DE3228457A1 - Elektrisches bauelement - Google Patents

Elektrisches bauelement

Info

Publication number
DE3228457A1
DE3228457A1 DE19823228457 DE3228457A DE3228457A1 DE 3228457 A1 DE3228457 A1 DE 3228457A1 DE 19823228457 DE19823228457 DE 19823228457 DE 3228457 A DE3228457 A DE 3228457A DE 3228457 A1 DE3228457 A1 DE 3228457A1
Authority
DE
Germany
Prior art keywords
housing
electronic component
welds
protect
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19823228457
Other languages
English (en)
Inventor
Manfred Dipl.-Ing. 7141 Schwieberdingen Frister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19823228457 priority Critical patent/DE3228457A1/de
Priority to FR8307946A priority patent/FR2531269B1/fr
Priority to US06/504,840 priority patent/US4571612A/en
Priority to JP58134549A priority patent/JPS5939052A/ja
Publication of DE3228457A1 publication Critical patent/DE3228457A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Thermistors And Varistors (AREA)
  • Coils Or Transformers For Communication (AREA)

Description

η. 17 3 S 3
1 .?. 1. 982 Fb/Le
ROBERT 30SCH GMBH, 7000 STUTTGART 1
elektrisches Bauelement
Stand der Technik
Die Erfindung betrifft ein elektronisches Bauelement nach der Gattung des Hauptanspruchs.
In der Patentanmeldung ? 31 25 360 wurde bereits ein elektronisches Bauelement dieser Art vorgeschlagen, bei dem die an die Anschlußstifte direkt oder über Kabelschuhe angeschweißten Leitungen aus dem zum Schutz der Schweißstellen dienenden Gehäus.e durch einen Schlitz herausgeführt sind. 3ei diesem bereits vorgeschlagenen Bauelement kann aber die Kunststoffmasse beim Eingießen in das zum Schutz der Schweißstellen dienende Gehäuse aus diesem Gehäuse durch den Schlitz herauslaufen, was fertigungstechnisch von Nachteil ist.
Vorteile der Erfindung
Das erfindungsgemäße elektronische Bauelement mit; den kennzeichnenden Merkmalen des Anspruchs 1 hat demgegenüber ien Vorteil, daß die Kunststoffmasse beim Eingießen in das zum Schutz der Schweißstellen dienende Gehäuse aus diesem Gehäuse nicht herauslaufen kann. Weitere Verteile ergeben 3ica aus Anspruch 2.
Zeichnung
Ein Ausführungsbeispiel des erfindungsgemäSen elektronischen Bauelements ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Ss zeigen:
Figur 1 das elektronische Bauelement mit den Schvei3stellen und dem zusätzlich vorgesehenen zylinderförmig ausgebildeten Gehäuse im Schnitt,
Figur 2 dieselbe Anordnung wie in Figur 1, jedoch von oben gesehen.
Beschreibung des Ausführungabeispiels
Das in Figur 1 dargestellte elektronische Bauelement 50 besitzt ein aus einer Sockelplatte 2 und einer Metallkappe bestehendes metallisches Gehäuse. Die Metallkappe 1 ist auf die Sockelplatte 2 aufgeschweißt. Im Inneren des Gehäuses ist ein Halbleiterkörper 3 auf die Sockelpiatte 2 aufgelötet oder aufgeklebt. Zur äußeren Kontaktierung des Bauelements dienen Anschlußstifte 5» 6, die über Glaseinschmelzungen durch die Sockelplatte 2 isoliert hindurchgeführt sind. Vom Halbleiterkörper 3 zu den Anschlußstiften 5, β führen Bonddrähte U', h. Zur elektrisch leitenden Verbindung des elektronischen Bauelements 50 mit anderen Teilen eines Geräts sind Verbindungsleitungen 11, 12 an die Anschlußstifte 5, 6 direkt oder über Kabelschuhe angeschweißt. Zum Schutz der Schweißstellen ist ein zylinderförmig ausgebildetes metallisches Gehäuse 3 vorgesehen, in welchem die Schweißstellen untergebracht sind. Das zylinderförmig ausgebildete Gehäuse 3 ist mit einer isolierenden und korrosionsschutzenden Kunststoffmasse 10 ausgefüllt, die die Schweißstellen umhüllt. Das Gehäuse
ist an die Sockelplatte 2 angeschraubt. Mit ^ sind Befestigungslöcher in der Sockelplatte 2 bezeichne", iie ;-:r Aufnahme der Schrauben dienen sollen. Mi- "3 und 131 sind Befestigungslöcher im Gehäuse 3 bezeichnet, die zum Anschluß der gesamten Anordnung in einem 3erät iienen. Das Gehäuse 3 kann ein Abschnitt eines Strangpre3profils sein.
ErfindungsgemäS ist das zum Schutz der Schweißstellen dienende zylinderförmig ausgebildete Gehäuse 3 als geschlossener Hing ausgebildet. Die Verbindungsleitungen 11, 12 stehen von iem Gehäuse 1, 2 des elektronischen Bauelements 50 ab. Sie sind aus dem ringförmigen Gehäuse 3 durch die öffnung U herausgeführt, die dem elektronischen Bauelement 50 abgewandt ist. Die Kunststoffmasse 10 kann aus Polyurethan bestehen.
Leerseite

Claims (1)

17-1982 Fb/Le
ROBERT BOSCH GMBH, 7OOO STUTTGART 1
Ansprüche
π .1 In einer elektrischen Schaltungsanordnung enthaltenes elektronisches Bauelement (50), das ein Gehäuse (1, 2) und mindestens zwei aus dem Gehäuse herausgeführte Anschlußstifte (5, 6) hat, wobei zur elektrisch leitenden Verbindung des elektronischen Bauelements (50) mit anderen Teilen der Schaltungsanordnung Verbindungsleitungen {11, 12) an die Anschlußstifte (5» 6) direkt angeschweißt sind, wobei zum Schutz der Schweißstellen ein zylinderförmig ausgebildetes Gehäuse (8) vorgesehen ist, in dem die 'Schweißstellen untergebracht sind, und wobei schließlich das zylinderförmig ausgebildete Gehäuse (3) mit einer isolierenden und korrosionsschützenden Kunststoffmasse (i0) ausgefüllt ist, die die Schweißstellen umhüllt, insbesondere nach Patentanmeldung ? 31 25 3δθ, dadurch gekennzeichnet, daß das zum Schutz der Schweißstellen dienende zylinderförmig ausgebildete Gehäuse (8) als geschlossener Ring ausgebildet ist und daß die an die Anschlußstifte (5, β) des elektronischen Bauelements (50) direkt oder über Kabelschuhe angeschweißten Verbindungsleitungen (11, 12) von dem Gehäuse (1, 2) des elektronischen Bauelements (50) abstehen und aus dem zum Schutz der Schweißstellen dienenden zylinderförmig ausgebildeten Gehäuse (8) durch die dem elektronischen Bauelement; (50) abgewandte Öffnung (lU) herausgeführt sind.
— ρ —
/ 2./Elektronisches Bauelement nach Anspruch 1, dadurch gekennzeichnet, daß die Kunststoffmasse (10) aus Polyurethan besteht.
DE19823228457 1982-07-30 1982-07-30 Elektrisches bauelement Ceased DE3228457A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19823228457 DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement
FR8307946A FR2531269B1 (fr) 1982-07-30 1983-05-11 Element de construction electrique contenant un element de construction electronique
US06/504,840 US4571612A (en) 1982-07-30 1983-06-16 Corrosion-protected electrical circuit component
JP58134549A JPS5939052A (ja) 1982-07-30 1983-07-25 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823228457 DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement

Publications (1)

Publication Number Publication Date
DE3228457A1 true DE3228457A1 (de) 1984-02-02

Family

ID=6169690

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823228457 Ceased DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement

Country Status (4)

Country Link
US (1) US4571612A (de)
JP (1) JPS5939052A (de)
DE (1) DE3228457A1 (de)
FR (1) FR2531269B1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271638A (en) * 1963-11-04 1966-09-06 Emil M Murad Encased semiconductor with heat conductive and protective insulative encapsulation
JPS432111Y1 (de) * 1964-05-23 1968-01-29
DE2305484C3 (de) * 1973-02-05 1978-08-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Erregereinrichtung für eine gleichstromerregte Drehstrom-Lichtmaschine
JPS49135749U (de) * 1973-03-24 1974-11-21
DE7314657U (de) * 1973-04-17 1973-07-19 Roederstein Spezialfabrik Fuer Kondensatoren Gmbh Bauelementetrager
JPS502506U (de) * 1973-05-08 1975-01-11
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system
US4115838A (en) * 1976-08-17 1978-09-19 General Time Corporation Packaging of a semiconductor
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Also Published As

Publication number Publication date
US4571612A (en) 1986-02-18
JPS5939052A (ja) 1984-03-03
FR2531269B1 (fr) 1986-05-09
FR2531269A1 (fr) 1984-02-03
JPH0558261B2 (de) 1993-08-26

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