DE4010244A1 - Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallised - Google Patents
Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallisedInfo
- Publication number
- DE4010244A1 DE4010244A1 DE19904010244 DE4010244A DE4010244A1 DE 4010244 A1 DE4010244 A1 DE 4010244A1 DE 19904010244 DE19904010244 DE 19904010244 DE 4010244 A DE4010244 A DE 4010244A DE 4010244 A1 DE4010244 A1 DE 4010244A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- conductive lacquer
- printed circuit
- laser
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
Description
Die Erfindung betrifft ein Verfahren zum Herstellen von Leiterbilder auf Leiterplatten, insbesondere auf drei dimensionalen (3D) Leiterplatten, wobei das Leiterbild mittels eines Lasers auf der Leiterplatte heraus gearbeitet wird.The invention relates to a method for producing Circuit diagrams on circuit boards, especially on three dimensional (3D) circuit boards, the circuit diagram using a laser on the circuit board is worked.
Die Fertigung von Leiterplatten geht heute dahin, daß nicht mehr nur plane, in diesem Sinne zweidimensionale Leiterplatten hergestellt werden, sondern daß zum Zwecke der Platzeinsparung Leiterbahnen auch auf drei dimensionalen Unterlagen aufgebracht werden. Beliebige, beispielsweise in Spritzgießtechnik geformte drei dimensionale Gebilde können nicht nur metallisiert, sondern auch mittels Laser bezüglich dreidimensional verlaufender Leiterbahnen strukturiert werden. The production of printed circuit boards goes today that no longer just plan, in this sense two-dimensional Printed circuit boards are made, but that for Purposes of space saving conductor tracks also on three dimensional documents are applied. Any, for example three molded using injection molding technology dimensional structures can not only be metallized, but also with a laser in terms of three dimensions running conductor tracks are structured.
Das Ergebnis sind elektrische und elektronische Schaltungen, die nahezu ohne mechanische Zusatzbauteile und Befestigungselemente auskommen und alle möglichen Formen zulassen. Beispielsweise kann daran gedacht werden, das Gehäuse einer elektronischen Schreibmaschine nicht mehr mit entsprechenden Leiter platten zu bestücken, sondern die Leiterplatten selbst auf das Innere des Gehäuses aufzubringen. Der denkbare Bereich dieser Technik ist unbegrenzt.The result is electrical and electronic Circuits with almost no additional mechanical components and fasteners get along and all sorts Allow shapes. For example, think of it be the housing of an electronic Typewriter no longer with appropriate ladder boards, but the circuit boards themselves to apply to the inside of the housing. The conceivable The scope of this technique is unlimited.
Aus der Zeitschrift "Productronic" 12/88, Dr. Alfred Hüthig Verlags GmbH, Heidelberg, wird in einem Artikel "Schaltungen aus einem Guß" ein Herstellungsverfahren für derartige dreidimensionale Leiterplatten beschrieben. Nach diesem Verfahren wird in einem ersten Schritt die Leiterplatte durch Spritzgießen herge stellt. Dananch erfolgt eine Metallisierung der Leiterplatte mit chemischem Kupfer in einer Schichtstärke von 0,2 µm. Auf dieses chemische Kupfer wird galvanisches Kupfer in einer Schichtstärke von 1,3 µm aufmetallisiert. Nunmehr erfolgt eine Lackierung der gesamten Leiterplatte und danach die Erstellung des Leiterbildes durch Verdampfen des Lackes mittels Nd.YAG-Laser. Hierdurch wird das entsprechende Leiter bild freigelegt, so daß nunmehr die freigelegten Bahnen mit galvanischem Kupfer in einer Schichtstärke von etwa 35 µm metallisiert werden können. Anschließend wird eine Oberflächenbehandlung z. B. mit Zinn-Blei, ein Lack entfernen und ein Differenzätzen durchgeführt. From the magazine "Productronic" 12/88, Dr. Alfred Hüthig Verlags GmbH, Heidelberg, is published in an article "Integrated circuits" is a manufacturing process for such three-dimensional circuit boards described. After this procedure, in a first Step the circuit board by injection molding poses. This is followed by a metallization of the PCB with chemical copper in one Layer thickness of 0.2 µm. On this chemical copper becomes galvanic copper in a layer thickness of 1.3 µm metallized. Painting is now carried out the entire circuit board and then the creation of the Conductor pattern by evaporating the paint by means of Nd.YAG laser. This will become the appropriate leader picture exposed, so that now the exposed tracks with galvanic copper in a layer thickness of about 35 µm can be metallized. Then one Surface treatment e.g. B. with tin-lead, a paint remove and carry out a differential etching.
Dieses Verfahren, welches neun Arbeitsschritte bein haltet, ist sehr aufwendig und bringt relativ unscharfe Leiterbahnkonturen, da das Verdampfen des Lackes mittels des Lasers keine gute Grenzgebung erlaubt.This process, which involves nine steps holds, is very complex and brings relatively blurred Conductor contours because the paint evaporates using the laser does not allow good boundaries.
Der Erfinder hat sich zum Ziel gesetzt, ein Verfahren der oben genannten Art zu entwickeln, mittels welchem wesentlich einfacher und genauer die entsprechenden Leiterbilder hergestellt werden können.The inventor has set the goal of a method of the type mentioned above, by means of which the corresponding much easier and more precise Circuit diagrams can be produced.
Zur Lösung dieser Aufgabe führt, daß auf die Leiter platte ein Leitlack aufgetragen, sodann aus dem Leitlack das Leiterbild mit Hilfe des Lasers heraus gearbeitet und dann das so erzeugte Leiterbild metallisiert wird.To solve this problem, that leads to the ladder plate applied a conductive varnish, then from the Conduct the varnish using the laser worked and then the resulting conductor pattern is metallized.
Durch die Verwendung eines Leitlackes werden drei Stufen aus dem Verfahrensablauf nach dem Stand der Technik eingespart, nämlich die Aufbringung von Kupfer auf chemischem und galvanischem Weg sowie die Lackierung der gesamten Leiterplatte. Ein entspre chender Leitlack wird beispielsweise in der DE-OS 35 29 302.0 beschrieben. Dieser Leitlack hat den Vorteil, daß er in allen möglichen Verfahren auf die Leiterplatte aufgebracht werden kann. Gedacht ist einmal an ein Tauchen oder Spritzen der Leiterplatte, zum anderern aber auch vor allem an ein Siebdrucken oder auch an ein Aufdrucken im Tampondruck. Vor allem die letzteren Druckverfahren ermöglichen ein Aufbringen des Leit lackes nicht auf der gesamten Leiterplattenfläche, sondern bereits in vorher ausgewählten Konturen, in denen später die Leiterbilder erzeugt werden sollen. Dies bringt ebenfalls eine erhebliche Einsparung sowohl an Zeit wie auch an Kosten mit sich. By using a conductive varnish, three Stages from the process according to the state of the Technology saved, namely the application of copper by chemical and galvanic means as well as the Painting of the entire circuit board. A correspond The conductive varnish is described, for example, in DE-OS 35 29 302.0 described. This conductive varnish has the advantage that he in all possible procedures on the circuit board can be applied. One is thought of one Dip or splash the circuit board to change but also especially on screen printing or on a Pad printing. Especially the latter Printing processes enable the guide to be applied lacks on the entire printed circuit board area, but already in previously selected contours, in which will later be used to generate the conductor diagrams. This also brings significant savings both in terms of time and costs.
Als Leitlack wird bevorzugt ein Zweikomponenten-Lack verwendet, wobei dieser Lack entsprechende Metall partikel beinhaltet. Auch hier sind eine Vielzahl von Möglichkeiten denkbar, bevorzugt wird jedoch, daß der Leitlack Nickelpulver enthält. Bekanntlich weist Nickelpulver in der Regel eine schuppen- bzw. plättchenförmige Kontur auf, wobei sich die Schuppen innerhalb der Schicht des Leitlackes legen und so eine gute gegenseitige Kontaktierung bewirken. Ferner wird relativ wenig Nickelpulver benötigt, wobei mit 2-5% auszukommen ist. Auch dies resultiert wiederum aus der schuppen- bzw. plättchenförmigen Ausbildung des Nickel pulvers, wohingegen beispielsweise bei der Verwendung von Kupfer oder Eisen mit einem sehr viel höheren Bestandteil gearbeitet werden muß, da die kugelförmige Struktur des Eisenpulvers im Verhältnis zur Oberfläche nur geringere Möglichkeiten der Kontaktierung zuläßt.A two-component lacquer is preferred as the conductive lacquer used, this paint corresponding metal contains particles. Again, there are a variety of Possibilities conceivable, but it is preferred that the Contains conductive powder nickel powder. As is well known Nickel powder usually a dandruff or platelet-shaped contour, with the scales lay within the layer of the conductive varnish and so one bring about good mutual contact. Furthermore, relatively little nickel powder required, with 2-5% is to get by. This also results from the scale-like or platelet-shaped formation of nickel powder, whereas, for example, when used of copper or iron with a much higher one Part must be worked because the spherical Structure of the iron powder in relation to the surface only allows fewer possibilities of contacting.
Ferner resultiert aus der schuppen- bzw. plättchen förmigen Struktur des Nickelpulvers der Vorteil, daß die Schichtdicke relativ gering gehalten werden kann, ebenfalls im Gegensatz zu der körnigen bzw. kugeligen Struktur von Eisen- bzw. Kupferpulver.It also results from the flake or platelet shaped structure of nickel powder the advantage that the layer thickness can be kept relatively small, also in contrast to the granular or spherical Structure of iron or copper powder.
Gemäß dem vorliegenden Verfahren wird nun das Leiterbild mittels eines Lasers herausgearbeitet, wobei hier auch ein Nd.YAG-Laser verwendet werden kann. Jedoch wird nicht der Leitlack verdampft, sondern durch den Laser werden die Bereiche außerhalb des gewünschten Leiterbahnverlaufes entfernt. According to the present method, this is now Conductor worked out by means of a laser, whereby a Nd.YAG laser can also be used here. However, the conductive varnish is not evaporated, but by The laser will move the areas outside of the desired area Trace removed.
Die Strukturen der Leiterbahnen bzw. des Leitlackes verbleiben nun auf der Leiterplatte, während der übrige Leitlack entfernt wird. In der Praxis hat sich herausgestellt, daß so erzeugte Leiterbahnen sehr scharf konturiert sind, so daß mit dem Verfahren sehr genau gearbeitet werden kann und auch sehr eng beieinanderliegende Leiterbahnen erzeugt werden können.The structures of the conductor tracks or the conductive varnish now remain on the circuit board while the rest Conductive varnish is removed. In practice it has emphasized that conductor tracks produced in this way are sharply contoured so that with the method very can be worked precisely and also very closely contiguous interconnects can be generated.
Zur Steuerung des Lasers bietet sich das bekannte CAD-Verfahren an, jedoch soll hierauf der Erfindungsgedanke nicht beschränkt sein.The well-known is available for controlling the laser CAD process, but the The inventive idea should not be limited.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904010244 DE4010244A1 (en) | 1990-03-30 | 1990-03-30 | Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallised |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904010244 DE4010244A1 (en) | 1990-03-30 | 1990-03-30 | Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallised |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4010244A1 true DE4010244A1 (en) | 1991-10-02 |
Family
ID=6403414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19904010244 Withdrawn DE4010244A1 (en) | 1990-03-30 | 1990-03-30 | Three dimensional circuit board mfr. - using laser machining to provide circuit pattern in conductive lacquer layer subsequently metallised |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE4010244A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0727925A1 (en) * | 1995-02-14 | 1996-08-21 | Lpkf Cad/Cam Systeme Gmbh | Process for structured metallizing of the surface of substrates |
DE19535068A1 (en) * | 1995-09-21 | 1997-03-27 | Lpkf Cad Cam Systeme Gmbh | Coating for the structured generation of conductor tracks on the surface of electrically insulating substrates |
WO2003037049A1 (en) * | 2001-10-22 | 2003-05-01 | Invint Limited | Circuit formation by laser ablation of ink |
EP1439743A3 (en) * | 2003-01-17 | 2006-05-03 | Ticona GmbH | Process for applying conductive tracks on the surface of plastic moulded parts and the obtained moulded parts |
FR2893478A1 (en) * | 2005-11-14 | 2007-05-18 | Eads Space Transp Sas Soc Par | THREE-DIMENSIONAL NON-DEVELOPABLE SURFACE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR. |
CN102612271A (en) * | 2012-04-09 | 2012-07-25 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
DE102018101156A1 (en) * | 2018-01-19 | 2019-07-25 | CURO GmbH | Fracture detection by means of RFID |
-
1990
- 1990-03-30 DE DE19904010244 patent/DE4010244A1/en not_active Withdrawn
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0727925A1 (en) * | 1995-02-14 | 1996-08-21 | Lpkf Cad/Cam Systeme Gmbh | Process for structured metallizing of the surface of substrates |
DE19535068A1 (en) * | 1995-09-21 | 1997-03-27 | Lpkf Cad Cam Systeme Gmbh | Coating for the structured generation of conductor tracks on the surface of electrically insulating substrates |
WO2003037049A1 (en) * | 2001-10-22 | 2003-05-01 | Invint Limited | Circuit formation by laser ablation of ink |
EP1439743A3 (en) * | 2003-01-17 | 2006-05-03 | Ticona GmbH | Process for applying conductive tracks on the surface of plastic moulded parts and the obtained moulded parts |
FR2893478A1 (en) * | 2005-11-14 | 2007-05-18 | Eads Space Transp Sas Soc Par | THREE-DIMENSIONAL NON-DEVELOPABLE SURFACE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR. |
WO2007057528A1 (en) * | 2005-11-14 | 2007-05-24 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
US20080272983A1 (en) * | 2005-11-14 | 2008-11-06 | Astrium Sas | Method for Producing a Non-Developable Surface Printed Circuit and the Thus Obtained Printed Circuit |
US8481858B2 (en) | 2005-11-14 | 2013-07-09 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
CN102612271A (en) * | 2012-04-09 | 2012-07-25 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
CN102612271B (en) * | 2012-04-09 | 2015-06-03 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
DE102018101156A1 (en) * | 2018-01-19 | 2019-07-25 | CURO GmbH | Fracture detection by means of RFID |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |