DE1496892A1 - Device for the production of galvanic deposits on supporting bodies, e.g. Gravure cylinder - Google Patents
Device for the production of galvanic deposits on supporting bodies, e.g. Gravure cylinderInfo
- Publication number
- DE1496892A1 DE1496892A1 DE19631496892 DE1496892A DE1496892A1 DE 1496892 A1 DE1496892 A1 DE 1496892A1 DE 19631496892 DE19631496892 DE 19631496892 DE 1496892 A DE1496892 A DE 1496892A DE 1496892 A1 DE1496892 A1 DE 1496892A1
- Authority
- DE
- Germany
- Prior art keywords
- electrolyte
- anode plates
- anode
- container
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/02—Engraving; Heads therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Poteniui iPoteniui i
NürnbergNuremberg
©•«»•nberger StraSf 97/r
T»l#foo© • «» • nberger StraSf 97 / r
T »l # foo
Dr. E*piDr. E * pi
Rudolf Kartinv Allschwil (Schweiz)Rudolf Kartin v Allschwil (Switzerland)
Einrichtung «ar Herstellung galvanischer Niederschläge auf Unterlagkörper, wie z.Bo Tiefdruck-ZylinderEstablishment "ar producing galvanic precipitation on blinding body, such as o gravure cylinder
Die vorliegende Erfindung betrifft eine Einrichtung zur Herstellung galvanischer Niederschläge auf Unterlagkörper, wie z,B, Tief druck·™ Zylinder oder mit einem galvanischen üeberzug zu versehene Gegenstände, The present invention relates to a device for producing galvanic deposits on base bodies, such as, for example, gravure · ™ cylinders or objects to be provided with a galvanic coating,
Diese Einrichtung umfasst einen Behälter5 der eine das Elektrolytbad enthaltende Hauptkammer und mindestens einer dieser zugeordneten Ueber lauf kammer aufweist, wobei der al« Kathode wirkende ünterlagkörper im Elektrolytbad teilweise eingetaucht ist, ferner eine ebenfalls in das Elektrolytbad eingetauchte Anodenplatten-Tragvorrichtungs deren Anodenplatten sich unterhalb des ünterlagkörpers befinden*This device comprises a container 5 which has a main chamber containing the electrolyte bath and at least one overflow chamber assigned to it, the support body acting as a cathode being partially immersed in the electrolyte bath, and an anode plate support device also immersed in the electrolyte bath, the anode plates of which are below the underlay bodies are located *
909815/0834909815/0834
Λ Η96892 Λ Η96892
t ι t ι
Gemäse der Erfindung kennzeichnet eich diese Einrichtung durch eine Umwälz- und Filtruervorrlöhtung, die dazu bestimmt ist,, denAccording to the invention, this characterizes this Set-up by means of a circulation and filter pre-installation, which is intended, the
Kammern des Behälters abzuführen, um ihn dann* im geschlossenen Kreislauf und nachdem er die Filter der Vorrichtung durchflossen hat, mittels oberhalb der Anodenplatten angeordneten, parallel zu denselben verlaufenden Düsenrohren wieder der Hauptkammer zuzuführenοChambers of the container to drain it then * in a closed circuit and after having the filter of the device has flowed through, by means of nozzle pipes arranged above the anode plates and running parallel to the same to be fed back to the main chamber ο
Eine vorteilhafte Aueführungsform dieser Einrichtungv bei der die Anodenplatten-Tragvorrichtung mit ihrem Stegteil nach unten gekehrte Trägbügel aufweist % auf welchen aie Anodenplatten abgestützt sind, kennzeichnet sich dadurch, dass die Anodenplatten in zueinander parallelen Schräglagen auf den Tragbügeln abgestützt und unter gleichen leigungewinkeln gegen die Düsenröhre hin geneigt sind?Are an advantageous Aueführungsform this Einrichtungv wherein the anode plate carrying device with its web portion by swept down Trägbügel having% to which aie anode plates supported, is characterized in that the anode plates in mutually parallel inclined positions supported on the support brackets and under the same leigungewinkeln against the nozzle tube towards are inclined?
Dadurch, dass die Anodenplatten in dieser Aus* führungsform schräg angeordnet sind, wirken beide Flachseiten derselben ale Anodenflächen, ia Gegensatz su den bis jetzt bekannten Ausführungen» bei welchen die Anodenplatten flach auf den Tragbügeln aufliegen und nur ihre der Kathode zugekehrte Fläche wirksam 1st, Bei der erfindungsgemäeeen AusfUhrungsform ist somit die totale wirksame Anodenfläche stark vergrössert Aueserdem wird der Elektrolyt veranlasst, zwischen die Anodenplatten hindurch zu zirkulieren, wodurch die Wirksamkeit der Einrichtung weiter erhöht wird.Due to the fact that the anode plates in this * guide form are arranged at an angle, both flat sides act the same all anode surfaces, in general opposite to see below now known versions »in which the anode plates lie flat on the support brackets and only theirs the cathode facing surface is effective, with the inventive The embodiment is thus the total effective anode area greatly enlarged In addition, the electrolyte is induced to circulate between the anode plates, thereby further increasing the effectiveness of the device.
909815 AQ 834 BAD909815 AQ 834 BAD
η U96892 - \ " .3 η U96892 - \ " .3
Auf der belllegenden Zeichnung sind zwei Aus« ftthrungsbelspiele des Erflndungsgegenstandes veransohaulicht. On the barking drawing are two Aus " Guide games of the subject of the invention are illustrated.
Pig. 1 let ein senkrechter Querschnitt durch die Elnrlohtung naoh der ereten AusfUhrungsform, undPig. 1 let a vertical cross section through the Elnrlohtung near the first embodiment, and
Flg. 2 let eine Draufeicht auf die Elnrlohtung naoh der zweiten AusfUhrungaforai.Flg. Let us give you a top-down on the elbow near the second execution aforai.
Die Einrichtung nach Pig. 1 hat einen Behälter a, der eine da· Elektrolytbad enthaltende Hauptkammer al undThe Pig facility. 1 has a container a which has a main chamber a1 and a main chamber containing the electrolyte bath
zwei auf entgegengeeetzten Seiten derselben vorgesehene Ueberlaufkammern a2 und a? aufweist, die unmittelbar Über dem Boden derselben mittels eines In Flg. 1 nlaht ersichtlichen Rohres mit'einander verbunden sind. In das Elektrolyt· bad teilweise eingetaucht, 1st der als rotierender« in den beiden Stirnwandteilen der Hauptkamroer gelagerter Tiefdruckzylinder ausgebildete Unterlagkörper b, auf dem der galvanische Niederschlag gebildet werden soll. Der Zylinder b wirkt dabei wie Üblich als Kathode. Unterhalb dieses Zylinders sind längliche Anodenpiatten jj vorgesehen, die mit ihren Endteilen auf zwei In einem gewissen Abstand voneinander angeordneten, mit Ihrem Stegteil naoh unten gekehrten Tragbügein d abgestützt sind« Diese Anodenplatten c verlaufen parallel zueinander *jj>d sind unter dem gleichen Neigungswinkel alle na«h der gleichen Seite hin geneigt-. Zur Einrichtung gehört auch eine hier nur angedeutetetwo provided on opposite sides of the same Overflow chambers a2 and a? has that immediately about the bottom of the same by means of an In Flg. 1 not shown Rohres are connected to each other. Into the electrolyte The rotogravure cylinder, which is mounted in the two front wall parts of the main camera, is partially immersed in the bath trained base body b, on which the galvanic Precipitation should be formed. The cylinder b acts as a cathode as usual. Elongated anode plates jj are provided below this cylinder, which are marked with their end parts on two At a certain distance from each other arranged, with their web part near the downward facing carrying brackets are supported in d «These anode plates c run parallel to each other * jj> d are under the same Angle of inclination all inclined towards the same side. The facility also includes one that is only hinted at here
BAD ORJGfNAL 909815/0834BAD ORJGfNAL 909815/0834
ν- τ ν- τ
aufweist . _, .having . _,.
a und gC Die Aneaugeeite dieser beiden Pumpen iet mn im Boden der Hauptkammer ajL und der Ueberlaufkammer §ß Vorge-BehenenlAuelaufstutzen el und £3 angeschlossen. Sie beiden Pumpen furdern den filtrierten Slsktrolyt mittels dioht duinh den Boden der Hauptkammer al hindurchgefuhrt«^Druckleitungen zu DüeenrShren 01 und 02, die parallel zu den Anodenplatten o, oberhalb dereelben rerlauf en und zwar in der Ähe der Schenkel der Tragbügel d, gegen die dieee Anodenplatten £ geneigt sind, Die Düeenuffnungen der Düsenrohr· Ol und 02 befinden eich auf der dem Tiefdruck-Zylinder b bsw. den Anodenplatten c entsprechenden Seite derselben, sodass der Elektrolyt auf seinem τοη den Pilterpuapen im Kreislauf beförderte Elektrolyt zwischen die Anodenplatten hinduroh«- strömt, wobei ein Teil desselben auoh noch den Zylinder beetreicht. Dadurch, daes die Ueberlaufkammer a2 mittels einer leitung mit der Ueberlaufkammer a? rerbunden ist# wird auoh der in der erstgsnannten Ueberlaufkanmer befindliche Elektrolyt umgewälzt.a and gC The Aneaugeeite these two pumps iet mn in the bottom of the main chamber and the overflow chamber AJL §ß Pre-BehenenlAuelaufstutzen el £ 3 connected and. The two pumps convey the filtered sctrolyte by means of which the bottom of the main chamber is passed through the pressure lines to nozzle tubes 01 and 02, which run parallel to the anode plates o, above them, near the legs of the support brackets d, against which they run The anode plates £ are inclined, the nozzle openings of the nozzle tube oil and 02 are located on that of the rotogravure cylinder b bsw. the side of the same corresponding to the anode plates c, so that the electrolyte flows between the anode plates on its electrolyte, which is circulated in the pilterpuapen, a part of which also covers the cylinder. Because the overflow chamber a2 is connected to the overflow chamber a? rerbunden is # is circulated AUOH of the present in the erstgsnannten Ueberlaufkanmer electrolyte.
Das AusfUhrungcbsispiel gemüse fig. 2 hat «inen im Querschnitt runden, doppelwandigen Behälter &, dessen Innenwand etwas höher ist als die Aussenwand, Dadurojh werden auch wieder eine Rauptkamoer £l und eine Uebtrj.aufkammer £2 gebildet. In der Achse der Hauptkammer gJL ist e.3. sin mit einem galvanisohen üsberzug zu rersehender Uegen.ttsnd ]|9 The example of the vegetable fig. 2 has a double-walled container with a round cross-section, the inner wall of which is somewhat higher than the outer wall. In the axis of the main chamber gJL is e.3. sin with a galvanic coating of objects to be seen.ttsnd] | 9
909815/0834 bad original909815/0834 bad original
c U96892 c U96892
«wischen welche« und der Innenwand dee Behälter· g, die dinglichen Anodenplatten *L stehend in turblnenechauf elkran«artiger Anordnung Yorgesehen sind* Innerhalb der eo angeordneten Anodenplatten i Bind parallel daiu rerlaufende DUeenrohre J. vorgesehen, denen der filtrierte Elektrolyt von unten her auch wieder von einer Motorfilterpumpe, deren Ansaugeeite an drei Ablaufstutzen k der Ueber lauf kasse r £2 angeschlossen ist, zugeführt wird» Der so in TJelauf verse-sete Elektrolyt ströat dabei auch wieder «wischen die Anodenplatten χ hinduroh, wobei ein Teil desselben ähnlich wie ober erläutert, den su galvanisierenden Gegenstand bestreicht. "Wipe which" and the inner wall of the container, the real anode plates * L standing in a turblnenechaufelkran «-like arrangement * Inside the eo arranged anode plates are provided in parallel running DU tubes J, which also receive the filtered electrolyte from below again by a motor filter pump whose Ansaugeeite three downcomer k the overflow checkout r £ 2 is connected is, is supplied to "the sete verse-so in TJelauf electrolyte ströat the possibility" again wipe the anode plates χ hinduroh, a portion thereof, similar to top explained, coated the object to be electroplated.
Dank der eigenartigen Anordnung der Anodenplatten in den beiden oben beaclr !ebenen Aueftthrungsbeispislen ist es gelungen, unter Anwendung einer enspreohend groeeen filtration des Elektrolyten, Mit herkömlichen Elektrolyten-]su<jaiunenseteungen die Stroadlchten uü sehr als das doppelte zu erhöhen. Der Hauptrortell dieser neuartigen Anodenanordnung besteht vor alles darin, dass die anodische Oberfläche gegenüber bisherigen Anlagen us das 3 bis 4-fache vergrttesert wird, Von wesentlicher. Bedeutung 1st auch die hier der Anodenstellung angepasste Filtration und Einspritzung des gereinigten Eletrolyten.Thanks to the peculiar arrangement of the anode plates in the two flat installation examples shown above succeeded using a correspondingly large Filtration of the electrolyte, with conventional electrolyte] su <jaiunenseteungen the street lights and much more than twice that to increase. The main aspect of this novel anode arrangement consists primarily in the anodic surface compared to previous systems us 3 to 4 times the rate of increase becomes, of essential. The filtration and injection of des, which is adapted to the position of the anode, is also important purified electrolytes.
Die hier vorgesehene Anodenanordnung und die durch die filtration erreichte starke ümspüllung der Anoden,The anode arrangement provided here and the strong flooding of the anodes achieved by the filtration,
BAD ORIQ^5ALBAD ORIQ ^ 5AL
909815/0834909815/0834
Λ-Λ-
erlaubt die Anwendung β ehr hoher Stromdiohten, d.h. unter Verwendung Üblicher Badsusammensetsungen wird eine Erhöhung der Stromdichte τοη aehr al· 100 l· erreicht, d.h. bie su 55 Amp/dm2·allows the use of rather high currents, that is, by using the usual bathroom set, an increase in the current density τοη aehr al · 100 l · is achieved, ie up to 55 Amp / dm 2 ·
Si· Düeenrohre selbst erlauben ein« eehr inteneiT· Elektrolyt-Zirkulation swieohen Anode und Kathode zu erreichen, wobei su sagen ist, dass es sieh um einen filtrierten Elektrolyt handelt.You · nozzle pipes themselves allow a «very inteneiT · Electrolyte circulation as well as the anode and cathode to be achieved, whereby it is to be said that it looks like a filtered one Electrolyte.
In Kombination mit geeigneten Zu·ateen gelingt es, mit der erfindungsgemässen Einrichtung fein kristallene Kupf erniedersohlUge mit einer Hörte τοη ca. 180 - 190 Ticker· su erzeugen, welche trots ihrer Härte ein· eehr hohe Slastisitat aufweisen und frei τοη Foren und fremdkörpereinschltt·*- een sind. Siese neuartige Einrichtung kann für Tersohleden· Zwecke una mit dirersen Elektrolyten betrieben werden»In combination with suitable additions, it is possible to with the device according to the invention finely crystalline Copper bottom with a sound τοη approx. 180 - 190 ticker su generate, which despite their hardness a very high slastisity have and free τοη forums and foreign body inclusion * - een are. This new type of device can be operated for Tersohleden · purposes and with direct electrolytes »
909815/0834909815/0834
Claims (6)
a , β? bezw«. g , g ) des Behälters (a bezwo g) abzufüh» ren, um Um dann, im geschlossenen Kreislauf und nachdem er die Filter dar Vorrichtung durchflossen hatt mittels oberhalb der Anodenplatten (c bezw„ i) angeordneten,.2 Ά 3 2
a, β? or «. g, g) of the container (a bezwo g) abzufüh "ren to order then, arranged in a closed circuit and after it has passed through the filter device is t means above the anode plates (c BEZW" i) ,.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH515862A CH423404A (en) | 1962-04-30 | 1962-04-30 | Device for the production of galvanic deposits on a body, in particular a gravure cylinder |
Publications (3)
Publication Number | Publication Date |
---|---|
DE1496892A1 true DE1496892A1 (en) | 1969-04-10 |
DE1496892B2 DE1496892B2 (en) | 1974-01-10 |
DE1496892C3 DE1496892C3 (en) | 1974-08-15 |
Family
ID=4288886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1496892A Expired DE1496892C3 (en) | 1962-04-30 | 1963-04-29 | Device for generating galvanic deposits on a carrier |
Country Status (8)
Country | Link |
---|---|
BE (1) | BE631672A (en) |
CH (1) | CH423404A (en) |
DE (1) | DE1496892C3 (en) |
DK (1) | DK103650C (en) |
FR (1) | FR1362099A (en) |
GB (1) | GB1035007A (en) |
NL (2) | NL292092A (en) |
SE (1) | SE218494C1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19839479A1 (en) * | 1998-08-29 | 2000-03-02 | Schaeffler Waelzlager Ohg | Chemical or electrochemical treatment of an axisymmetric hollow component involves holding the component in a rotating unit so that a circumferential section of the component is dipped into the treatment bath |
US7556722B2 (en) | 1996-11-22 | 2009-07-07 | Metzger Hubert F | Electroplating apparatus |
US8298395B2 (en) | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3959109A (en) * | 1972-11-17 | 1976-05-25 | Xerox Corporation | Method and apparatus for electroforming |
CN109837583A (en) * | 2019-02-19 | 2019-06-04 | 昆山科比精工设备有限公司 | A kind of roll-to-roll horizontal plating line of flexible board |
-
0
- NL NL137510D patent/NL137510C/xx active
- NL NL292092D patent/NL292092A/xx unknown
- BE BE631672D patent/BE631672A/xx unknown
-
1962
- 1962-04-30 CH CH515862A patent/CH423404A/en unknown
-
1963
- 1963-04-26 GB GB16461/63A patent/GB1035007A/en not_active Expired
- 1963-04-26 FR FR932832A patent/FR1362099A/en not_active Expired
- 1963-04-26 SE SE460163A patent/SE218494C1/sv unknown
- 1963-04-29 DE DE1496892A patent/DE1496892C3/en not_active Expired
- 1963-04-29 DK DK198863AA patent/DK103650C/en active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7556722B2 (en) | 1996-11-22 | 2009-07-07 | Metzger Hubert F | Electroplating apparatus |
US7914658B2 (en) | 1996-11-22 | 2011-03-29 | Chema Technology, Inc. | Electroplating apparatus |
DE19839479A1 (en) * | 1998-08-29 | 2000-03-02 | Schaeffler Waelzlager Ohg | Chemical or electrochemical treatment of an axisymmetric hollow component involves holding the component in a rotating unit so that a circumferential section of the component is dipped into the treatment bath |
US8298395B2 (en) | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
US8758577B2 (en) | 1999-06-30 | 2014-06-24 | Chema Technology, Inc. | Electroplating apparatus |
Also Published As
Publication number | Publication date |
---|---|
FR1362099A (en) | 1964-05-29 |
CH423404A (en) | 1966-10-31 |
SE218494C1 (en) | 1968-01-23 |
DE1496892B2 (en) | 1974-01-10 |
NL137510C (en) | |
DK103650C (en) | 1966-01-31 |
DE1496892C3 (en) | 1974-08-15 |
GB1035007A (en) | 1966-07-06 |
NL292092A (en) | |
BE631672A (en) |
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E77 | Valid patent as to the heymanns-index 1977 |