DE3228457A1 - Elektrisches bauelement - Google Patents
Elektrisches bauelementInfo
- Publication number
- DE3228457A1 DE3228457A1 DE19823228457 DE3228457A DE3228457A1 DE 3228457 A1 DE3228457 A1 DE 3228457A1 DE 19823228457 DE19823228457 DE 19823228457 DE 3228457 A DE3228457 A DE 3228457A DE 3228457 A1 DE3228457 A1 DE 3228457A1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- electronic component
- welds
- protect
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Casings For Electric Apparatus (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Details Of Resistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Thermistors And Varistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
η. 17 3 S 3
1 .?. 1. 982 Fb/Le
ROBERT 30SCH GMBH, 7000 STUTTGART 1
elektrisches Bauelement
Stand der Technik
Stand der Technik
Die Erfindung betrifft ein elektronisches Bauelement nach
der Gattung des Hauptanspruchs.
In der Patentanmeldung ? 31 25 360 wurde bereits ein
elektronisches Bauelement dieser Art vorgeschlagen, bei dem die an die Anschlußstifte direkt oder über Kabelschuhe
angeschweißten Leitungen aus dem zum Schutz der Schweißstellen
dienenden Gehäus.e durch einen Schlitz herausgeführt
sind. 3ei diesem bereits vorgeschlagenen Bauelement kann aber die Kunststoffmasse beim Eingießen in das zum
Schutz der Schweißstellen dienende Gehäuse aus diesem Gehäuse durch den Schlitz herauslaufen, was fertigungstechnisch
von Nachteil ist.
Vorteile der Erfindung
Das erfindungsgemäße elektronische Bauelement mit; den kennzeichnenden
Merkmalen des Anspruchs 1 hat demgegenüber ien Vorteil, daß die Kunststoffmasse beim Eingießen in das zum
Schutz der Schweißstellen dienende Gehäuse aus diesem Gehäuse nicht herauslaufen kann. Weitere Verteile ergeben 3ica
aus Anspruch 2.
Zeichnung
Ein Ausführungsbeispiel des erfindungsgemäSen elektronischen
Bauelements ist in der Zeichnung dargestellt und in der
nachfolgenden Beschreibung näher erläutert. Ss zeigen:
Figur 1 das elektronische Bauelement mit den Schvei3stellen
und dem zusätzlich vorgesehenen zylinderförmig ausgebildeten
Gehäuse im Schnitt,
Figur 2 dieselbe Anordnung wie in Figur 1, jedoch von oben gesehen.
Beschreibung des Ausführungabeispiels
Das in Figur 1 dargestellte elektronische Bauelement 50 besitzt
ein aus einer Sockelplatte 2 und einer Metallkappe bestehendes metallisches Gehäuse. Die Metallkappe 1 ist auf
die Sockelplatte 2 aufgeschweißt. Im Inneren des Gehäuses
ist ein Halbleiterkörper 3 auf die Sockelpiatte 2 aufgelötet oder aufgeklebt. Zur äußeren Kontaktierung des Bauelements
dienen Anschlußstifte 5» 6, die über Glaseinschmelzungen
durch die Sockelplatte 2 isoliert hindurchgeführt sind. Vom Halbleiterkörper 3 zu den Anschlußstiften
5, β führen Bonddrähte U', h. Zur elektrisch leitenden
Verbindung des elektronischen Bauelements 50 mit anderen
Teilen eines Geräts sind Verbindungsleitungen 11, 12 an
die Anschlußstifte 5, 6 direkt oder über Kabelschuhe angeschweißt.
Zum Schutz der Schweißstellen ist ein zylinderförmig
ausgebildetes metallisches Gehäuse 3 vorgesehen, in welchem die Schweißstellen untergebracht sind. Das
zylinderförmig ausgebildete Gehäuse 3 ist mit einer isolierenden
und korrosionsschutzenden Kunststoffmasse 10
ausgefüllt, die die Schweißstellen umhüllt. Das Gehäuse
ist an die Sockelplatte 2 angeschraubt. Mit ^ sind Befestigungslöcher
in der Sockelplatte 2 bezeichne", iie ;-:r Aufnahme der Schrauben dienen sollen. Mi- "3 und
131 sind Befestigungslöcher im Gehäuse 3 bezeichnet, die
zum Anschluß der gesamten Anordnung in einem 3erät iienen.
Das Gehäuse 3 kann ein Abschnitt eines Strangpre3profils sein.
ErfindungsgemäS ist das zum Schutz der Schweißstellen dienende
zylinderförmig ausgebildete Gehäuse 3 als geschlossener Hing
ausgebildet. Die Verbindungsleitungen 11, 12 stehen von iem
Gehäuse 1, 2 des elektronischen Bauelements 50 ab. Sie sind
aus dem ringförmigen Gehäuse 3 durch die öffnung U herausgeführt,
die dem elektronischen Bauelement 50 abgewandt ist.
Die Kunststoffmasse 10 kann aus Polyurethan bestehen.
Leerseite
Claims (1)
17-1982 Fb/Le
ROBERT BOSCH GMBH, 7OOO STUTTGART 1
Ansprüche
π .1 In einer elektrischen Schaltungsanordnung enthaltenes elektronisches Bauelement (50), das ein Gehäuse (1, 2) und
mindestens zwei aus dem Gehäuse herausgeführte Anschlußstifte
(5, 6) hat, wobei zur elektrisch leitenden Verbindung des elektronischen Bauelements (50) mit anderen
Teilen der Schaltungsanordnung Verbindungsleitungen {11,
12) an die Anschlußstifte (5» 6) direkt angeschweißt sind,
wobei zum Schutz der Schweißstellen ein zylinderförmig
ausgebildetes Gehäuse (8) vorgesehen ist, in dem die 'Schweißstellen
untergebracht sind, und wobei schließlich das zylinderförmig ausgebildete Gehäuse (3) mit einer isolierenden
und korrosionsschützenden Kunststoffmasse (i0) ausgefüllt
ist, die die Schweißstellen umhüllt, insbesondere nach Patentanmeldung
? 31 25 3δθ, dadurch gekennzeichnet, daß das zum
Schutz der Schweißstellen dienende zylinderförmig ausgebildete
Gehäuse (8) als geschlossener Ring ausgebildet ist und daß die an die Anschlußstifte (5, β) des elektronischen
Bauelements (50) direkt oder über Kabelschuhe angeschweißten Verbindungsleitungen (11, 12) von dem Gehäuse (1, 2) des
elektronischen Bauelements (50) abstehen und aus dem zum
Schutz der Schweißstellen dienenden zylinderförmig ausgebildeten
Gehäuse (8) durch die dem elektronischen Bauelement; (50) abgewandte Öffnung (lU) herausgeführt sind.
— ρ —
/ 2./Elektronisches Bauelement nach Anspruch 1, dadurch
gekennzeichnet, daß die Kunststoffmasse (10) aus Polyurethan besteht.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823228457 DE3228457A1 (de) | 1982-07-30 | 1982-07-30 | Elektrisches bauelement |
FR8307946A FR2531269B1 (fr) | 1982-07-30 | 1983-05-11 | Element de construction electrique contenant un element de construction electronique |
US06/504,840 US4571612A (en) | 1982-07-30 | 1983-06-16 | Corrosion-protected electrical circuit component |
JP58134549A JPS5939052A (ja) | 1982-07-30 | 1983-07-25 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823228457 DE3228457A1 (de) | 1982-07-30 | 1982-07-30 | Elektrisches bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3228457A1 true DE3228457A1 (de) | 1984-02-02 |
Family
ID=6169690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823228457 Ceased DE3228457A1 (de) | 1982-07-30 | 1982-07-30 | Elektrisches bauelement |
Country Status (4)
Country | Link |
---|---|
US (1) | US4571612A (de) |
JP (1) | JPS5939052A (de) |
DE (1) | DE3228457A1 (de) |
FR (1) | FR2531269B1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5252856A (en) * | 1990-09-26 | 1993-10-12 | Nec Corporation | Optical semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2064563A1 (de) * | 1970-01-02 | 1971-07-08 | Texas Instruments Inc | Hermetisch abgedichteter Sockel |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271638A (en) * | 1963-11-04 | 1966-09-06 | Emil M Murad | Encased semiconductor with heat conductive and protective insulative encapsulation |
JPS432111Y1 (de) * | 1964-05-23 | 1968-01-29 | ||
DE2305484C3 (de) * | 1973-02-05 | 1978-08-24 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Erregereinrichtung für eine gleichstromerregte Drehstrom-Lichtmaschine |
JPS49135749U (de) * | 1973-03-24 | 1974-11-21 | ||
DE7314657U (de) * | 1973-04-17 | 1973-07-19 | Roederstein Spezialfabrik Fuer Kondensatoren Gmbh | Bauelementetrager |
JPS502506U (de) * | 1973-05-08 | 1975-01-11 | ||
JPS51113464A (en) * | 1975-03-28 | 1976-10-06 | Fujitsu Ltd | Compound electronic component manufacturing system |
US4115838A (en) * | 1976-08-17 | 1978-09-19 | General Time Corporation | Packaging of a semiconductor |
US4249034A (en) * | 1978-11-27 | 1981-02-03 | General Electric Company | Semiconductor package having strengthening and sealing upper chamber |
-
1982
- 1982-07-30 DE DE19823228457 patent/DE3228457A1/de not_active Ceased
-
1983
- 1983-05-11 FR FR8307946A patent/FR2531269B1/fr not_active Expired
- 1983-06-16 US US06/504,840 patent/US4571612A/en not_active Expired - Fee Related
- 1983-07-25 JP JP58134549A patent/JPS5939052A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2064563A1 (de) * | 1970-01-02 | 1971-07-08 | Texas Instruments Inc | Hermetisch abgedichteter Sockel |
Also Published As
Publication number | Publication date |
---|---|
US4571612A (en) | 1986-02-18 |
JPS5939052A (ja) | 1984-03-03 |
FR2531269B1 (fr) | 1986-05-09 |
FR2531269A1 (fr) | 1984-02-03 |
JPH0558261B2 (de) | 1993-08-26 |
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