DE3582091D1 - Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern. - Google Patents
Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern.Info
- Publication number
- DE3582091D1 DE3582091D1 DE8585401518T DE3582091T DE3582091D1 DE 3582091 D1 DE3582091 D1 DE 3582091D1 DE 8585401518 T DE8585401518 T DE 8585401518T DE 3582091 T DE3582091 T DE 3582091T DE 3582091 D1 DE3582091 D1 DE 3582091D1
- Authority
- DE
- Germany
- Prior art keywords
- package
- electronic components
- shaped electronic
- assembly arrangement
- flat connecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15340384A JPS6132490A (ja) | 1984-07-24 | 1984-07-24 | フラツトリ−ドパツケ−ジ型電子部品の取付け構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3582091D1 true DE3582091D1 (de) | 1991-04-18 |
Family
ID=15561725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585401518T Expired - Fee Related DE3582091D1 (de) | 1984-07-24 | 1985-07-23 | Montageanordnung fuer paeckchenfoermige elektronische bauteile mit flachen anschlussleitern. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4703393A (de) |
EP (1) | EP0169788B1 (de) |
JP (1) | JPS6132490A (de) |
KR (1) | KR910000996B1 (de) |
AU (1) | AU565047B2 (de) |
BR (1) | BR8503495A (de) |
CA (1) | CA1233910A (de) |
DE (1) | DE3582091D1 (de) |
ES (1) | ES8609873A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JP2726042B2 (ja) * | 1987-02-03 | 1998-03-11 | 三菱電機株式会社 | 半導体装置 |
US4862247A (en) * | 1987-11-24 | 1989-08-29 | Texas Instruments Incorporated | Contact joint for semiconductor chip carriers |
DE3853197T2 (de) * | 1987-12-07 | 1995-06-29 | Nippon Electric Co | Kühlungssystem für integrierte Schaltungspackung. |
US4827611A (en) * | 1988-03-28 | 1989-05-09 | Control Data Corporation | Compliant S-leads for chip carriers |
JPH01313969A (ja) * | 1988-06-13 | 1989-12-19 | Hitachi Ltd | 半導体装置 |
US5191404A (en) * | 1989-12-20 | 1993-03-02 | Digital Equipment Corporation | High density memory array packaging |
JP3187106B2 (ja) * | 1991-12-27 | 2001-07-11 | ローム株式会社 | 電気回路素子のパッケージ構造 |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5455386A (en) * | 1994-01-14 | 1995-10-03 | Olin Corporation | Chamfered electronic package component |
US5969259A (en) * | 1995-04-07 | 1999-10-19 | Sensym, Inc. | Side port package for micromachined fluid sensor |
US5610436A (en) * | 1995-06-07 | 1997-03-11 | Bourns, Inc. | Surface mount device with compensation for thermal expansion effects |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5883789A (en) * | 1997-09-19 | 1999-03-16 | United Technologies Corporation | Method of mounting a PC board to a hybrid |
US6339534B1 (en) * | 1999-11-05 | 2002-01-15 | International Business Machines Corporation | Compliant leads for area array surface mounted components |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588618A (en) * | 1970-03-02 | 1971-06-28 | Raychem Corp | Unsoldering method and apparatus using heat-recoverable materials |
US4377316A (en) * | 1981-02-27 | 1983-03-22 | International Business Machines Corporation | High density interconnection means for chip carriers |
JPS57155758A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
-
1984
- 1984-07-24 JP JP15340384A patent/JPS6132490A/ja active Granted
-
1985
- 1985-07-22 CA CA000487257A patent/CA1233910A/en not_active Expired
- 1985-07-22 US US06/757,308 patent/US4703393A/en not_active Expired - Lifetime
- 1985-07-23 DE DE8585401518T patent/DE3582091D1/de not_active Expired - Fee Related
- 1985-07-23 BR BR8503495A patent/BR8503495A/pt not_active IP Right Cessation
- 1985-07-23 EP EP85401518A patent/EP0169788B1/de not_active Expired - Lifetime
- 1985-07-23 ES ES545480A patent/ES8609873A1/es not_active Expired
- 1985-07-23 AU AU45255/85A patent/AU565047B2/en not_active Ceased
- 1985-07-24 KR KR1019850005293A patent/KR910000996B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA1233910A (en) | 1988-03-08 |
KR860001681A (ko) | 1986-03-20 |
EP0169788B1 (de) | 1991-03-13 |
US4703393A (en) | 1987-10-27 |
AU4525585A (en) | 1986-01-30 |
ES8609873A1 (es) | 1986-09-01 |
EP0169788A3 (en) | 1987-11-04 |
KR910000996B1 (ko) | 1991-02-19 |
EP0169788A2 (de) | 1986-01-29 |
JPH0256838B2 (de) | 1990-12-03 |
ES545480A0 (es) | 1986-09-01 |
AU565047B2 (en) | 1987-09-03 |
BR8503495A (pt) | 1986-04-15 |
JPS6132490A (ja) | 1986-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |