JPS57155758A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57155758A
JPS57155758A JP4031981A JP4031981A JPS57155758A JP S57155758 A JPS57155758 A JP S57155758A JP 4031981 A JP4031981 A JP 4031981A JP 4031981 A JP4031981 A JP 4031981A JP S57155758 A JPS57155758 A JP S57155758A
Authority
JP
Japan
Prior art keywords
package
lead
protecting groove
top end
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4031981A
Other languages
Japanese (ja)
Other versions
JPS6251501B2 (en
Inventor
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4031981A priority Critical patent/JPS57155758A/en
Publication of JPS57155758A publication Critical patent/JPS57155758A/en
Publication of JPS6251501B2 publication Critical patent/JPS6251501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To miniaturize and enhance the mounting effect of lead, by forming so that lead enters a protecting groove provided in the half-lower part of a package to prevent the top end from projecting outward from the outer boundary of the package. CONSTITUTION:A plurality of in-line type leads 6 are distributed to the both sides of the package 5 constituted of resin, and the protecting groove 7 is provided from the joint of the lead 6 toward the lower part. The lead 6 is bent down at the position some distant from the bottom of the protecting groove with the top end horizontally extended toward the outside to form a fit connecting part 8 to a printing substrate being not projected toward the outside from the outer boundary of the package. Thus, the outer dimension is reduced with less chance of contacting external force for the improvement of mounting yield.
JP4031981A 1981-03-23 1981-03-23 Semiconductor device Granted JPS57155758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4031981A JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4031981A JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57155758A true JPS57155758A (en) 1982-09-25
JPS6251501B2 JPS6251501B2 (en) 1987-10-30

Family

ID=12577286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4031981A Granted JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57155758A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184746A (en) * 1982-04-22 1983-10-28 Toshiba Corp Package
JPS5980955A (en) * 1982-10-29 1984-05-10 Matsushita Electronics Corp Electronic parts device
JPS59104544U (en) * 1982-12-29 1984-07-13 松下電器産業株式会社 integrated circuit device
JPS59189662A (en) * 1983-04-13 1984-10-27 Fujitsu Ltd Resin-sealed type semiconductor device
JPS6088561U (en) * 1983-11-22 1985-06-18 日本電気株式会社 semiconductor equipment
JPS6116556A (en) * 1984-07-03 1986-01-24 Matsushita Electronics Corp Resin sealed type semiconductor device
US4698660A (en) * 1982-03-30 1987-10-06 Fujitsu Limited Resin-molded semiconductor device
US4703393A (en) * 1984-07-24 1987-10-27 Fujitsu Ltd. Mounting structure of flat-lead package-type electronic component
JPS6398640U (en) * 1986-12-16 1988-06-25

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4698660A (en) * 1982-03-30 1987-10-06 Fujitsu Limited Resin-molded semiconductor device
JPS58184746A (en) * 1982-04-22 1983-10-28 Toshiba Corp Package
JPS5980955A (en) * 1982-10-29 1984-05-10 Matsushita Electronics Corp Electronic parts device
JPS59104544U (en) * 1982-12-29 1984-07-13 松下電器産業株式会社 integrated circuit device
JPS59189662A (en) * 1983-04-13 1984-10-27 Fujitsu Ltd Resin-sealed type semiconductor device
JPS6088561U (en) * 1983-11-22 1985-06-18 日本電気株式会社 semiconductor equipment
JPS6116556A (en) * 1984-07-03 1986-01-24 Matsushita Electronics Corp Resin sealed type semiconductor device
US4703393A (en) * 1984-07-24 1987-10-27 Fujitsu Ltd. Mounting structure of flat-lead package-type electronic component
JPS6398640U (en) * 1986-12-16 1988-06-25

Also Published As

Publication number Publication date
JPS6251501B2 (en) 1987-10-30

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