DE3485085D1 - Elektrisch leitende klebende folie. - Google Patents
Elektrisch leitende klebende folie.Info
- Publication number
- DE3485085D1 DE3485085D1 DE8484116388T DE3485085T DE3485085D1 DE 3485085 D1 DE3485085 D1 DE 3485085D1 DE 8484116388 T DE8484116388 T DE 8484116388T DE 3485085 T DE3485085 T DE 3485085T DE 3485085 D1 DE3485085 D1 DE 3485085D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- adhesive film
- conductive adhesive
- film
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01066—Dysprosium [Dy]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25078883A JPS60140790A (ja) | 1983-12-27 | 1983-12-27 | 連結シ−ト |
JP59023882A JPS60170176A (ja) | 1984-02-10 | 1984-02-10 | 透明導電膜との接続構造体 |
JP59033793A JPS60178690A (ja) | 1984-02-24 | 1984-02-24 | 配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3485085D1 true DE3485085D1 (de) | 1991-10-24 |
Family
ID=27284422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484116388T Expired - Lifetime DE3485085D1 (de) | 1983-12-27 | 1984-12-27 | Elektrisch leitende klebende folie. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4735847A (de) |
EP (1) | EP0147856B1 (de) |
AU (1) | AU572615B2 (de) |
CA (1) | CA1227579A (de) |
DE (1) | DE3485085D1 (de) |
Families Citing this family (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
CA1284523C (en) * | 1985-08-05 | 1991-05-28 | Leo G. Svendsen | Uniaxially electrically conductive articles with porous insulating substrate |
JPS6261397A (ja) * | 1985-09-11 | 1987-03-18 | ソニ−ケミカル株式会社 | 配線基板の接続方法 |
AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
AU608745B2 (en) * | 1986-02-07 | 1991-04-18 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
EP0265077A3 (de) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | Ein Anisotropisches Klebemittel zum Verbinden elektrischer Bauelemente |
US4837407A (en) * | 1987-03-30 | 1989-06-06 | Aisin Seiki Company, Ltd. | Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof |
GB2203442B (en) * | 1987-04-14 | 1991-10-16 | James Robert Clements | Electronic device including uniaxial conductive adhesive and method of making same |
US5246771A (en) * | 1988-04-18 | 1993-09-21 | Teraoka Seisakusho Co., Ltd. | Adhesive tape for preventing implosion and removing electrostatic charge |
JPH0717162Y2 (ja) * | 1988-05-13 | 1995-04-19 | ミノルタ株式会社 | フレキシブルプリント基板 |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
CA1307594C (en) * | 1988-06-10 | 1992-09-15 | Kenneth B. Gilleo | Multilayer electronic circuit and method of manufacture |
US5240761A (en) * | 1988-08-29 | 1993-08-31 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
DE3844420A1 (de) * | 1988-12-30 | 1990-07-05 | Mst Micro Sensor Tech Gmbh | Verfahren und vorrichtung zum anschliessen flexibler leiterbahnen an anschlusskontakte |
JPH03125443A (ja) * | 1989-10-09 | 1991-05-28 | Sharp Corp | 実装基板の電極及び該実装基板の電極を有する液晶表示装置 |
US5049085A (en) * | 1989-12-22 | 1991-09-17 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
US5245751A (en) | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
EP0591174B1 (de) * | 1990-06-08 | 1997-07-16 | Minnesota Mining And Manufacturing Company | Wiederverarbeitbarer klebstoff für elektronische anwendungen |
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
JPH04332404A (ja) * | 1991-05-07 | 1992-11-19 | Nec Corp | 異方性導電材料及びこれを用いた集積回路素子の接続方法 |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
US5206585A (en) * | 1991-12-02 | 1993-04-27 | At&T Bell Laboratories | Methods for testing integrated circuit devices |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
JPH07174788A (ja) * | 1993-12-17 | 1995-07-14 | Nhk Spring Co Ltd | 導電性接触子 |
DE4406418C1 (de) * | 1994-02-28 | 1995-07-13 | Bosch Gmbh Robert | Anisotrop elektrisch leitender Kleber |
CA2184373C (en) * | 1994-03-08 | 2002-01-29 | Lee J. Millette | Fabrication multilayer combined rigid/flex printed circuit board |
CN1090370C (zh) * | 1994-06-29 | 2002-09-04 | 罗伯特·博施有限公司 | 各向异性导电粘合剂及其制备方法 |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
FI98899C (fi) * | 1994-10-28 | 1997-09-10 | Jorma Kalevi Kivilahti | Menetelmä elektroniikan komponenttien liittämiseksi juottamalla |
US5621836A (en) * | 1994-11-28 | 1997-04-15 | Methode Electronics, Inc. | Plastic fiber alignment ferrule and termination method |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
DE19510186C2 (de) * | 1995-03-21 | 2003-12-24 | Aeg Ges Moderne Inf Sys Mbh | Verfahren zum Anschluß eines flexiblen Verbindungselements an ein Substrat |
DE19540807C1 (de) * | 1995-11-02 | 1997-04-17 | Mayer Textilmaschf | Flexibles elektrisches Kabel und aus diesem Kabel bestehende elektrische Verbindung |
US5914534A (en) * | 1996-05-03 | 1999-06-22 | Ford Motor Company | Three-dimensional multi-layer molded electronic device and method for manufacturing same |
TW505686B (en) * | 1996-07-15 | 2002-10-11 | Hitachi Chemical Ltd | Film-like adhesive for connecting circuit and circuit board |
US6193139B1 (en) * | 1996-10-17 | 2001-02-27 | Jorma Kivilahti | Method for joining metals by soldering |
US6100178A (en) * | 1997-02-28 | 2000-08-08 | Ford Motor Company | Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same |
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
JP3587859B2 (ja) * | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
US6019271A (en) * | 1997-07-11 | 2000-02-01 | Ford Motor Company | Method for ultrasonic bonding flexible circuits |
US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
US6893896B1 (en) * | 1998-03-27 | 2005-05-17 | The Trustees Of Princeton University | Method for making multilayer thin-film electronics |
US5906004A (en) * | 1998-04-29 | 1999-05-25 | Motorola, Inc. | Textile fabric with integrated electrically conductive fibers and clothing fabricated thereof |
JP3955156B2 (ja) * | 1998-08-31 | 2007-08-08 | エルジー フィリップス エルシーディー カンパニー リミテッド | 電子機器用構成基板と電子機器 |
DE69919822T2 (de) * | 1998-12-10 | 2005-09-15 | Ultex Corp. | Ultraschallschwingungsschweissverfahren |
JP2001031929A (ja) * | 1999-07-21 | 2001-02-06 | Sony Chem Corp | 接続構造体 |
US6449836B1 (en) * | 1999-07-30 | 2002-09-17 | Denso Corporation | Method for interconnecting printed circuit boards and interconnection structure |
US6347521B1 (en) * | 1999-10-13 | 2002-02-19 | Komatsu Ltd | Temperature control device and method for manufacturing the same |
US6727197B1 (en) | 1999-11-18 | 2004-04-27 | Foster-Miller, Inc. | Wearable transmission device |
US6646364B1 (en) * | 2000-07-11 | 2003-11-11 | Honeywell International Inc. | MEMS actuator with lower power consumption and lower cost simplified fabrication |
US6527162B2 (en) * | 2000-08-04 | 2003-03-04 | Denso Corporation | Connecting method and connecting structure of printed circuit boards |
CA2426110C (en) * | 2000-10-16 | 2010-06-29 | Foster-Miller, Inc. | A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
US20040092186A1 (en) * | 2000-11-17 | 2004-05-13 | Patricia Wilson-Nguyen | Textile electronic connection system |
JP4105409B2 (ja) * | 2001-06-22 | 2008-06-25 | 株式会社ルネサステクノロジ | マルチチップモジュールの製造方法 |
US6852395B2 (en) | 2002-01-08 | 2005-02-08 | North Carolina State University | Methods and systems for selectively connecting and disconnecting conductors in a fabric |
WO2004003273A2 (en) * | 2002-06-28 | 2004-01-08 | North Carolina State University | Fabric and yarn structures for improving signal integrity in fabric based electrical circuits |
WO2004070827A1 (ja) * | 2003-02-05 | 2004-08-19 | Senju Metal Industry Co., Ltd. | 端子間の接続方法及び半導体装置の実装方法 |
US6860620B2 (en) * | 2003-05-09 | 2005-03-01 | Agilent Technologies, Inc. | Light unit having light emitting diodes |
US7559902B2 (en) * | 2003-08-22 | 2009-07-14 | Foster-Miller, Inc. | Physiological monitoring garment |
JP4302607B2 (ja) * | 2004-01-30 | 2009-07-29 | 株式会社デンソー | 半導体装置 |
US7300397B2 (en) * | 2004-07-29 | 2007-11-27 | C2C Cure, Inc. | Endoscope electronics assembly |
US20070299325A1 (en) * | 2004-08-20 | 2007-12-27 | Brian Farrell | Physiological status monitoring system |
TWM269683U (en) * | 2005-01-03 | 2005-07-01 | High Tech Comp Corp | Flexible printed circuit board and reinforcing structure thereof |
KR101084777B1 (ko) | 2005-02-03 | 2011-11-21 | 파나소닉 주식회사 | 플립 칩 실장체와 그 실장 방법 및 범프 형성 방법 |
JP2006294350A (ja) * | 2005-04-07 | 2006-10-26 | Three M Innovative Properties Co | ケーブルハーネス体 |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
KR100824881B1 (ko) * | 2006-11-10 | 2008-04-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
KR100824880B1 (ko) * | 2006-11-10 | 2008-04-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
JP2008130803A (ja) * | 2006-11-21 | 2008-06-05 | Toshiba Matsushita Display Technology Co Ltd | 基板装置および基板 |
KR100833738B1 (ko) | 2006-11-30 | 2008-05-29 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
KR100824902B1 (ko) * | 2006-12-13 | 2008-04-23 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
JP2008153470A (ja) * | 2006-12-18 | 2008-07-03 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
US8035789B2 (en) * | 2007-03-19 | 2011-10-11 | Sony Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
JP4924143B2 (ja) * | 2007-03-28 | 2012-04-25 | マツダ株式会社 | 金属製ワークの接合方法 |
JP5014890B2 (ja) * | 2007-06-20 | 2012-08-29 | パナソニック株式会社 | 電極芯線の接合方法 |
GB0714723D0 (en) | 2007-07-30 | 2007-09-12 | Pilkington Automotive D Gmbh | Improved electrical connector |
BRPI0822649B8 (pt) * | 2008-05-09 | 2022-07-12 | Stora Enso Oyj | Aparelho, método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e chipset do mesmo |
CN104228324B (zh) * | 2008-05-09 | 2017-12-01 | 斯塔诺阿埃索澳吉有限公司 | 在基底上形成导电图案的设备、方法、绝缘基底和芯片组 |
DE102008028300B4 (de) * | 2008-06-13 | 2021-10-07 | Tdk Electronics Ag | Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung |
CH700060A1 (de) * | 2008-12-04 | 2010-06-15 | Forster Rohner Ag | Verfahren zum Anbringen flächiger elektronischer Bauelemente, wie Solarzellen, auf einem flexiblen Flächengebilde. |
US8488271B2 (en) * | 2009-07-06 | 2013-07-16 | Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. | Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device |
CN102118674B (zh) * | 2010-01-05 | 2016-02-10 | 歌尔声学股份有限公司 | 一种mems麦克风及其封装方法 |
US9211085B2 (en) | 2010-05-03 | 2015-12-15 | Foster-Miller, Inc. | Respiration sensing system |
US9028404B2 (en) | 2010-07-28 | 2015-05-12 | Foster-Miller, Inc. | Physiological status monitoring system |
US8585606B2 (en) | 2010-09-23 | 2013-11-19 | QinetiQ North America, Inc. | Physiological status monitoring system |
JP2012233723A (ja) * | 2011-04-28 | 2012-11-29 | Micronics Japan Co Ltd | プローブ装置及びプローブユニット |
WO2014054586A1 (ja) * | 2012-10-02 | 2014-04-10 | 独立行政法人科学技術振興機構 | 信号検出装置および信号検出方法 |
JP6192974B2 (ja) * | 2013-04-23 | 2017-09-06 | 株式会社東芝 | テレビジョン受像機および電子機器 |
WO2016033328A1 (en) | 2014-08-27 | 2016-03-03 | North Carolina State University | Binary encoding of sensors in textile structures |
US10890669B2 (en) * | 2015-01-14 | 2021-01-12 | General Electric Company | Flexible X-ray detector and methods for fabricating the same |
JP6187918B2 (ja) * | 2015-04-23 | 2017-08-30 | パナソニックIpマネジメント株式会社 | 回路部材の接続構造、接続方法および接続材料 |
US10082913B2 (en) | 2015-05-10 | 2018-09-25 | Microsoft Technology Licensing, Llc | Embroidered sensor assembly |
KR102450959B1 (ko) * | 2015-08-31 | 2022-10-04 | 엘지디스플레이 주식회사 | 연성 인쇄 회로 필름 및 그를 이용한 디스플레이 장치 |
KR101751407B1 (ko) * | 2016-02-16 | 2017-07-11 | 단국대학교 산학협력단 | 플래시 메모리의 신뢰성 검증을 위한 아날로그 정보 기반 에뮬레이션 방법 및 그 장치 |
DE112017000189B4 (de) * | 2016-05-13 | 2021-04-29 | Warwick Mills, Inc. | E-Fabric-Gewebe und E-Fabric-Kleidungsstück mit integral verbundenen Leitern und eingebetteten Vorrichtungen |
KR102626385B1 (ko) * | 2016-06-08 | 2024-01-19 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
KR20180074264A (ko) | 2016-12-23 | 2018-07-03 | 엘지디스플레이 주식회사 | 전자 장치 및 이를 포함하는 표시 장치 |
US10688731B2 (en) * | 2018-01-30 | 2020-06-23 | Te Connectivity Corporation | System and method for bonding structural components |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3646670A (en) * | 1968-07-19 | 1972-03-07 | Hitachi Chemical Co Ltd | Method for connecting conductors |
US3740366A (en) * | 1969-04-28 | 1973-06-19 | Rohm & Haas | Pressure sensitive adhesive containing carboxylic acid groups and polyvalent metal |
US3778306A (en) * | 1971-01-04 | 1973-12-11 | Minnesota Mining & Mfg | Tape |
US3762946A (en) * | 1971-10-21 | 1973-10-02 | Minnesota Mining & Mfg | Small particle loaded electrically conductive adhesive tape |
US4098945A (en) * | 1973-07-30 | 1978-07-04 | Minnesota Mining And Manufacturing Company | Soft conductive materials |
JPS5724456Y2 (de) * | 1977-09-09 | 1982-05-27 | ||
CA1132213A (en) * | 1979-04-02 | 1982-09-21 | Matthew Pobog | Printed circuit board connector |
JPS5670529A (en) * | 1979-11-14 | 1981-06-12 | Hitachi Ltd | Liquid crystal display unit |
JPS56138881A (en) | 1980-03-31 | 1981-10-29 | Sony Corp | Electric connecting sheet |
US4513005A (en) | 1981-06-18 | 1985-04-23 | Lilly Industries Limited | SRS-A antagonists |
CA1184622A (en) * | 1981-12-28 | 1985-03-26 | James G. Berg | Insulated connector sheet |
US4546037A (en) * | 1984-09-04 | 1985-10-08 | Minnesota Mining And Manufacturing Company | Flexible tape having stripes of electrically conductive particles for making multiple connections |
US4548862A (en) * | 1984-09-04 | 1985-10-22 | Minnesota Mining And Manufacturing Company | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
JPS61173471A (ja) * | 1985-01-28 | 1986-08-05 | シャープ株式会社 | 熱圧着コネクタ− |
-
1984
- 1984-12-19 AU AU36909/84A patent/AU572615B2/en not_active Expired
- 1984-12-20 CA CA000470624A patent/CA1227579A/en not_active Expired
- 1984-12-27 DE DE8484116388T patent/DE3485085D1/de not_active Expired - Lifetime
- 1984-12-27 EP EP84116388A patent/EP0147856B1/de not_active Expired - Lifetime
-
1987
- 1987-06-22 US US07/061,608 patent/US4735847A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0147856B1 (de) | 1991-09-18 |
EP0147856A2 (de) | 1985-07-10 |
CA1227579A (en) | 1987-09-29 |
AU3690984A (en) | 1985-07-04 |
US4735847A (en) | 1988-04-05 |
AU572615B2 (en) | 1988-05-12 |
EP0147856A3 (en) | 1987-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3485085D1 (de) | Elektrisch leitende klebende folie. | |
DE3483600D1 (de) | Lichtdurchlaessiges leitfaehiges material. | |
GB2152060B (en) | Electrically conductive adhesive composition | |
NL7901700A (nl) | Elektrisch geleidend laminaat. | |
DK164183D0 (da) | Tykfilmlederkompositioner | |
DE3670648D1 (de) | Elektrisch leitfaehige kunstharz-zusammensetzung. | |
IT8322493A0 (it) | Elemento circuitale elettrico. | |
DK405584D0 (da) | Tykfilmleder-kompositioner | |
DE3486221D1 (de) | Aufgedruckte elektroden. | |
DE3574646D1 (de) | Thermoplastisches elektrisch leitendes material. | |
FR2606784B1 (fr) | Composition potentiellement adhesive electriquement conductrice | |
DE3650210D1 (de) | Leitfähige Dickschichtzusammensetzung. | |
KR840007210A (ko) | 감압형 도전성 복합시트 | |
IT1197581B (it) | Nastro adesivo elettricamente conduttore | |
DE3672748D1 (de) | Spannungsmultipliziererschaltung. | |
FI853367L (fi) | Texturerad termoplastfilm. | |
DE3381727D1 (de) | Elektrisch leitfaehiger zusammengesetzter kunststoff. | |
IT8422886A0 (it) | Elemento di batteria. | |
DE3575230D1 (de) | Elektrisch leitfaehiges elastisches material. | |
DE69122176D1 (de) | Elektrisch leitender Film | |
ES295813Y (es) | Disposicion de circuito electrico multicapa. | |
ES517262A0 (es) | Una cinta adhesiva. | |
ATE16061T1 (de) | Gekapseltes elektrisches schaltfeld. | |
IT8026047A0 (it) | Laminato elettricamente conduttivo. | |
JPS57128405A (en) | Conductive film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |