DE112013006850A5 - Stereokameramodul sowie Verfahren zur Herstellung - Google Patents

Stereokameramodul sowie Verfahren zur Herstellung Download PDF

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Publication number
DE112013006850A5
DE112013006850A5 DE112013006850.8T DE112013006850T DE112013006850A5 DE 112013006850 A5 DE112013006850 A5 DE 112013006850A5 DE 112013006850 T DE112013006850 T DE 112013006850T DE 112013006850 A5 DE112013006850 A5 DE 112013006850A5
Authority
DE
Germany
Prior art keywords
manufacture
camera module
stereo camera
stereo
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112013006850.8T
Other languages
English (en)
Inventor
Gerhard Müller
Sven Kujat
Marko Alexovski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112013006850A5 publication Critical patent/DE112013006850A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20Image signal generators
    • H04N13/204Image signal generators using stereoscopic image cameras
    • H04N13/239Image signal generators using stereoscopic image cameras using two 2D image sensors having a relative position equal to or related to the interocular distance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B35/00Stereoscopic photography
    • G03B35/08Stereoscopic photography by simultaneous recording
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2213/00Details of stereoscopic systems
    • H04N2213/001Constructional or mechanical details
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)
  • Stereoscopic And Panoramic Photography (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE112013006850.8T 2013-03-19 2013-12-12 Stereokameramodul sowie Verfahren zur Herstellung Withdrawn DE112013006850A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013102820.9A DE102013102820A1 (de) 2013-03-19 2013-03-19 Stereokameramodul sowie Verfahren zur Herstellung
DE102013102820.9 2013-03-19
PCT/DE2013/200361 WO2014146629A1 (de) 2013-03-19 2013-12-12 Stereokameramodul sowie verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
DE112013006850A5 true DE112013006850A5 (de) 2015-11-26

Family

ID=50156519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013102820.9A Withdrawn DE102013102820A1 (de) 2013-03-19 2013-03-19 Stereokameramodul sowie Verfahren zur Herstellung
DE112013006850.8T Withdrawn DE112013006850A5 (de) 2013-03-19 2013-12-12 Stereokameramodul sowie Verfahren zur Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013102820.9A Withdrawn DE102013102820A1 (de) 2013-03-19 2013-03-19 Stereokameramodul sowie Verfahren zur Herstellung

Country Status (7)

Country Link
US (1) US20150358605A1 (de)
EP (1) EP2976880A1 (de)
JP (1) JP2016522596A (de)
KR (1) KR20150131059A (de)
CN (1) CN105191299A (de)
DE (2) DE102013102820A1 (de)
WO (1) WO2014146629A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016126243A (ja) * 2015-01-07 2016-07-11 株式会社リコー カメラ装置
TWI558200B (zh) * 2015-02-26 2016-11-11 晶睿通訊股份有限公司 攝像模組及攝影裝置
DE102015003963A1 (de) 2015-03-26 2015-08-20 Daimler Ag Vorrichtung und Verfahren zur Erkennung von Verkehrszeichen
WO2017096455A1 (en) * 2015-12-09 2017-06-15 Titan Medical Inc. Stereoscopic imaging sensor apparatus and method for fabricating pairs of image sensors used in stereoscopic imaging
US10298819B2 (en) * 2016-07-20 2019-05-21 Nextvr Inc. Camera apparatus and methods which allow for filters to be used
CN108886566B (zh) 2016-12-27 2021-10-22 华为技术有限公司 一种摄像头基板组件、摄像头模组及终端设备
CN110169048B (zh) 2017-01-09 2022-07-19 Lg伊诺特有限公司 双透镜驱动装置、双相机模块和光学装置
CN107529001B (zh) * 2017-08-28 2020-07-24 信利光电股份有限公司 一种双摄像模组搭载对位方法
DE102017221474A1 (de) * 2017-11-29 2019-05-29 Robert Bosch Gmbh Überwachungsmodul, Überwachungsmodulanordnung, Überwachungsanlage und Verfahren
DE102017222708A1 (de) * 2017-12-14 2019-06-19 Conti Temic Microelectronic Gmbh 3D-Umfelderfassung mittels Projektor und Kameramodulen
JP7242500B2 (ja) * 2019-10-18 2023-03-20 日立Astemo株式会社 ステレオカメラ装置
CN113824857A (zh) * 2021-08-10 2021-12-21 浙江时空道宇科技有限公司 一种图像采集与处理***和空间遥感相机

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US4703343A (en) 1984-12-25 1987-10-27 Matsushita Electric Industrial Co., Ltd. Noise reduction feedback type comb filter
AU2599701A (en) * 1999-12-28 2001-07-09 Vrex, Inc. A 3d camera
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
JP4679864B2 (ja) * 2004-09-21 2011-05-11 富士フイルム株式会社 ステレオカメラ、およびステレオカメラ用ステー
JP4115981B2 (ja) * 2004-10-06 2008-07-09 本田技研工業株式会社 車両用ステレオカメラの取付構造
JP4691508B2 (ja) 2004-11-15 2011-06-01 日立オートモティブシステムズ株式会社 ステレオカメラ
US8081207B2 (en) * 2006-06-06 2011-12-20 Point Grey Research Inc. High accuracy stereo camera
DE102006035232A1 (de) * 2006-07-26 2008-01-31 Robert Bosch Gmbh Optische Messeinrichtung mit einer Bildaufnahmeeinheit
US20100259655A1 (en) * 2007-11-01 2010-10-14 Konica Minolta Holdings, Inc. Imaging device
DE102007057172B4 (de) * 2007-11-26 2009-07-02 Silicon Micro Sensors Gmbh Stereokamera zur Umgebungserfassung
JP2009265412A (ja) * 2008-04-25 2009-11-12 Fuji Heavy Ind Ltd ステレオカメラユニット
JP5324946B2 (ja) * 2008-04-25 2013-10-23 富士重工業株式会社 ステレオカメラユニット
DE102008035150A1 (de) * 2008-07-28 2010-02-04 Hella Kgaa Hueck & Co. Stereokamerasystem
WO2011131164A1 (de) * 2010-04-21 2011-10-27 Conti Temic Microelectronic Gmbh Optische vorrichtung und verfahren zur positionierung eines optischen elements über einem bildaufnahmeelement
KR101149021B1 (ko) * 2010-10-08 2012-05-24 엘지이노텍 주식회사 3차원 촬상장치와 그 제조방법
KR101182549B1 (ko) * 2010-12-16 2012-09-12 엘지이노텍 주식회사 3차원 입체 카메라 모듈
CN102256150A (zh) * 2011-07-14 2011-11-23 深圳市掌网立体时代视讯技术有限公司 一种双光路双传感器合成模组及三维成像装置
US9438889B2 (en) * 2011-09-21 2016-09-06 Qualcomm Incorporated System and method for improving methods of manufacturing stereoscopic image sensors

Also Published As

Publication number Publication date
CN105191299A (zh) 2015-12-23
WO2014146629A1 (de) 2014-09-25
DE102013102820A1 (de) 2014-09-25
KR20150131059A (ko) 2015-11-24
EP2976880A1 (de) 2016-01-27
JP2016522596A (ja) 2016-07-28
US20150358605A1 (en) 2015-12-10

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Legal Events

Date Code Title Description
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H04N0013020000

Ipc: H04N0013200000

R005 Application deemed withdrawn due to failure to request examination