DE19980206T1 - Wärmebeständige Isolationsschicht, Grundplatte für eine Leiterplatte unter Verwendung dieser und Verfahren zur Herstellung der Leiterplatte - Google Patents

Wärmebeständige Isolationsschicht, Grundplatte für eine Leiterplatte unter Verwendung dieser und Verfahren zur Herstellung der Leiterplatte

Info

Publication number
DE19980206T1
DE19980206T1 DE1999180206 DE19980206T DE19980206T1 DE 19980206 T1 DE19980206 T1 DE 19980206T1 DE 1999180206 DE1999180206 DE 1999180206 DE 19980206 T DE19980206 T DE 19980206T DE 19980206 T1 DE19980206 T1 DE 19980206T1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
manufacturing
methods
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1999180206
Other languages
English (en)
Other versions
DE19980206B4 (de
Inventor
Kouichirou Taniguchi
Jun Takagi
Hideo Yamano
Shingetsu Yamada
Kouji Kondo
Kaoru Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Plastics Inc
Denso Corp
Original Assignee
Mitsubishi Plastics Inc
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc, Denso Corp filed Critical Mitsubishi Plastics Inc
Publication of DE19980206T1 publication Critical patent/DE19980206T1/de
Application granted granted Critical
Publication of DE19980206B4 publication Critical patent/DE19980206B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE19980206T 1998-01-21 1999-01-20 Grundplatte für eine Leiterplatte unter Verwendung einer wärmebeständigen Isolationsschicht, deren Herstellverfahren und Verfahren zur Herstellung der Leiterplatte Expired - Lifetime DE19980206B4 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP10/9780 1998-01-21
JP978098 1998-01-21
JP10/139273 1998-05-21
JP13927398 1998-05-21
JP10/359161 1998-12-17
JP35916198A JP3355142B2 (ja) 1998-01-21 1998-12-17 耐熱性積層体用フィルムとこれを用いたプリント配線基板用素板および基板の製造方法
PCT/JP1999/000176 WO1999037704A1 (fr) 1998-01-21 1999-01-20 Film isolant resistant a la chaleur, support vierge pour carte imprimee comprenant le film et procede de production du support

Publications (2)

Publication Number Publication Date
DE19980206T1 true DE19980206T1 (de) 2000-04-27
DE19980206B4 DE19980206B4 (de) 2010-11-11

Family

ID=27278637

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980206T Expired - Lifetime DE19980206B4 (de) 1998-01-21 1999-01-20 Grundplatte für eine Leiterplatte unter Verwendung einer wärmebeständigen Isolationsschicht, deren Herstellverfahren und Verfahren zur Herstellung der Leiterplatte

Country Status (4)

Country Link
US (1) US6228467B1 (de)
JP (1) JP3355142B2 (de)
DE (1) DE19980206B4 (de)
WO (1) WO1999037704A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2467004A3 (de) * 2000-12-14 2013-07-17 Denso Corporation Herstellungsverfahren für mehrschichtiges Substrat und mit diesem Verfahren hergestelltes mehrschichtiges Substrat

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JP3585793B2 (ja) * 1999-11-09 2004-11-04 富士通株式会社 両面薄膜配線基板の製造方法
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JP4201965B2 (ja) 2000-08-10 2008-12-24 三菱樹脂株式会社 耐熱性樹脂組成物及びこれよりなる耐熱性フィルムまたはシート並びにこれを基材とする積層板
JP4073631B2 (ja) * 2001-01-22 2008-04-09 三菱樹脂株式会社 ポリアリールケトン系樹脂フィルム及びそれを用いてなる金属積層体
JP2002271028A (ja) * 2001-03-13 2002-09-20 Denso Corp コイル内蔵多層基板及びその製造方法並びに積層コイルの製造方法
JP3840921B2 (ja) * 2001-06-13 2006-11-01 株式会社デンソー プリント基板のおよびその製造方法
JP4605950B2 (ja) * 2001-08-17 2011-01-05 三菱樹脂株式会社 ポリイミド系積層フィルム及びそれを用いてなる金属積層体並びに金属積層体の製造方法
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JP4401070B2 (ja) 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
JP3969192B2 (ja) * 2002-05-30 2007-09-05 株式会社デンソー 多層配線基板の製造方法
JP4192554B2 (ja) * 2002-10-25 2008-12-10 株式会社デンソー 多層回路基板の製造方法
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JP4029759B2 (ja) * 2003-04-04 2008-01-09 株式会社デンソー 多層回路基板およびその製造方法
JP4559163B2 (ja) 2004-08-31 2010-10-06 ルネサスエレクトロニクス株式会社 半導体装置用パッケージ基板およびその製造方法と半導体装置
JP2007053212A (ja) * 2005-08-17 2007-03-01 Denso Corp 回路基板の製造方法
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JP4806279B2 (ja) * 2006-03-17 2011-11-02 三菱樹脂株式会社 ガラスクロス含有絶縁基材
JP2006249443A (ja) * 2006-05-19 2006-09-21 Mitsubishi Plastics Ind Ltd ポリアリールケトン系樹脂フィルム
US20080274360A1 (en) * 2007-05-04 2008-11-06 General Electric Company Polyaryl ether ketone - polycarbonate copolymer blends
JP5170874B2 (ja) * 2007-11-21 2013-03-27 古河電気工業株式会社 多層プリント基板およびその製造方法
JP5170873B2 (ja) * 2007-11-21 2013-03-27 古河電気工業株式会社 多層プリント基板およびその製造方法
JP5436774B2 (ja) 2007-12-25 2014-03-05 古河電気工業株式会社 多層プリント基板およびその製造方法
JP5227584B2 (ja) * 2007-12-25 2013-07-03 古河電気工業株式会社 多層プリント基板およびその製造方法
US8912272B2 (en) 2008-12-19 2014-12-16 Sabic Innovative Plastics Ip B.V. Moisture resistant polyimide compositions
JP2010275404A (ja) * 2009-05-28 2010-12-09 Mitsubishi Plastics Inc ガラスクロス含有白色フィルム、金属積層体及びｌｅｄ搭載用基板
JP5607378B2 (ja) * 2010-01-25 2014-10-15 帝人株式会社 二軸延伸フィルム
JP5359940B2 (ja) * 2010-03-10 2013-12-04 株式会社デンソー 多層回路基板の製造方法
TWI652694B (zh) * 2014-01-17 2019-03-01 日商納美仕有限公司 導電性糊及使用該導電性糊製造半導體裝置之方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2467004A3 (de) * 2000-12-14 2013-07-17 Denso Corporation Herstellungsverfahren für mehrschichtiges Substrat und mit diesem Verfahren hergestelltes mehrschichtiges Substrat

Also Published As

Publication number Publication date
DE19980206B4 (de) 2010-11-11
US6228467B1 (en) 2001-05-08
JP2000038464A (ja) 2000-02-08
JP3355142B2 (ja) 2002-12-09
WO1999037704A1 (fr) 1999-07-29

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