DE102014201306A1 - Power electronics module with 3D-made cooler - Google Patents
Power electronics module with 3D-made cooler Download PDFInfo
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- DE102014201306A1 DE102014201306A1 DE102014201306.2A DE102014201306A DE102014201306A1 DE 102014201306 A1 DE102014201306 A1 DE 102014201306A1 DE 102014201306 A DE102014201306 A DE 102014201306A DE 102014201306 A1 DE102014201306 A1 DE 102014201306A1
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K15/0093—Welding characterised by the properties of the materials to be welded
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K2101/14—Heat exchangers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K2101/36—Electric or electronic devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
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- B23K2103/10—Aluminium or alloys thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Ein erster Erfindungsaspekt führt ein Herstellungsverfahren für ein Leistungselektronikmodul (1) ein. Das erfindungsgemäße Verfahren verfügt wenigstens über folgende Schritte: – Bereitstellen eines Leistungselektronikbauteils (8); und – Auftragen einer Kühlstruktur (9) direkt auf das Leistungselektronikbauteil (8) mittels eines dreidimensionalen schichtweisen Auftragsverfahrens. Ein zweiter Erfindungsaspekt betrifft das durch das erfindungsgemäße Verfahren hergestellte oder herstellbare Leistungselektronikmodul (1).A first aspect of the invention introduces a manufacturing method for a power electronics module (1). The method according to the invention has at least the following steps: provision of a power electronic component (8); and - applying a cooling structure (9) directly to the power electronic component (8) by means of a three-dimensional layer-by-layer application method. A second aspect of the invention relates to the power electronics module (1) produced or producible by the method according to the invention.
Description
Technisches Gebiet Technical area
Die Erfindung betrifft ein Herstellungsverfahren für ein Leistungselektronikmodul und ein mit diesem Herstellungsverfahren hergestelltes oder herstellbares Leistungselektronikmodul. The invention relates to a production method for a power electronics module and to a power electronics module produced or producible with this production method.
Technischer Hintergrund Technical background
Leistungselektronikbauteile werden für vielfältige Anwendungen verwendet, beispielsweise um starke elektrische Ströme innerhalb kurzer Zeiten zu schalten, wie es in Wechselrichtern üblich ist. Solche Leistungselektronikbauteile können eine Vielzahl von Schalttransistoren wie beispielsweise IGBTs (Insulated Gate Bipolar Transistor) umfassen, die auf einem flächigen Substrat nebeneinander zu einer Leistungselektronikschaltung angeordnet sind. Hierzu findet beispielsweise die DBC- oder auch DCB-Technik (Direct Bonded Copper) weite Verwendung, bei der ein Keramiksubstrat beidseitig mit strukturierten Kupferlagen versehen und die Schalttransistoren auf einer der strukturierten Kupferlagen angeordnet und dadurch zu einer Leistungselektronikschaltung verbunden werden. Power electronics components are used for a variety of applications, for example, to switch strong electrical currents within a short time, as is common in inverters. Such power electronic components may comprise a plurality of switching transistors such as IGBTs (Insulated Gate Bipolar Transistor), which are arranged on a flat substrate next to each other to a power electronics circuit. For this purpose, for example, the DBC or DCB technique (Direct Bonded Copper) widely used in which a ceramic substrate provided on both sides with structured copper layers and arranged the switching transistors on one of the structured copper layers and thereby connected to a power electronics circuit.
Aufgrund der hohen fließenden Ströme und zu schaltenden Lasten entsteht dabei Abwärme, die zum Schutz der Leistungselektronikschaltung vor Überhitzung abgeführt werden muss. Hierzu wird das Leistungselektronikbauteil mit einem Kühler zu einem Leistungselektronikmodul kombiniert. Bei der DCB- Technik wird zudem die verbleibende strukturierte Kupferlage für eine Ableitung und Verteilung der punktuell unterschiedlich stark anfallenden Abwärme und für eine Kontrolle der aufgrund der ungleichmäßig verteilten Abwärme entstehenden mechanischen Spannungen verwendet und für diesen Zweck geeignet strukturiert. Due to the high flowing currents and loads to be switched, this generates waste heat, which must be dissipated to protect the power electronics circuit from overheating. For this purpose, the power electronic component is combined with a cooler to form a power electronics module. In the case of the DCB technology, the remaining structured copper layer is also used for the dissipation and distribution of the pointwise different amounts of waste heat and for the control of the resulting due to the unevenly distributed heat dissipation mechanical stresses and structured suitable for this purpose.
Der oder die Kühler eines Leistungselektronikmoduls können auf einer beliebigen Seite eines DCB-Substrates angeordnet sein. Diese Kühler können als Mikrokanalkühler ausgeführt sein, die die Abwärme der Leistungselektronikschaltung aufnehmen und an ein flüssiges Kühlmittel, das den Mikrokanalkühler durchströmt, abgeben. The one or more coolers of a power electronics module can be arranged on any side of a DCB substrate. These coolers can be designed as a microchannel cooler, which absorb the waste heat of the power electronics circuit and deliver to a liquid coolant flowing through the microchannel cooler.
Durch die Kühlmaßnahmen wird eine möglichst hohe Packungsdichte der Leistungselektronikmodule und somit eine möglichst große schaltbare elektrische Leistung in einem gegebenen Volumen erreicht, ohne eine Überhitzung der Leistungselektronikmodule befürchten zu müssen. By the cooling measures the highest possible packing density of the power electronics modules and thus the largest possible switchable electrical power is achieved in a given volume, without having to fear overheating of the power electronics modules.
Die Erfindung macht es sich zur Aufgabe, ein verbessertes Herstellungsverfahren für Leistungselektronikmodule und verbesserte Leistungselektronikmodule einzuführen. The invention has for its object to introduce an improved manufacturing method for power electronics modules and improved power electronics modules.
Zusammenfassung der Erfindung Summary of the invention
Ein erster Erfindungsaspekt führt daher ein Herstellungsverfahren für ein Leistungselektronikmodul ein. Das erfindungsgemäße Verfahren verfügt wenigstens über folgende Schritte:
- – Bereitstellen eines Leistungselektronikbauteils; und
- – Auftragen einer Kühlstruktur direkt auf das Leistungselektronikbauteil mittels eines dreidimensionalen schichtweisen Auftragsverfahrens.
- - Providing a power electronics component; and
- - Applying a cooling structure directly to the power electronics component by means of a three-dimensional layered application method.
Das Verfahren der Erfindung bietet eine Mehrzahl von Vorteilen. So ist es durch die Verwendung eines dreidimensionalen schichtweisen Auftragsverfahrens, wie es aus dem Rapid Prototyping oder dem sogenannten 3D-Drucken bekannt ist, möglich, komplexe Kühlstrukturen aufzubauen, die sich in klassischer Bauart eines Mikrokanalkühlers nicht realisieren ließen. Dies ist deshalb vorteilhaft, weil sich Durchmesser, Verästelungen und Positionierung von Kühlmittelkanälen in der Kühlstruktur und auch Turbulenzen des Kühlmittels in den Kühlmittelkanälen strömungstechnisch optimieren lassen, so dass eine bestmögliche Verteilung des Kühlmittels entlang der zu kühlenden Oberfläche gemäß den durch die räumliche Anordnung der Leistungselektronikschaltung bedingten Gegebenheiten der Abwärmeverteilung erfolgen kann. Die Kühlmittelkanäle der Kühlstruktur können mit Verfahren der CFD (computational fluid dynamics) berechnet und optimiert werden. The method of the invention offers a number of advantages. Thus, by using a three-dimensional layer-by-layer application method, as it is known from rapid prototyping or so-called 3D printing, it is possible to construct complex cooling structures that could not be realized in the classical design of a microchannel cooler. This is advantageous because the diameter, ramifications and positioning of coolant channels in the cooling structure and also turbulence of the coolant in the coolant channels can be optimized in terms of flow, so that the best possible distribution of the coolant along the surface to be cooled according to the conditional by the spatial arrangement of the power electronics circuit Conditions of the waste heat distribution can take place. The coolant channels of the cooling structure can be calculated and optimized using methods of CFD (computational fluid dynamics).
Ein weiterer Vorteil der Erfindung besteht in seiner schnellen Durchführung, dass die Produktionszeit verkürzt. Zudem kann ein besonders guter wärmeleitender Kontakt zwischen der Kühlstruktur und dem Leistungselektronikbauteil hergestellt werden, indem die Kühlstruktur direkt auf dem Leistungselektronikbauteil aufgebaut und dadurch mit dem Leistungselektronikbauteil verbunden wird. Im Unterschied hierzu werden die bekannten Kühler mit Wärmeleitpasten oder dergleichen auf die Leistungselektronikbauteile aufgebracht. Dies hat jedoch einen verhältnismäßig schlechten Wärmeleitwert von ungefähr 3 bis 10 W/mK zur Folge. Another advantage of the invention is its rapid implementation that shortens production time. In addition, a particularly good heat-conducting contact between the cooling structure and the power electronics component can be produced by the cooling structure is constructed directly on the power electronics component and thereby connected to the power electronics component. In contrast, the known cooler with thermal paste or the like are applied to the power electronics components. However, this results in a relatively poor thermal conductivity of about 3 to 10 W / mK.
Besonders bevorzugt wird für das dreidimensionale schichtweise Auftragsverfahren ein Pulverauftragsverfahren verwendet. Bei bevorzugten Beispielen solcher Pulverauftragsverfahren werden dünne Pulverschichten eines zu wählenden Materials, meist metallisches Material oder Kunststoff, auf das für das Auftragsverfahren als Substrat dienende Leistungselektronikbauteil aufgetragen und anschließend durch einen Energiestrahl, beispielsweise einen Laser- oder Elektronenstrahl, selektiv verhärtet. Indem jede Schicht geeignet selektiv verhärtet wird, entsteht aus der Vielzahl der Schichten schließlich die gewünschte Form der Kühlstruktur. Abschließend wird das Pulver von den nicht verhärteten Stellen entfernt. Particularly preferred for the three-dimensional layer-by-layer application method, a powder application method is used. In preferred examples of such powder application methods, thin powder layers of a material to be selected, usually metallic material or plastic, are applied to the power electronic component serving as substrate for the application process and then selectively hardened by an energy beam, for example a laser or electron beam. By doing Each layer is hardened selectively selectively, arises from the plurality of layers, finally, the desired shape of the cooling structure. Finally, the powder is removed from the non-hardened areas.
Es sind jedoch auch flüssigkeitsbasierte Auftragsverfahren anwendbar, beispielsweise galvanische Verfahren unter Verwendung von photolithographischen Stukturierungsverfahren. However, liquid-based application methods are also applicable, for example galvanic methods using photolithographic patterning methods.
In dem dreidimensionalen schichtweisen Auftragsverfahren für den Aufbau der Kühlstruktur kann wenigstens eine Kunststoffschicht oder eine Kunststoffteilschicht aufgetragen werden. Eine solche Kunststoffschicht kann insbesondere in Verbindung mit einer Mehrzahl von metallischen Schichten oder Teilschichten genutzt werden, um die Kühlstruktur elektrisch von dem Leistungselektronikbauteil zu isolieren. Außerdem können etwaige in der Kühlstruktur enthaltene Kühlmittelkanäle auf diese Weise mit Kunststoff beschichtet werden, was dem Korrosionsschutz dienen kann. Dies ist insbesondere bei einem Aufbau der Kühlstruktur aus Kupfer und/oder einer Verwendung von Wasser als Kühlmittel beziehungsweise wasserhaltigen Kühlmitteln vorteilhaft. Allerdings kann die Beschichtung der Kühlmittelkanäle mit Kunststoff auch mit anderen Verfahren erreicht werden. Ebenso ist es denkbar, die Kühlmittelkanäle aus Aluminium oder einem anderen korrosionsfesten metallischen Material auszuführen. In the three-dimensional layered application method for the construction of the cooling structure, at least one plastic layer or a plastic sublayer can be applied. Such a plastic layer can be used in particular in conjunction with a plurality of metallic layers or partial layers in order to electrically isolate the cooling structure from the power electronic component. In addition, any coolant channels contained in the cooling structure can be coated in this way with plastic, which can serve the corrosion protection. This is particularly advantageous in a structure of the cooling structure made of copper and / or a use of water as a coolant or water-containing coolants. However, the coating of the coolant channels with plastic can also be achieved by other methods. It is also conceivable to carry out the coolant channels made of aluminum or another corrosion-resistant metallic material.
In vorteilhaften Ausführungsformen des erfindungsgemäßen Verfahrens kann in dem dreidimensionalen schichtweisen Auftragsverfahren eine Mehrzahl von unterschiedlichen Materialien in einer ausgewählten Schicht aufgetragen werden. Dies kann beispielsweise für den oben beschriebenen Aufbau von korrosionsfesten Kühlmittelkanälen innerhalb einer Kühlstruktur aus korrosionsanfälligem Material verwendet werden. Es ist aber auch denkbar, eine Kühlstruktur aus einem gewählten Material (beispielsweise mit besonders guten Wärmeleiteigenschaften) zu deren Schutz mit einem Gehäuse (z.B. aus Edelstahl) zu versehen, indem entsprechend für unterschiedliche Bereiche jeder ausgewählten Schicht die unterschiedlichen Materialien verwendet und strukturiert werden. In advantageous embodiments of the method according to the invention, a plurality of different materials can be applied in a selected layer in the three-dimensional layered application method. This can be used, for example, for the above-described construction of corrosion-resistant coolant channels within a cooling structure of corrosion-prone material. However, it is also conceivable to provide a cooling structure made of a selected material (for example with particularly good heat conduction properties) with a housing (for example made of stainless steel) for protection thereof, by using and structuring the different materials for different areas of each selected layer.
Besonders bevorzugt wird in dem Schritt des Auftragens der Kühlstruktur wenigstens ein Kühlmittelkanal in der Kühlstruktur geformt. Der wenigstens eine Kühlmittelkanal kann mit Anschlüssen für das Kühlmittel versehen sein. Solche Anschlüsse können gegebenenfalls direkt durch das dreidimensionale schichtweise Auftragsverfahren, beispielsweise unter Verwendung eines Kunststoffmaterials, realisiert werden. Particularly preferably, in the step of applying the cooling structure, at least one coolant channel is formed in the cooling structure. The at least one coolant channel may be provided with connections for the coolant. If appropriate, such connections can be realized directly by the three-dimensional layer-by-layer application method, for example using a plastic material.
Der Schritt des Bereitstellens des Leistungselektronikbauteils kann einen Schritt umfassen, in dem ein Leistungshalbleiterchip des Leistungselektronikbauteils durch ein Planares Interconnect-Verfahren kontaktiert wird. Hierbei ist insbesondere das sogenannte SiPLIT-Verfahren (Siemens PLanar Interconnect Technology), wie es beispielsweise in
Ein weiterer Vorteil der Kombination eines Planaren Interconnect-Verfahrens wie SiPLIT und des erfindungsgemäßen Verfahrens liegt darin, dass die Kühlstruktur in besonders geringem Abstand zu den Schalttransistoren angeordnet werden kann. Bei Leistungselektronikschaltungen, die mit dem traditionellen Bonding mittels kurzer Drähte kontaktiert werden, werden diese Drähte üblicherweise durch Aufgießen einer verhältnismäßig dicken, meist silikonhaltigen, Harzschicht mechanisch stabilisiert, was eine bedeutende Wärmebarriere darstellt, die die Kühlung nach oben erheblich erschwert. Im Gegensatz hierzu kann bei Verwendung eines planaren Interconnect-Verfahrens eine verhältnismäßig dünne Isolationsschicht auf das Leistungselektronikbauteil aufgebracht werden, beispielsweise in Form einer auflaminierten Folie, wie sie auch im Rahmen des SiPLIT-Verfahrens verwendet wird, auf der dann direkt die Kühlstruktur aufgebaut wird. Diese Isolationsschicht kann auch im Rahmen des dreidimensionalen schichtweisen Auftragsverfahrens selbst erzeugt werden, wie weiter oben erklärt wird. A further advantage of the combination of a planar interconnect method such as SiPLIT and the method according to the invention is that the cooling structure can be arranged at a particularly small distance from the switching transistors. In power electronics circuits that are contacted with the traditional short-wire bonding, these wires are usually mechanically stabilized by casting a relatively thick, usually silicone-containing, resin layer, which represents a significant thermal barrier, which makes cooling up significantly more difficult. In contrast, when using a planar interconnect method, a relatively thin insulating layer can be applied to the power electronics component, for example in the form of a laminated film, as used in the SiPLIT process, on which the cooling structure is then built up directly. This insulation layer can also be generated in the context of the three-dimensional layer-wise application method itself, as explained above.
Nach dem Schritt des Auftragens der Kühlstruktur kann ein Deckel auf der Kühlstruktur befestigt werden. Dies kann beispielsweise durch Laserschweißen oder entsprechende Verfahren erfolgen. Der Deckel kann dazu dienen, die Kühlstruktur abzuschließen und dadurch zu schützen. Außerdem kann es dazu dienen, offene Kühlmittelkanäle fluidisch abzudichten, wobei freilich Bohrungen in dem Deckel für Kühlmittelzu- und -ableitungen vorgesehen sein können. Es ist aber auch möglich, ein zweites Leistungselektronikmodul auf dem ersten zu befestigen. Hierbei können beide Leistungselektronikmodule räumlich gleich ausgerichtet sein, so dass die Rückseite des einen auf der Vorderseite des anderen befestigt wird, wodurch Stapel von mehreren Leistungselektronikmodulen möglich sind. Solche Stapel ermöglichen eine besonders hohe Packungsdichte. After the step of applying the cooling structure, a lid may be mounted on the cooling structure. This can be done for example by laser welding or appropriate methods. The cover may serve to complete and thereby protect the cooling structure. In addition, it may serve to fluidly seal open coolant channels, although holes may be provided in the cover for coolant supply and discharge lines. But it is also possible to attach a second power electronics module on the first. Here, both power electronics modules can be aligned spatially the same, so that the back one is attached to the front of the other, allowing stacks of multiple power electronics modules. Such stacks enable a particularly high packing density.
Alternativ können die beiden Leistungselektronikmodule voneinander wegweisen, so dass die Kühlstrukturen der beiden Leistungselektronikmodule aufeinander angeordnet werden. Dabei ist es denkbar, die Kühlstrukturen der beiden Leistungselektronikmodule funktional und räumlich miteinander zu verbinden, so dass auch ein Kühlmittelaustausch zwischen den Leistungselektronikmodulen möglich ist. Beispielsweise kann jedes der Leistungselektronikmodule eine obere beziehungsweise untere Hälfte eines einzigen Kühlmittelkanals aufweisen, der durch die Befestigung der beiden Leistungselektronikmodule aneinander vervollständigt wird. Ebenso ist es vorstellbar, dass jede Kühlstruktur als Abdichtung der Kühlmittelkanäle der jeweils anderen Kühlstruktur dient. Alternatively, the two power electronics modules can point away from each other, so that the cooling structures of the two power electronics modules are arranged on top of each other. It is conceivable to connect the cooling structures of the two power electronic modules functionally and spatially, so that a coolant exchange between the power electronics modules is possible. For example, each of the power electronics modules may include an upper and a lower half of a single coolant channel, which is completed by the attachment of the two power electronics modules to each other. It is also conceivable that each cooling structure serves as a seal of the coolant channels of the respective other cooling structure.
Ein zweiter Erfindungsaspekt betrifft das durch das erfindungsgemäße Verfahren hergestellte oder herstellbare Leistungselektronikmodul. Ein solches Leistungselektronikmodul kann beispielsweise von herkömmlichen anhand der Kristallstruktur der Kühlstruktur, der Formgebung von Kühlmittelkanälen oder der Abwesenheit von Wärmeleitpasten oder -klebern zwischen dem Leistungselektronikbauteil und der Kühlstruktur unterschieden werden. A second aspect of the invention relates to the power electronics module produced or producible by the method according to the invention. Such a power electronics module can be differentiated, for example, from conventional ones based on the crystal structure of the cooling structure, the shaping of coolant channels or the absence of thermal compounds or adhesives between the power electronics component and the cooling structure.
Kurzbeschreibung der Abbildungen Brief description of the pictures
Die Erfindung wird nachfolgend anhand von Abbildungen von Ausführungsbeispielen näher erläutert. Es zeigen: The invention will be explained in more detail with reference to illustrations of exemplary embodiments. Show it:
Ausführliche Beschreibung der Abbildungen Detailed description of the pictures
Im gezeigten Ausführungsbeispiel ist das Leistungselektronikbauteil
Das SiPLIT-Leistungselektronikbauteil
Erfindungsgemäß wird direkt auf das Leistungselektronikbauteil
In dem gezeigten Ausführungsbeispiel besitzt die Kühlstruktur
Der Kühlmittelkanal
Bei dem gezeigten Ausführungsbeispiel ist der Kühlmittelkanal
Bei dem in
In vorteilhaften Ausführungsformen der Erfindung kann durch die Befestigung der Kühlstrukturen
Obwohl die Erfindung im Detail durch bevorzugte Ausführungsbeispiele näher illustriert und beschrieben wurde, ist die Erfindung nicht durch die offenbarten Beispiele eingeschränkt. Variationen können vom Fachmann abgeleitet werden, ohne den Schutzumfang der Erfindung, wie er in den anhängenden Ansprüchen definiert ist, zu verlassen. Although the invention has been illustrated and described in detail by preferred embodiments, the invention is not limited by the disclosed examples. Variations may be derived by those skilled in the art without departing from the scope of the invention as defined in the appended claims.
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
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