GB2124035B - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB2124035B
GB2124035B GB08220517A GB8220517A GB2124035B GB 2124035 B GB2124035 B GB 2124035B GB 08220517 A GB08220517 A GB 08220517A GB 8220517 A GB8220517 A GB 8220517A GB 2124035 B GB2124035 B GB 2124035B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08220517A
Other versions
GB2124035A (en
Inventor
Refaie Mohamed Mah Abdalla El
Edward Ronald Mcquat
Ian James Wylie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB08220517A priority Critical patent/GB2124035B/en
Publication of GB2124035A publication Critical patent/GB2124035A/en
Application granted granted Critical
Publication of GB2124035B publication Critical patent/GB2124035B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
GB08220517A 1982-07-15 1982-07-15 Printed circuit boards Expired GB2124035B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08220517A GB2124035B (en) 1982-07-15 1982-07-15 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08220517A GB2124035B (en) 1982-07-15 1982-07-15 Printed circuit boards

Publications (2)

Publication Number Publication Date
GB2124035A GB2124035A (en) 1984-02-08
GB2124035B true GB2124035B (en) 1985-07-31

Family

ID=10531690

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08220517A Expired GB2124035B (en) 1982-07-15 1982-07-15 Printed circuit boards

Country Status (1)

Country Link
GB (1) GB2124035B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104981107A (en) * 2014-04-14 2015-10-14 深南电路有限公司 Processing method of circuit board gold finger, and gold finger circuit board
CN104981113A (en) * 2014-04-14 2015-10-14 深南电路有限公司 Processing method of circuit board gold finger, and gold finger circuit board

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149196A (en) * 1984-01-17 1985-08-06 ソニー株式会社 Printed board and method of producing same
IT1201315B (en) * 1985-06-17 1989-01-27 M A S Ind Spa METHOD TO ENSURE THE COOLING OF ELECTRONIC COMPONENTS FIXED ON A MULTILAYER FOR MOLDED AND MULTI-LAYER CIRCUITS REALIZED ACCORDING TO THAT METHOD
JPH0621595A (en) * 1992-07-03 1994-01-28 Cmk Corp Material for printed circuit board
DE766186T1 (en) * 1995-09-27 1997-11-20 Yokogawa Electric Corp Data processor
GB2329073B (en) * 1997-09-03 2002-04-17 Motorola Israel Ltd Circuit board
ATE379958T1 (en) * 2001-07-26 2007-12-15 Siemens Spa Italiana CIRCUIT BOARD AND CORRESPONDING PRODUCTION PROCESS FOR INSTALLING MICROWAVE CHIPS UP TO 80 GHZ
DE20301773U1 (en) * 2003-02-05 2003-04-17 Kostal Leopold Gmbh & Co Kg Electrical equipment
WO2005002302A1 (en) * 2003-06-24 2005-01-06 Bae Systems Plc Flexi-rigid printed circuit board with integral flexible heat sink area
US20110024165A1 (en) 2009-07-31 2011-02-03 Raytheon Company Systems and methods for composite structures with embedded interconnects
US8826640B2 (en) 2010-11-12 2014-09-09 Raytheon Company Flight vehicles including electrically-interconnective support structures and methods for the manufacture thereof
JP2016213375A (en) * 2015-05-12 2016-12-15 日本精工株式会社 Heat dissipation substrate and heat dissipation case for housing the same therein
KR102483624B1 (en) * 2018-01-10 2023-01-02 삼성전기주식회사 Printed circuit board and battery module having the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104981107A (en) * 2014-04-14 2015-10-14 深南电路有限公司 Processing method of circuit board gold finger, and gold finger circuit board
CN104981113A (en) * 2014-04-14 2015-10-14 深南电路有限公司 Processing method of circuit board gold finger, and gold finger circuit board
CN104981113B (en) * 2014-04-14 2017-12-29 深南电路有限公司 The processing method and golden finger circuit board of circuit edge connector
CN104981107B (en) * 2014-04-14 2018-01-26 深南电路有限公司 The processing method and golden finger circuit board of circuit edge connector

Also Published As

Publication number Publication date
GB2124035A (en) 1984-02-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee