DE3218953A1 - Verfahren und vorrichtung zur ausbildung einer schraegrille in einer halbleitervorrichtung - Google Patents
Verfahren und vorrichtung zur ausbildung einer schraegrille in einer halbleitervorrichtungInfo
- Publication number
- DE3218953A1 DE3218953A1 DE3218953A DE3218953A DE3218953A1 DE 3218953 A1 DE3218953 A1 DE 3218953A1 DE 3218953 A DE3218953 A DE 3218953A DE 3218953 A DE3218953 A DE 3218953A DE 3218953 A1 DE3218953 A1 DE 3218953A1
- Authority
- DE
- Germany
- Prior art keywords
- angle
- forming
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
- Y10T409/303808—Process including infeeding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/304536—Milling including means to infeed work to cutter
- Y10T409/305544—Milling including means to infeed work to cutter with work holder
- Y10T409/305656—Milling including means to infeed work to cutter with work holder including means to support work for rotation during operation
- Y10T409/305712—Milling including means to infeed work to cutter with work holder including means to support work for rotation during operation and including means to infeed cutter toward work axis
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7589381A JPS57189762A (en) | 1981-05-20 | 1981-05-20 | Inclined groove forming method |
JP713882A JPS6016098B2 (ja) | 1982-01-20 | 1982-01-20 | 半導体の溝加工用砥石 |
JP888382A JPS58126056A (ja) | 1982-01-25 | 1982-01-25 | 斜め溝加工方法 |
JP888282A JPS58126055A (ja) | 1982-01-25 | 1982-01-25 | 斜め溝加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3218953A1 true DE3218953A1 (de) | 1983-01-05 |
DE3218953C2 DE3218953C2 (de) | 1986-05-15 |
Family
ID=27454647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3218953A Expired DE3218953C2 (de) | 1981-05-20 | 1982-05-19 | Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung |
Country Status (3)
Country | Link |
---|---|
US (1) | US4517769A (de) |
DE (1) | DE3218953C2 (de) |
GB (1) | GB2098893B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822757A (en) * | 1987-11-10 | 1989-04-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
GB8728879D0 (en) * | 1987-12-10 | 1988-01-27 | Westinghouse Brake & Signal | Shaping silicon semiconductor wafers |
US5616071A (en) * | 1994-05-06 | 1997-04-01 | Herrmann; Heinz | Bevel grinder |
JP4472316B2 (ja) * | 2003-11-28 | 2010-06-02 | 日東電工株式会社 | 粘着テープ切断方法及び粘着テープ切断装置 |
US20070298687A1 (en) * | 2006-06-22 | 2007-12-27 | 3M Innovative Properties Company | Apparatus and method for modifying an edge |
JP2011108746A (ja) * | 2009-11-13 | 2011-06-02 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP4732549B1 (ja) * | 2010-04-19 | 2011-07-27 | ヤマザキマザック株式会社 | 切削加工方法及び切削加工装置 |
JP6667100B2 (ja) * | 2015-12-14 | 2020-03-18 | 株式会社ジェイテクト | ツルア、これを備えたツルーイング装置、研削装置及びツルーイング方法 |
RU2710258C1 (ru) * | 2019-05-29 | 2019-12-25 | Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) | Устройство для шлифования пазов дисков газотурбинных двигателей |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH298992A (de) * | 1950-08-17 | 1954-05-31 | Josef Hjelmblad Karl Wilhelm | Verfahren zum Schleifen von spiralförmigen Nuten. |
GB1237414A (en) * | 1968-04-11 | 1971-06-30 | Tokyo Shibaura Electric Co | A semiconductor device and a method of manufacturing the same |
GB1491705A (en) * | 1974-12-20 | 1977-11-16 | Texas Instruments Ltd | Semiconductor junctions |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1665954A (en) * | 1923-08-08 | 1928-04-10 | Fox Tom | Harrow-disk sharpener |
US2203788A (en) * | 1937-04-01 | 1940-06-11 | Clayton L Jenks | Knife sharpening device |
US2197309A (en) * | 1938-09-07 | 1940-04-16 | Hyland A Lackey | Valve reseater |
US2813379A (en) * | 1956-05-17 | 1957-11-19 | Norton Co | Grinding machine |
US2810238A (en) * | 1956-12-04 | 1957-10-22 | Goodrich Co B F | Tire sidewall finishing apparatus |
US3172243A (en) * | 1962-12-13 | 1965-03-09 | Cooper Tire & Rubber Co | Method for grinding white sidewall tires |
US3137976A (en) * | 1962-12-21 | 1964-06-23 | Goodrich Co B F | Tire sidewall grinder and cleaner machine |
US3698138A (en) * | 1969-08-13 | 1972-10-17 | Toyoda Machine Works Ltd | Grinding machine with adaptive control system |
US3691707A (en) * | 1969-11-12 | 1972-09-19 | Sola Basic Ind | Semiconductor material cutting apparatus and method of making the same |
US3839942A (en) * | 1972-01-07 | 1974-10-08 | Gen Motors Corp | Method for simultaneously milling grooves in opposite sides of a workpiece |
US4029531A (en) * | 1976-03-29 | 1977-06-14 | Rca Corporation | Method of forming grooves in the [011] crystalline direction |
-
1982
- 1982-05-11 US US06/377,008 patent/US4517769A/en not_active Expired - Lifetime
- 1982-05-17 GB GB8214280A patent/GB2098893B/en not_active Expired
- 1982-05-19 DE DE3218953A patent/DE3218953C2/de not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH298992A (de) * | 1950-08-17 | 1954-05-31 | Josef Hjelmblad Karl Wilhelm | Verfahren zum Schleifen von spiralförmigen Nuten. |
GB1237414A (en) * | 1968-04-11 | 1971-06-30 | Tokyo Shibaura Electric Co | A semiconductor device and a method of manufacturing the same |
GB1491705A (en) * | 1974-12-20 | 1977-11-16 | Texas Instruments Ltd | Semiconductor junctions |
Also Published As
Publication number | Publication date |
---|---|
GB2098893A (en) | 1982-12-01 |
GB2098893B (en) | 1984-10-24 |
US4517769A (en) | 1985-05-21 |
DE3218953C2 (de) | 1986-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
|
8339 | Ceased/non-payment of the annual fee |