GB8309899D0 - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
GB8309899D0
GB8309899D0 GB838309899A GB8309899A GB8309899D0 GB 8309899 D0 GB8309899 D0 GB 8309899D0 GB 838309899 A GB838309899 A GB 838309899A GB 8309899 A GB8309899 A GB 8309899A GB 8309899 D0 GB8309899 D0 GB 8309899D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB838309899A
Other versions
GB2129223A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welwyn Electronics Ltd
Original Assignee
Welwyn Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838300247A external-priority patent/GB8300247D0/en
Application filed by Welwyn Electronics Ltd filed Critical Welwyn Electronics Ltd
Priority to GB08309899A priority Critical patent/GB2129223A/en
Priority to GB838311200A priority patent/GB8311200D0/en
Publication of GB8309899D0 publication Critical patent/GB8309899D0/en
Priority to GB8400142A priority patent/GB2136212B/en
Priority to EP84300073A priority patent/EP0116396A3/en
Publication of GB2129223A publication Critical patent/GB2129223A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB08309899A 1982-10-09 1983-04-12 Printed circuit boards Withdrawn GB2129223A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB08309899A GB2129223A (en) 1982-10-09 1983-04-12 Printed circuit boards
GB838311200A GB8311200D0 (en) 1982-10-09 1983-04-25 Printed circuit board
GB8400142A GB2136212B (en) 1983-01-06 1984-01-05 Cooling components on printed circuit boards
EP84300073A EP0116396A3 (en) 1983-01-06 1984-01-05 Electrical assembly

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB8228936 1982-10-09
GB838300247A GB8300247D0 (en) 1983-01-06 1983-01-06 Printed circuit board
GB08309899A GB2129223A (en) 1982-10-09 1983-04-12 Printed circuit boards

Publications (2)

Publication Number Publication Date
GB8309899D0 true GB8309899D0 (en) 1983-05-18
GB2129223A GB2129223A (en) 1984-05-10

Family

ID=27261789

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08309899A Withdrawn GB2129223A (en) 1982-10-09 1983-04-12 Printed circuit boards
GB838311200A Pending GB8311200D0 (en) 1982-10-09 1983-04-25 Printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB838311200A Pending GB8311200D0 (en) 1982-10-09 1983-04-25 Printed circuit board

Country Status (1)

Country Link
GB (2) GB2129223A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008656A (en) * 1984-12-20 1991-04-16 Raytheon Company Flexible cable assembly
CA1237817A (en) * 1984-12-20 1988-06-07 Raytheon Co Flexible cable assembly
IT1215267B (en) * 1985-04-26 1990-01-31 Ates Componenti Elettron APPARATUS AND METHOD FOR THE PERFECTED THERMAL COUPLING OF A SEMICONDUCTOR CONTAINER TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF CONTAINER CONDUCTORS ON MORE THAN ONE SIDE OF THE CONTAINER ON A CIRCUIT BOARD.
DE4015788C2 (en) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Assembly
GB2247782A (en) * 1990-09-05 1992-03-11 Marconi Gec Ltd A circuit board assembly
DE9016732U1 (en) * 1990-12-11 1992-04-09 Robert Bosch Gmbh, 7000 Stuttgart, De
TW258829B (en) * 1994-01-28 1995-10-01 Ibm
JP3347145B2 (en) * 1996-09-26 2002-11-20 サムソン・エレクトロニクス・カンパニー・リミテッド Microwave hybrid integrated circuit
US6078101A (en) * 1996-12-04 2000-06-20 Samsung Electronics Co., Ltd. High-power microwave-frequency hybrid integrated circuit
DE19720167B4 (en) * 1997-05-14 2006-06-22 Siemens Ag Structure for connecting a plurality of remote electrical components to a central unit
DE19806801C2 (en) * 1998-02-18 2001-06-21 Siemens Ag Electrical circuit arrangement
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
CN112738972A (en) * 2019-10-28 2021-04-30 河北百纳信达科技有限公司 Heat sink for circuit module and circuit module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338139B2 (en) * 1973-06-06 1978-10-13
JPS5216665A (en) * 1975-07-28 1977-02-08 Sharp Kk Electronic device
JPS58301Y2 (en) * 1977-10-06 1983-01-06 旭光学工業株式会社 multilayer flexible board
CA1138122A (en) * 1978-10-13 1982-12-21 Yoshifumi Okada Flexible printed circuit wiring board
FR2439478A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS
FR2439438A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull RIBBON CARRYING ELECTRIC SIGNAL PROCESSING DEVICES, MANUFACTURING METHOD THEREOF AND APPLICATION THEREOF TO A SIGNAL PROCESSING ELEMENT
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device

Also Published As

Publication number Publication date
GB2129223A (en) 1984-05-10
GB8311200D0 (en) 1983-06-02

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)