DE3463719D1 - Device for the heat dissipation of printed circuit boards - Google Patents

Device for the heat dissipation of printed circuit boards

Info

Publication number
DE3463719D1
DE3463719D1 DE8484108975T DE3463719T DE3463719D1 DE 3463719 D1 DE3463719 D1 DE 3463719D1 DE 8484108975 T DE8484108975 T DE 8484108975T DE 3463719 T DE3463719 T DE 3463719T DE 3463719 D1 DE3463719 D1 DE 3463719D1
Authority
DE
Germany
Prior art keywords
printed circuit
heat dissipation
circuit boards
boards
dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484108975T
Other languages
German (de)
Inventor
Hans Ohlenburger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bodenseewerk Geratetechnik GmbH
Original Assignee
Bodenseewerk Geratetechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bodenseewerk Geratetechnik GmbH filed Critical Bodenseewerk Geratetechnik GmbH
Priority to DE8484108975T priority Critical patent/DE3463719D1/en
Application granted granted Critical
Publication of DE3463719D1 publication Critical patent/DE3463719D1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE8484108975T 1983-08-30 1984-07-28 Device for the heat dissipation of printed circuit boards Expired DE3463719D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8484108975T DE3463719D1 (en) 1983-08-30 1984-07-28 Device for the heat dissipation of printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833331112 DE3331112A1 (en) 1983-08-30 1983-08-30 DEVICE FOR HEAT EXHAUST FROM PCB
DE8484108975T DE3463719D1 (en) 1983-08-30 1984-07-28 Device for the heat dissipation of printed circuit boards

Publications (1)

Publication Number Publication Date
DE3463719D1 true DE3463719D1 (en) 1987-06-19

Family

ID=6207712

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19833331112 Withdrawn DE3331112A1 (en) 1983-08-30 1983-08-30 DEVICE FOR HEAT EXHAUST FROM PCB
DE8484108975T Expired DE3463719D1 (en) 1983-08-30 1984-07-28 Device for the heat dissipation of printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19833331112 Withdrawn DE3331112A1 (en) 1983-08-30 1983-08-30 DEVICE FOR HEAT EXHAUST FROM PCB

Country Status (3)

Country Link
US (1) US4583149A (en)
EP (1) EP0136454B1 (en)
DE (2) DE3331112A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3536963A1 (en) * 1985-10-17 1987-04-23 Diehl Gmbh & Co ASSEMBLY ARRANGEMENT
DE3813364A1 (en) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech DEVICE FOR HEAT EXHAUSTING COMPONENTS ON A CIRCUIT BOARD
US5329420A (en) * 1990-02-28 1994-07-12 Altoz Frank E Slotted tuning fork thermal interface
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4310446C1 (en) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements
WO1996013048A1 (en) * 1994-10-19 1996-05-02 Philips Electronics N.V. Electric lamp
US5506751A (en) * 1994-10-26 1996-04-09 Chatel; Louis R. Extruded card cage
US6086404A (en) * 1998-07-02 2000-07-11 Advanced Processing Laboratories, Inc. Circuit board card cage with one-piece integral card guide units
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
FR2821497B1 (en) * 2001-02-27 2004-07-16 Bosch Gmbh Robert ELECTRIC DRIVE, PARTICULARLY WINDSCREEN WIPER DRIVE
US7046520B2 (en) * 2003-04-07 2006-05-16 Honeywell International, Inc. Electronic assemblies having supports for circuit boards
DE102008033193A1 (en) 2008-07-15 2010-02-04 Continental Automotive Gmbh Motor control device of a vehicle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243252B (en) * 1965-05-17 1967-06-29 Int Standard Electric Corp Housing for receiving printed circuit boards, which is made of sheet metal parts closed on all sides
US3487267A (en) * 1968-01-02 1969-12-30 Jerrold Electronics Corp Thermally conducting transistor support arms
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
DE2336168B1 (en) * 1973-07-16 1974-10-03 Siemens Ag Horizontal deflection block
DE2744341A1 (en) * 1977-10-01 1979-04-12 Teldix Gmbh Frame holding circuit boards - has sides clamping spaced boards and having two riveted plates to prevent vibration or acceleration damage
FR2413016A1 (en) * 1977-12-26 1979-07-20 Radiotechnique Compelec Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate
DE7740059U1 (en) * 1977-12-29 1980-04-03 Neumann Elektronik Gmbh, 4330 Muelheim Fastening device for the electrically insulated fastening of components that generate considerable heat loss
US4386390A (en) * 1981-01-21 1983-05-31 The Bendix Corporation Vibration adjustable spacer
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
DE8221756U1 (en) * 1982-07-30 1982-11-04 Siemens AG, 1000 Berlin und 8000 München Device for heat dissipation from thermally stressed flat components in communications technology

Also Published As

Publication number Publication date
US4583149A (en) 1986-04-15
DE3331112A1 (en) 1985-03-14
EP0136454A1 (en) 1985-04-10
EP0136454B1 (en) 1987-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee