DE10392603D2 - Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver - Google Patents
Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem LeuchtstoffpulverInfo
- Publication number
- DE10392603D2 DE10392603D2 DE10392603T DE10392603T DE10392603D2 DE 10392603 D2 DE10392603 D2 DE 10392603D2 DE 10392603 T DE10392603 T DE 10392603T DE 10392603 T DE10392603 T DE 10392603T DE 10392603 D2 DE10392603 D2 DE 10392603D2
- Authority
- DE
- Germany
- Prior art keywords
- phosphor
- phosphor powder
- powder
- producing
- phosphor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10392603.8T DE10392603B4 (de) | 2002-05-29 | 2003-05-28 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10223988.6 | 2002-05-29 | ||
DE10223988A DE10223988A1 (de) | 2002-05-29 | 2002-05-29 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver |
PCT/DE2003/001749 WO2003102113A1 (de) | 2002-05-29 | 2003-05-28 | Leuchtstoffpulver, verfahren zum herstellen des leuchtstoffpulvers und leuchtstoffkörper mit dem leuchtstoffpulver |
DE10392603.8T DE10392603B4 (de) | 2002-05-29 | 2003-05-28 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10392603D2 true DE10392603D2 (de) | 2005-02-03 |
DE10392603B4 DE10392603B4 (de) | 2018-01-18 |
Family
ID=29557395
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10223988A Ceased DE10223988A1 (de) | 2002-05-29 | 2002-05-29 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver |
DE10392603.8T Expired - Lifetime DE10392603B4 (de) | 2002-05-29 | 2003-05-28 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Verwendung eines Leuchtstoffpulvers |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10223988A Ceased DE10223988A1 (de) | 2002-05-29 | 2002-05-29 | Leuchtstoffpulver, Verfahren zum Herstellen des Leuchtstoffpulvers und Leuchtstoffkörper mit dem Leuchtstoffpulver |
Country Status (4)
Country | Link |
---|---|
US (1) | US7481951B2 (de) |
JP (1) | JP2005527692A (de) |
DE (2) | DE10223988A1 (de) |
WO (1) | WO2003102113A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2855169B1 (fr) | 2003-05-23 | 2006-06-16 | Rhodia Elect & Catalysis | Composes precurseurs d'aluminates d'alcalino-terreux ou de terre rare, leur procede de preparation et leur utilisation comme precurseur de luminophore notamment |
DE20308495U1 (de) | 2003-05-28 | 2004-09-30 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Konversions-LED |
US7088038B2 (en) | 2003-07-02 | 2006-08-08 | Gelcore Llc | Green phosphor for general illumination applications |
US7094362B2 (en) | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
US7442326B2 (en) | 2003-10-29 | 2008-10-28 | Lumination Llc | Red garnet phosphors for use in LEDs |
US7252787B2 (en) | 2003-10-29 | 2007-08-07 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
JP4374474B2 (ja) * | 2004-04-23 | 2009-12-02 | 独立行政法人物質・材料研究機構 | 蛍光体 |
JP4583076B2 (ja) * | 2004-06-11 | 2010-11-17 | スタンレー電気株式会社 | 発光素子 |
US7648649B2 (en) | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
US7329371B2 (en) | 2005-04-19 | 2008-02-12 | Lumination Llc | Red phosphor for LED based lighting |
JP5205724B2 (ja) * | 2006-08-04 | 2013-06-05 | 日亜化学工業株式会社 | 発光装置 |
US7847309B2 (en) | 2007-07-16 | 2010-12-07 | GE Lighting Solutions, LLC | Red line emitting complex fluoride phosphors activated with Mn4+ |
KR101421719B1 (ko) * | 2007-09-18 | 2014-07-30 | 삼성전자주식회사 | 금속 하이드록시 탄산염을 이용한 나노 형광체의 제조방법및 그로부터 제조된 나노 형광체 |
FR2943333B1 (fr) * | 2009-03-20 | 2011-08-05 | Baikowski | Alumine, luminophores et composes mixtes ainsi que procedes de preparation associes |
TWI501926B (zh) * | 2010-07-23 | 2015-10-01 | Baikowski | 氧化鋁、發光團及混合化合物,以及相關製備方法 |
TWI583625B (zh) * | 2010-07-23 | 2017-05-21 | 貝柯夫斯基公司 | 氧化鋁、發光團及混合化合物,以及相關製備方法 |
US9617469B2 (en) * | 2011-01-06 | 2017-04-11 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles, making method, and light-emitting diode |
US8865022B2 (en) | 2011-01-06 | 2014-10-21 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles and making method |
KR20150100864A (ko) * | 2012-12-28 | 2015-09-02 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 형광체 함유 수지 성형체, 발광 장치 및 수지 펠릿 |
JP6261196B2 (ja) * | 2013-06-12 | 2018-01-17 | 信越化学工業株式会社 | 発光装置 |
JP6543492B2 (ja) * | 2015-03-20 | 2019-07-10 | 株式会社カネカ | Yag蛍光体の製造方法 |
DE102015113360A1 (de) | 2015-08-13 | 2017-02-16 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Konversionselements |
JP6428813B2 (ja) * | 2017-03-13 | 2018-11-28 | 信越化学工業株式会社 | 発光装置 |
JP2019147968A (ja) * | 2019-06-13 | 2019-09-05 | 株式会社カネカ | Yag蛍光体用複合粒子、yag蛍光体及び発光装置 |
US10950773B1 (en) * | 2019-12-02 | 2021-03-16 | Bruce H Baretz | Light emitting diode devices |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4034257A (en) * | 1975-06-05 | 1977-07-05 | General Electric Company | Mercury vapor lamp utilizing a combination of phosphor materials |
GB1589964A (en) * | 1976-09-03 | 1981-05-20 | Johnson Matthey Co Ltd | Luminescent materials |
GB1600492A (en) * | 1977-01-19 | 1981-10-14 | Johnson Matthey Co Ltd | Luminescent materials |
NL7809555A (nl) * | 1978-09-20 | 1980-03-24 | Philips Nv | Werkwijze voor het bereiden van een luminescerend alu- minaat. |
FR2469477A1 (fr) * | 1979-11-09 | 1981-05-22 | Rhone Poulenc Ind | Procede de fabrication de grenat polycristallin, grenat polycristallin et monocristal correspondant |
KR920010085B1 (ko) * | 1988-07-30 | 1992-11-14 | 소니 가부시기가이샤 | 이트륨 · 알루미늄 · 가넷미립자의 제조방법 |
FR2679242A1 (fr) * | 1991-07-19 | 1993-01-22 | Rhone Poulenc Chimie | Phosphate mixte de lanthane, terbium et cerium, procede de fabrication de ceux-ci a partir de sels insolubles de terres rares. |
JPH05294722A (ja) * | 1992-04-10 | 1993-11-09 | Kurosaki Refract Co Ltd | 固体レーザ用多結晶透明yagセラミックスの製造方法 |
FR2743555B1 (fr) * | 1996-01-17 | 1998-02-27 | Rhone Poulenc Chimie | Borate de terre rare et son precurseur, leurs procedes de preparation et l'utilisation du borate comme luminophore |
JP2001513828A (ja) * | 1997-02-24 | 2001-09-04 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | 酸素含有蛍光粉体、該蛍光粉体の製造方法、該蛍光粉体を利用してなる装置 |
JP3906352B2 (ja) * | 2000-03-27 | 2007-04-18 | 独立行政法人物質・材料研究機構 | Yag透明焼結体の製造方法 |
JP3425582B2 (ja) * | 2000-04-14 | 2003-07-14 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
JP2002029742A (ja) | 2000-07-21 | 2002-01-29 | Daiichi Kigensokagaku Kogyo Co Ltd | 希土類金属酸化物粉末及びその製造方法 |
JP2002194346A (ja) * | 2000-12-22 | 2002-07-10 | Sumitomo Chem Co Ltd | アルミン酸塩蛍光体の製造方法 |
DE20308495U1 (de) * | 2003-05-28 | 2004-09-30 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Konversions-LED |
-
2002
- 2002-05-29 DE DE10223988A patent/DE10223988A1/de not_active Ceased
-
2003
- 2003-05-28 US US10/513,724 patent/US7481951B2/en not_active Expired - Lifetime
- 2003-05-28 JP JP2004510355A patent/JP2005527692A/ja active Pending
- 2003-05-28 DE DE10392603.8T patent/DE10392603B4/de not_active Expired - Lifetime
- 2003-05-28 WO PCT/DE2003/001749 patent/WO2003102113A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2005527692A (ja) | 2005-09-15 |
DE10223988A1 (de) | 2003-12-18 |
DE10392603B4 (de) | 2018-01-18 |
WO2003102113A1 (de) | 2003-12-11 |
US20060022580A1 (en) | 2006-02-02 |
US7481951B2 (en) | 2009-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, , DE Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBU, DE |
|
8110 | Request for examination paragraph 44 | ||
R082 | Change of representative |
Representative=s name: , Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE |
|
R081 | Change of applicant/patentee |
Owner name: OSRAM GMBH, DE Free format text: FORMER OWNER: OSRAM GESELLSCHAFT MIT BESCHRAEN, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20120612 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: OSRAM GESELLSCHAFT MIT BESCHRAEN, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20120612 Owner name: OSRAM AG, DE Free format text: FORMER OWNER: OSRAM GESELLSCHAFT MIT BESCHRAEN, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20120612 Owner name: OSRAM GMBH, DE Free format text: FORMER OWNERS: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20120612 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNERS: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20120612 |
|
R081 | Change of applicant/patentee |
Owner name: OSRAM GMBH, DE Free format text: FORMER OWNER: OSRAM AG, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20130205 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: OSRAM AG, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20130205 Owner name: OSRAM GMBH, DE Free format text: FORMER OWNERS: OSRAM AG, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130205 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNERS: OSRAM AG, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130205 |
|
R081 | Change of applicant/patentee |
Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: OSRAM GMBH, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20130827 Owner name: OSRAM GMBH, DE Free format text: FORMER OWNER: OSRAM GMBH, OSRAM OPTO SEMICONDUCTORS GMBH, , DE Effective date: 20130827 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNERS: OSRAM GMBH, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130827 Owner name: OSRAM GMBH, DE Free format text: FORMER OWNERS: OSRAM GMBH, 81543 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130827 Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNERS: OSRAM GMBH, 80807 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130827 Owner name: OSRAM GMBH, DE Free format text: FORMER OWNERS: OSRAM GMBH, 80807 MUENCHEN, DE; OSRAM OPTO SEMICONDUCTORS GMBH, 93055 REGENSBURG, DE Effective date: 20130827 |
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R016 | Response to examination communication | ||
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division | ||
R020 | Patent grant now final | ||
R071 | Expiry of right |