JPS57155758A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57155758A JPS57155758A JP4031981A JP4031981A JPS57155758A JP S57155758 A JPS57155758 A JP S57155758A JP 4031981 A JP4031981 A JP 4031981A JP 4031981 A JP4031981 A JP 4031981A JP S57155758 A JPS57155758 A JP S57155758A
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead
- protecting groove
- top end
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To miniaturize and enhance the mounting effect of lead, by forming so that lead enters a protecting groove provided in the half-lower part of a package to prevent the top end from projecting outward from the outer boundary of the package. CONSTITUTION:A plurality of in-line type leads 6 are distributed to the both sides of the package 5 constituted of resin, and the protecting groove 7 is provided from the joint of the lead 6 toward the lower part. The lead 6 is bent down at the position some distant from the bottom of the protecting groove with the top end horizontally extended toward the outside to form a fit connecting part 8 to a printing substrate being not projected toward the outside from the outer boundary of the package. Thus, the outer dimension is reduced with less chance of contacting external force for the improvement of mounting yield.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4031981A JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4031981A JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57155758A true JPS57155758A (en) | 1982-09-25 |
JPS6251501B2 JPS6251501B2 (en) | 1987-10-30 |
Family
ID=12577286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4031981A Granted JPS57155758A (en) | 1981-03-23 | 1981-03-23 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57155758A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184746A (en) * | 1982-04-22 | 1983-10-28 | Toshiba Corp | Package |
JPS5980955A (en) * | 1982-10-29 | 1984-05-10 | Matsushita Electronics Corp | Electronic parts device |
JPS59104544U (en) * | 1982-12-29 | 1984-07-13 | 松下電器産業株式会社 | integrated circuit device |
JPS59189662A (en) * | 1983-04-13 | 1984-10-27 | Fujitsu Ltd | Resin-sealed type semiconductor device |
JPS6088561U (en) * | 1983-11-22 | 1985-06-18 | 日本電気株式会社 | semiconductor equipment |
JPS6116556A (en) * | 1984-07-03 | 1986-01-24 | Matsushita Electronics Corp | Resin sealed type semiconductor device |
US4698660A (en) * | 1982-03-30 | 1987-10-06 | Fujitsu Limited | Resin-molded semiconductor device |
US4703393A (en) * | 1984-07-24 | 1987-10-27 | Fujitsu Ltd. | Mounting structure of flat-lead package-type electronic component |
JPS6398640U (en) * | 1986-12-16 | 1988-06-25 |
-
1981
- 1981-03-23 JP JP4031981A patent/JPS57155758A/en active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4698660A (en) * | 1982-03-30 | 1987-10-06 | Fujitsu Limited | Resin-molded semiconductor device |
JPS58184746A (en) * | 1982-04-22 | 1983-10-28 | Toshiba Corp | Package |
JPS5980955A (en) * | 1982-10-29 | 1984-05-10 | Matsushita Electronics Corp | Electronic parts device |
JPS59104544U (en) * | 1982-12-29 | 1984-07-13 | 松下電器産業株式会社 | integrated circuit device |
JPS59189662A (en) * | 1983-04-13 | 1984-10-27 | Fujitsu Ltd | Resin-sealed type semiconductor device |
JPS6088561U (en) * | 1983-11-22 | 1985-06-18 | 日本電気株式会社 | semiconductor equipment |
JPS6116556A (en) * | 1984-07-03 | 1986-01-24 | Matsushita Electronics Corp | Resin sealed type semiconductor device |
US4703393A (en) * | 1984-07-24 | 1987-10-27 | Fujitsu Ltd. | Mounting structure of flat-lead package-type electronic component |
JPS6398640U (en) * | 1986-12-16 | 1988-06-25 |
Also Published As
Publication number | Publication date |
---|---|
JPS6251501B2 (en) | 1987-10-30 |
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