 (de)
DE (1) DE3687585T2 (de)
HK (1) HK56194A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2221468B (en) * 1985-12-27 1990-09-05 Fsk Kk Adhesive sheet suitable for use in dicing semiconductor wafers into chips
DE3639266A1 (de) * 1985-12-27 1987-07-02 Fsk K K Haftfolie
US5183599A (en) * 1990-01-19 1993-02-02 Smuckler Jack H Rapid curing, electrically conductive adhesive
KR20070105040A (ko) * 2006-04-25 2007-10-30 엘지.필립스 엘시디 주식회사 레지스트 조성물, 이를 이용한 레지스트 패턴 형성방법 및이를 이용하여 제조된 어레이 기판
CN114907798B (zh) * 2021-10-22 2024-05-28 亮线(上海)新材料科技有限公司 一种电子束辐射固化胶黏剂及其制备方法与应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423574B2 (de) * 1972-09-13 1979-08-15
JPS5515696B2 (de) * 1973-08-07 1980-04-25
DE2854010A1 (de) * 1977-12-21 1979-07-05 Letraset International Ltd Verfahren zur herstellung von schildern
JPS55145717A (en) * 1979-05-02 1980-11-13 Sumitomo Chem Co Ltd Resin composition curable by ultraviolet ray
JPS5626951A (en) * 1979-08-08 1981-03-16 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS5667322A (en) * 1979-11-05 1981-06-06 Showa Highpolymer Co Ltd Curable resin composition
EP0142463B1 (de) * 1983-08-24 1989-09-20 Ciba-Geigy Ag Verfahren zur Herstellung von Prepregs und die damit erhältlichen verstärkten Verbundstoffe

Also Published As

Publication number Publication date
JPS61194441A (ja) 1986-08-28
DE3687585T2 (de) 1993-06-09
HK56194A (en) 1994-06-03
ATE85138T1 (de) 1993-02-15
EP0195767A1 (de) 1986-09-24
EP0195767B1 (de) 1993-01-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee