DE102004058239A1 - Bildwandler - Google Patents
Bildwandler Download PDFInfo
- Publication number
- DE102004058239A1 DE102004058239A1 DE102004058239A DE102004058239A DE102004058239A1 DE 102004058239 A1 DE102004058239 A1 DE 102004058239A1 DE 102004058239 A DE102004058239 A DE 102004058239A DE 102004058239 A DE102004058239 A DE 102004058239A DE 102004058239 A1 DE102004058239 A1 DE 102004058239A1
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- Germany
- Prior art keywords
- transparent plate
- light
- image
- sensor substrate
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000010586 diagram Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
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- 238000012360 testing method Methods 0.000 description 5
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- 239000000463 material Substances 0.000 description 3
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- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S1/00—Beacons or beacon systems transmitting signals having a characteristic or characteristics capable of being detected by non-directional receivers and defining directions, positions, or position lines fixed relatively to the beacon transmitters; Receivers co-operating therewith
- G01S1/02—Beacons or beacon systems transmitting signals having a characteristic or characteristics capable of being detected by non-directional receivers and defining directions, positions, or position lines fixed relatively to the beacon transmitters; Receivers co-operating therewith using radio waves
- G01S1/022—Means for monitoring or calibrating
- G01S1/026—Means for monitoring or calibrating of associated receivers
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- G01S5/00—Position-fixing by co-ordinating two or more direction or position line determinations; Position-fixing by co-ordinating two or more distance determinations
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- G01S5/06—Position of source determined by co-ordinating a plurality of position lines defined by path-difference measurements
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- H03L7/08—Details of the phase-locked loop
- H03L7/085—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
- H03L7/091—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector using a sampling device
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Abstract
Ein Bildwandler weist folgendes auf: ein Sensorsubstrat (7), auf dem eine große Anzahl von Halbleiterchips (6), von denen jeder eine Vielzahl von Bildaufnahmeelementen (11) hat, linear angeordnet ist, um das von einer Linse (4) konvergent gemachte reflektierte Licht zu empfangen; und eine transparente Platte (5, 51, 52, 53), die zwischen der Linse (4) und dem Sensorsubstrat (7) angeordnet ist. Damit wird ein Lichtwegbereich gebildet, der dem Grenzbereich zwischen benachbarten Halbleiterchips (6) mit einer Brechungsfunktion entspricht, so daß das vertikale Licht, das auf den Grenzbereich zwischen Halbleiterchips (6) fällt, gebrochen wird und geteilt in die Richtungen der jeweiligen Bildaufnahmeelemente fällt.
Description
- Die Erfindung betrifft einen Bildwandler für eine Bildeingabevorrichtung und speziell einen Bildwandler vom Kontakttyp, bei dem eine Vielzahl von Halbleiterchips als fotoelektrische Umwandlungselemente angebracht sind.
- Als Konstruktion eines Bildwandlers ist in
9 des Patentdokuments 1 eine Bildlesevorrichtung gezeigt, bei der eine Vielzahl von Chips so angeordnet sind, daß verhindert wird, daß eine Dichtedifferenz aufgrund eines Abstandsfehlers zwischen den Chips (an einer Grenze der Chips) auffällt. In der Figur bezeichnen C1 und C2 Chips (fotoelektrische Umwandlungselemente), Ca und Cb bezeichnen einander benachbarte Chipenden, La bezeichnet eine Abstandsstrecke zwischen den Enden von benachbarten Chips. - Ferner bezeichnet r ein Bildaufnahmeelement (Lichtempfangselement), P bezeichnet eine Distanz zwischen den Bildaufnahmeelementen, P' bezeichnet eine Distanz zwischen Grenz-Bildaufnahmeelementen. Außerdem bezeichnen C14 und C21 in
3(c) des Patentdokuments 1 Bildaufnahmeelemente, die an der Grenze der Chips einander benachbart positioniert sind. -
4 in dem Patentdokument 2 zeigt eine Bildlesevorrichtung, bei der eine Vielzahl von Bildelementchips angeordnet sind. In der Figur bezeichnet1 einen Bildelementchip,2 ist ein Bildaufnahmeelement (Lichtempfangselement),3 ist eine (geneigte) Endoberfläche in einer Längsrichtung,3a ist ein Rand an der Vorder- bzw. Bildseite des Chips1 ,3b ist ein Rand an der Rückseite (Substratseite) des Chips1 ,7 ist ein Substrat, und8 ist Silberpaste. - Bei einem Bildwandler, der eine Vielzahl von auf einem Substrat angeordneten Chips hat, wird eine Distanz P' zwischen Grenz-Bildaufnahmeelementen in bezug auf eine Distanz P zwischen Bildaufnahmeelementen länger, und somit werden in dem Patentdokument
1 ein Mittelwert des Ausgangssignals des Bildaufnahmeelements C14 und ein Mittelwert des Ausgangssignals des Bildaufnahmeelements C21 als Interpolationsdaten hinzuaddiert. Da es sich nicht um tatsächliche Bilddaten handelt, die von dem Bildwandler gelesen werden, bedeutet dies, daß Simulations- bzw. Pseudodaten erzeugt werden. - In dem Patentdokument 2 ist die Steifigkeit eines rotierenden Messers erhöht, und das Vereinzeln erfolgt unter Neigen des rotierenden Messers, und der Rand
3a an der Bildseite des Chips1 wird vorstehend ausgebildet, so daß der Rand3b an der Rückseite zurückgezogen ist, so daß die Distanz P' zwischen den Grenz-Bildaufnahmeelementen nahe an die tatsächliche Distanz P zwischen den Bildaufnahmeelementen auf demselben Chip herangebracht werden kann. - Zum Zeitpunkt der tatsächlichen Produktion mit automatischer Montage mit einem Chipbonder oder dergleichen müssen jedoch die Chips vorher vereinzelt und unter Berücksichtigung einer Kollision (Berührung) von Chips mit der erforderlichen Genauigkeit bei der Montage angebracht werden. Und selbst dann, wenn die Chips als solche mit hoher Präzision angebracht werden können, werden sie doch mechanisch auf einem darunter befindlichen Klebstoff, wie etwa Silberpaste
8 angebracht, so daß die Positionen der Chips nach dem Anbringen verändert sein können. - Beim Bonden der Chips wird ferner der Klebstoff mittels Wärme ausgehärtet, um die Chips zu fixieren. Dabei tritt das Problem auf, daß im Fall der Anordnung vieler Chips die Chips nicht mit hoher Präzision angebracht werden können, weil Positionsänderungen von Chips infolge von Zufallsbewegungen der Chips aufgrund des Schrumpfens von Klebstoff beim Aushärten nicht vernachlässigt werden können.
- Ein Bildwandler gemäß der Erfindung löst die oben beschriebenen Probleme. Aufgabe der Erfindung ist die Angabe eines Bildwandlers, der ein Bild in einem Grenzbereich von Chips mit hoher Wiedergabetreue lesen kann, ohne Interpolationsdaten (Daten von einem imaginären Bildaufnahmeelement) zu verwenden, und zwar auch dann, wenn eine Distanz P' zwischen Grenz-Bildaufnahmeelementen größer als eine Distanz P zwischen Bildaufnahmeelementen auf demselben Chip ist.
- Ein Bildwandler gemäß der Erfindung weist folgendes auf: eine Lichtquelle, die Licht auf ein Objekt richtet, das aufzunehmen ist; eine Linse, die sich in einer Richtung erstreckt, die senkrecht zu einer Richtung ist, in der das aufzunehmende Objekt bewegt wird, und die von dem aufzunehmenden Objekt reflektiertes Licht über eine vorbestimmte Lesebreite konvergent macht; ein Sensorsubstrat, auf dem eine große Anzahl Halbleiterchips, von denen jeder eine Vielzahl von Bildaufnahmeelementen hat, linear angeordnet sind, um das von der Linse konvergent gemachte reflektierte Licht zu empfangen; eine transparente Platte, die zwischen der Linse und dem Sensorsubstrat angeordnet ist und mindestens einen von ausgeschnittenen Bereichen und vorstehenden Bereichen hat, die nahe einem Zwischenraum zwischen den benachbarten Halbleiterchips gebildet sind; und ein Gehäuse, das wenigstens die Linse, das Sensorsubstrat und die transparente Platte aufnimmt oder enthält.
- Daher kann der Bildwandler gemäß der Erfindung ein Bild in dem Grenzbereich mit hoher Abbildungstreue lesen, ohne Interpolationsdaten (Daten von einer imaginären Bildaufnahmevorrichtung) zu verwenden, und zwar auch dann, wenn die Distanz zwischen Grenz-Bildaufnahmeelementen größer als die Distanz zwischen Bildaufnahmeelementen auf demselben Chip ist.
- Die Erfindung wird nachstehend, auch hinsichtlich weiterer Merkmale und Vorteile, anhand der Beschreibung von Ausführungsbeispielen unter Bezugnahme auf die beiliegenden Zeichnungen näher erläutert. Diese zeigen in:
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1 eine Querschnittsansicht, die einen Aufbau des Bildwandlers gemäß Ausführungsform 1 der Erfindung zeigt; -
2 eine schematische Ansicht zur Erläuterung der Lagebeziehung einer Stablinsenanordnung, der transparenten Platte und des Sensorsubstrats des Bildwandlers gemäß Ausführungsform 1 der Erfindung; -
3 ein Diagramm, das eine Position und schematische Gestalt eines ausgeschnittenen Bereichs einer transparenten Platte gemäß Ausführungsform 1 der Erfindung zeigt; -
4 eine schematische Ansicht der Lagebeziehung eines Halbleiterchips auf dem Sensorsubstrat des Bildwandlers gemäß Ausführungsform 1 der Erfindung; -
5 eine Draufsicht, die die Gestalt der unteren Oberfläche der transparenten Platte gemäß Ausführungsform 1 der Erfindung zeigt; -
6 eine schematische Ansicht der Querschnittsform der unteren Oberfläche der transparenten Platte gemäß Ausführungsform 1 der Erfindung; -
7 eine Teilperspektivansicht der transparenten Platte gemäß Ausführungsform 1 der Erfindung; -
8 ein Diagramm, das die Lichtbrechung an der Grenze des Mediums zeigt; -
9 ein Diagramm, welches das strukturelle Prinzip der transparenten Platte gemäß Ausführungsform 1 der Erfindung erläutert; -
10 ein Diagramm, das einen Lichtweg zu dem Sensorsubstrat des Bildwandlers gemäß Ausführungsform 1 der Erfindung zeigt; -
11 eine teilweise vergrößerte Perspektivansicht der speziellen Struktur der transparenten Platte gemäß Ausführungsform 1 der Erfindung; -
12 ein Diagramm, das den Bereich optimaler Bildgüte des Bildwandlers gemäß Ausführungsform 1 der Erfindung zeigt; -
13 eine Teilperspektivansicht einer transparenten Platte gemäß Ausführungsform 2 der Erfindung; -
14 ein Diagramm zur Erläuterung der Lichtbrechung an der vorstehenden und geneigten Grenze des Mediums; -
15 ein Diagramm zur Erläuterung des strukturellen Prinzips der transparenten Platte gemäß Ausführungsform 2 der Erfindung; -
16 eine Teilperspektivansicht einer transparenten Platte gemäß Ausführungsform 3 der Erfindung; -
17 eine Teilperspektivansicht einer transparenten Platte gemäß Ausführungsform 4 der Erfindung; -
18 ein Diagramm, das den Bereich optimaler Bildgüte eines Bildwandlers gemäß Ausführungsform 5 der Erfindung zeigt; -
19 eine Querschnittsansicht eines Aufbaus des Bildwandlers gemäß Ausführungsform 6 der Erfindung; -
20 eine weitere Querschnittsansicht des Aufbaus des Bildwandlers gemäß Ausführungsform 6 der Erfindung; und -
21 eine Teilperspektivansicht einer transparenten Platte gemäß Ausführungsform 7 der Erfindung. - Ausführungsform 1
- Nachstehend wird die Ausführungsform 1 der Erfindung beschrieben.
1 ist eine Querschnittsansicht und zeigt den Aufbau eines Bildwandlers gemäß Ausführungsform 1. In1 bezeichnet1 eine Lichtquelle, um Licht auf ein aufzunehmendes Objekt (ein Originaldokument, einen Geldschein, einen Scheck, Wertpapiere und dergleichen) zu richten,2 ist eine Glasplatte, die eine Auflagefläche bildet, über die das aufzunehmende Objekt3 läuft oder die den Bildwandler schützt und hermetisch abschließt. -
3 ist ein Originaldokument, welches das aufzunehmende Objekt ist,4 ist eine Linse (Stablinsenanordnung), um das von dem Originaldokument3 reflektierte Licht konvergent zu machen,5 ist eine transparente Platte, die reflektiertes Licht durchläßt, 6 ist ein Halbleiterchip, der aus einem Bildaufnahmeelement und seinem Treiberkreis besteht. -
7 ist ein Sensorsubstrat, auf dem der Halbleiterchip6 angebracht ist,8 ist ein Verbinder zum Weiterleiten und Empfangen eines Eingangs-/Ausgangssignals,9 ist ein Gehäuse, welches die Stablinsenanordnung4 , die transparente Platte5 und das Sensorsubstrat7 aufnimmt bzw. hält, und10 ist eine Antriebswalze zum Antreiben des Originaldokuments3 ; die Antriebswalze10 ist gewöhnlich nicht an dem Bildwandler angebracht. - Als nächstes wird die Funktionsweise beschrieben. In
1 wird Licht von der Lichtquelle1 durch die Glasplatte2 auf das Originaldokument3 gerichtet. Ein Teil des Lichts, der von dem Originaldokument3 reflektiert und gestreut wird, wird zu Reflexionslicht und wird von der Stablinsenanordnung4 durch die Glasplatte2 konvergent gemacht. Das von der Stablinsenanordnung4 konvergent gemachte reflektierte Licht tritt durch die transparente Platte5 hindurch und fällt auf das Bildaufnahmeelement (Lichtempfangselement) des Halbleiterchips6 auf dem Sensorsubstrat7 . - Die Distanz zwischen der Oberfläche des Originaldokuments und dem an der oberen Oberfläche des Halbleiterchips positionierten Bildaufnahmeelement wird als Lichtweglänge bezeichnet, und ein Teil des Lichts, der reflektiert und gestreut wird und entlang diesem Lichtweg einfällt, wird von dem Halbleiterchip
6 als Reflexionslicht empfangen. Die Stablinsenanordnung4 , die transparente Platte5 und der Bildaufnahmeelementteil des Halbleiterchips6 sind in bezug auf eine Lichtwegachse symmetrisch angeordnet. -
2 ist eine Perspektivansicht (Vogelperspektive), welche die Lagebeziehung zwischen der Stablinsenanordnung4 , der transparenten Platte5 und dem Halbleiterchip6 auf dem Sensorsubstrat7 sowie ihre Gestalt in einer Längsrichtung (der Richtung, in der das Originaldokument gelesen wird) zeigt. Dabei bezeichnet11 ein Bildaufnahmeelement, das auf dem Halbleiterchip6 gebildet ist. -
3 zeigt einen ausgeschnittenen Bereich, der an der unteren Oberfläche der transparenten Platte5 gebildet ist, und das Abstandsmaß bzw. der Abstand (A) dieses ausgeschnittenen Bereichs stimmt mit dem Anbringabstand des Halbleiterchips6 überein. -
4 zeigt die Lagebeziehung zwischen den benachbarten Halbleiterchips6 auf dem Sensorsubstrat7 . In4 bezeichnet P eine Distanz zwischen Bildaufnahmeelementen, P' ist eine Distanz zwischen Grenz-Bildaufnahmeelementen, S ist die Größe des Lichtempfangsbereichs des Bildaufnahmeelements11 , wobei der Bereich quadratisch oder rechteckig ist, Lgap bezeichnet eine Abstandsstrecke zwischen den benachbarten Halbleiterchips (Zwischenraum zwischen Halbleiterchips6 ), und11e bezeichnet Bildaufnahmeelemente, die an beiden Enden von Halbleiterchips6 positioniert sind (Grenz-Bildaufnahmeelemente). -
5 ist eine Draufsicht und zeigt die Gestalt des ausgeschnittenen Bereichs, der an der unteren Oberfläche der transparenten Platte5 gebildet ist. In einer Längsrichtung der transparenten Platte5 weist die transparente Platte5 eine Oberfläche auf, die mit einer als A-Bereich bezeichneten Bogengestalt und einer als B-Bereich bezeichneten Rechteckgestalt an einer Seite in einer Richtung, in die das aufzunehmende Objekt3 bewegt wird, ausgebildet ist, und weist eine Oberfläche auf, die mit einer als C-Bereich bezeichneten Rechteckgestalt und einer als D-Bereich bezeichneten Bogengestalt an der anderen Seite in einer Richtung, in die das aufzunehmende Objekt3 bewegt wird, ausgebildet ist. -
6 zeigt die Querschnittsform des A-Bereichs und des B-Bereichs sowie die Querschnittsform des C-Bereichs und des D-Bereichs in5 .7 ist eine Perspektivansicht (Vogelperspektive) des ausgeschnittenen Bereichs der transparenten Platte5 . - In einem Fall, in dem die Brechzahl eines Mediums A größer als diejenige eines Mediums B ist, wie
8 zeigt, wird im allgemeinen Licht, das nicht vertikal auf eine Oberfläche des Mediums B fällt, von dem Medium A gebrochen und an der Grenze zwischen dem Medium A und dem Medium B gebeugt. - Wenn die Grenze zwischen dem Medium A (Brechzahl n = 1,5) und dem Medium B (Brechzahl n = 1,0) in bezug auf eine Horizontale der Papieroberfläche nach rechts oben geneigt ist, wird das gebrochene Licht in bezug auf das auftreffende Licht nach links gebeugt. Wenn die Grenze zwischen dem Medium A und dem Medium B nach rechts unten geneigt ist, wird das gebrochene Licht in bezug auf das auftreffende Licht nach rechts gebeugt.
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9 ist ein Diagramm, in dem die Grenzen zwischen dem Medium A und dem Medium B, die in8 gezeigt sind, einander überlagert sind, wobei sich die eine an der Vorderseite der Papieroberfläche und die andere an der Rückseite befindet. In diesem Fall erscheint das gebrochene Licht als vorderseitiges Licht und rückseitiges Licht in bezug auf das auftreffende vertikale Licht. -
10 ist ein Diagramm, das die Richtungen von gebrochenem Licht von der vorderen Brechungsoberfläche und der hinteren Brechungsoberfläche, die in den5 und6 gezeigt sind, zu dem Sensorsubstrat7 zeigt. In diesem Fall wird das vertikale Licht, das auf den Grenzbereich zwischen Halbleiterchips6 fällt, gebrochen und trifft aufgeteilt auf die Richtungen von Bildaufnahmeelementen (Grenz-Bildaufnahmeelementen)11e , die an der Grenze positioniert sind. -
11 zeigt spezifische Dimensionen eines Bereichs der transparenten Platte5 , der dem vertikalen Licht entspricht, das auf den Grenzbereich zwischen Halbleiterchips6 fällt. Bei dieser Ausführungsform ist die transparente Platte5 gezeigt, die als transparentes Kunststoffmaterial Acrylharz verwendet und einen ausgeschnittenen Bereich hat, der zu einer gekrümmten Oberfläche ausgebildet ist und auf solche Weise ausgeschnitten ist, daß er eine Breite von 0,2 mm und eine Höhe von 0,03 mm hat. Dabei kann die transparente Platte5 durch Schleifen eines transparenten Glasmaterials gebildet sein. -
12 zeigt Daten, die erhalten sind durch einen Reproduzierbarkeitstest eines Bildes an einem Bildwandler, der eine Lesedichte von 300 dpi hat, wobei die in11 gezeigte transparente Platte5 mit dem ausgeschnittenen Bereich angebracht war. Der Test wurde durchgeführt unter Verwendung eines Streifenmusters, das durch Drucken der Farben Rot, Blau und Grün mit einer Dichte von 300 dpi gebildet war, und die Reproduzierbarkeit eines dem Grenzbereich zwischen Halbleiterchips6 entsprechenden Bildes wurde bewertet. - Da die Bildgenauigkeit veränderlich ist in Abhängigkeit von einem Parameter, der auf der Zwischenraumdistanz (Lgap) zwischen Chips, die durch die Anbringpositionen von Halbleiterchips
6 verursacht ist, und einem Parameter, der auf der Distanz (+delta h) zwischen der unteren Oberfläche der transparenten Platte5 und dem Bildaufnahmeelement11 basiert, wurden die Messung und Bewertung unter Berücksichtigung dieser Parameter ausgeführt.12 zeigt deutlich, daß auch dann, wenn Lgap 0,2 mm ist, eine ausgezeichnete Bildgüte durch Ändern der Distanz +delta h gewährleistet werden kann. - Ausführungsform 2
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13 zeigt eine transparente Platte51 , die so ausgebildet hat, daß sie anstelle des ausgeschnittenen Bereichs gemäß7 , der in Ausführungsform 1 beschrieben wird, einen vorspringenden Bereich hat. Der vorspringende Bereich dieser transparenten Platte51 wird unter Bezugnahme auf die14 und15 im Vergleich mit den8 und9 beschrieben. - Wenn der Grenzbereich zwischen dem Medium A und dem Medium B in
14 nach rechts unten geneigt ist, wird das gebrochene Licht in bezug auf das auftreffende Licht nach rechts gebeugt. Wenn der Grenzbereich zwischen dem Medium A und dem Medium B nach rechts oben geneigt ist, wird das gebrochene Licht in bezug auf das auftreffende Licht nach links gebeugt. -
15 ist ein Diagramm, in dem die Grenzen zwischen dem Medium A und dem Medium B in15 einander überlagert sind, und zwar mit der einen an der Vorderseite der Papieroberfläche und der anderen an der Rückseite. In diesem Fall wird Licht, das in die rechte Richtung des gebrochenen Lichts relativ zu dem auftreffenden vertikalen Licht gebeugt wird, zu vorderseitigem Licht, und Licht, das in die linke Richtung des gebrochenen Lichts relativ zu dem auftreffenden vertikalen Licht gebeugt wird, zu rückseitigem Licht. - Die Richtungen von gebrochenem Licht, die in Ausführungsform 2 gezeigt sind, und die Richtungen von gebrochenem Licht, die in den
8 und9 von Ausführungsform 1 gezeigt sind, sind zueinander entgegengesetzt. Das heißt, die Situation der Lichtverteilung ist auch dann die gleiche, wenn die transparente Platte5 , die in Form eines ausgeschnittenen Bereichs ausgebildet ist, oder die transparente Platte51 , die in Form des vorspringenden Bereichs ausgebildet ist, für den Grenzbereich von Halbleiterchips6 verwendet wird. - Ausführungsform 3
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16 ist eine Teilperspektivansicht, die eine transparente Platte5 zeigt, bei welcher der diskontinuierliche Bereich der transparenten Platte5 des Bildwandlers gemäß7 von Ausführungsform 1 der Erfindung durch eine Lichtabfangbehandlung erhalten wird. Bei den Ausführungsformen 1 und 2 wurde hauptsächlich das vertikale Licht beschrieben, das auf den Grenzbereich zwischen Halbleiterchips6 fällt. - Es gibt jedoch tatsächlich von dem Originaldokument
3 reflektiertes effektives Licht, das in bezug auf das vertikale Licht geringfügig geneigt ist, wenn die transparente Platte5 den ausgeschnittenen Bereich mit einer Höhe (h) von 0,03 mm in bezug auf ihre Dicke (2 mm) hat, und daher wird ein Teil des effektiven Lichts totalreflektiert und tritt in das andere Bildaufnahmeelement11 ein, so daß die Schärfe eines gelesenen Bildes verringert wird. - Um diesen Effekt zu vermeiden, werden der Stufenbereich und der geneigte Bereich, die ebenfalls diskontinuierliche Bereiche sind und auf einer zu der Achse des Lichtwegs parallelen Ebene liegen, als Lichtabfangbereich
30 mit schwarzer Farbe für einen handelsüblichen Lötwiderstand beschichtet, und der Lichtabfangbereich30 wird auf geeignete Weise getrocknet und verfestigt. - Ausführungsform 4
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17 ist eine Teilperspektivansicht einer transparenten Platte51 , bei welcher der diskontinuierliche Bereich der transparenten Platte51 des in13 von Ausführungsform 2 gezeigten Bildwandlers mittels einer Lichtabfangbehandlung erhalten wird. Da von dem Originaldokument reflektiertes effektives Licht in bezug auf das vertikale Licht geringfügig geneigt ist, wird dann, wenn die transparente Platte51 den vorstehenden Bereich mit einer Höhe (h) von 0,03 mm in bezug auf ihre Dicke (2 mm) hat, ein Teil des effektiven Lichts totalreflektiert und tritt in ein anderes Bildaufnahmeelement11 ein, so daß die Schärfe eines gelesenen Bildes verringert wird. - Um diesen Effekt ebenso wie bei der Ausführungsform 3 auszuschließen, wird die schwarze Druckfarbe für einen handelsüblichen Lötwiderstand verwendet, um den Lichtabfangbereich
30 für den Stufenbereich und den geneigten Bereich zu bilden, die ebenfalls diskontinuierliche Bereiche sind, die auf der zu der Achse des Lichtwegs parallelen Ebene liegen. - Ausführungsform 5
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18 zeigt Daten, die bei der Durchführung eines Reproduzierbarkeitstests eines Bildes unter Verwendung eines Bildwandlers mit einer Dichte von 600 dpi anstelle des Bildwandlers mit einer Dichte von 300 dpi gemäß Ausführungsform 1 erhalten wurden, wobei die transparente Platte5 mit dem ausgeschnittenen Bereich gemäß -
11 angebracht war. Ebenso wie im Fall der Ausführungsform 1 wurde der Test unter Verwendung eines Streifenmusters durchgeführt, das durch Aufdrucken von Rot, Blau und Grün mit einer Dichte von 300 dpi gebildet war, und die Reproduzierbarkeit eines Bildes an dem Grenzbereich zwischen Halbleiterchips6 wurde bewertet. -
18 zeigt deutlich, daß selbst dann, wenn Lgap 0,1 mm ist, eine ausgezeichnete Bildgüte durch Ändern der Distanz +delta h gewährleistet ist. Dabei wurde zwar die transparente Platte5 mit dem ausgeschnittenen Bereich bei dieser Ausführungsform erläutert, aber die Verwendung der transparenten Platte51 mit dem vorstehenden Bereich anstelle des ausgeschnittenen Bereichs kann die gleichen Testergebnisse liefern. - Wenn ferner der Lichtabfangbereich
30 als der diskontinuierliche Bereich des ausgeschnittenen Bereichs der transparenten Platte5 oder des vorstehenden Bereichs der transparenten Platte51 verwendet wird, empfängt der Bildwandler hauptsächlich das vertikale Licht von dem Originaldokument, so daß der Bildwandler mit einer Dichte von 600 dpi die Klarheit der Bildgüte (eine Dichtedifferenz an einer Bildgrenze) zusätzlich zu der Schärfe verbessern kann. - Ausführungsform 6
-
19 ist eine Querschnittsansicht eines Bildwandlers, wobei ein Gehäuse91 verwendet wird, an dem die Position der transparenten Platte5 oder der transparenten Platte51 in der Lichtwegachse des Gehäuses9 des Bildwandlers vorgesehen bzw. angeordnet ist und durch Vertiefungen91a schrittweise geändert werden kann; die transparente Platte5 oder die transparente Platte51 sind in Ausführungsformen 1 bis 5 der Erfindung gezeigt. - Der auf dem Bildwandler angebrachte einzelne Halbleiterchip
6 hat eine Größe von ungefähr 12,8 mm oder weniger in einer Leserichtung, auch wenn der Halbleiterchip eine Auflösung von 600 dpi oder 300 dpi hat, und ein Halbleiterchip6 hat 144 Bildaufnahmeelemente (der Abstand zwischen den Bildaufnahmeelementen ist ungefähr 0,084 mm) im Fall von 300 dpi und 288 Bildaufnahmeelemente (der Abstand zwischen den Bildaufnahmeelementen ist ungefähr 0,042 mm) im Fall von 600 dpi. - Selbst wenn daher die Auflösung verschieden ist, ist der Abstand (Zwischenraum) zwischen den benachbarten Halbleiterchips
6 gleich wie im Herstellungsprozeß zum Zeitpunkt der Anbringung. - Bei dieser Ausführungsform sind daher ein Sensorsubstrat
7 für 600 dpi und ein Sensorsubstrat7 für 300 dpi hinsichtlich Form und Anbringposition miteinander identisch, aber die Position der transparenten Platte, die in die Lichtwegachse eingesetzt ist, muß geändert werden, so daß die Größe der transparenten Platte in Breitenrichtung geändert wird und in das Gehäuse91 mit den stufenweisen Vertiefungen (91a ) eingesetzt ist, damit die transparenten Platten unterschiedlicher Größe gehalten werden können, so daß auch das Sensorsubstrat für 300 dpi und das Sensorsubstrat7 für 600 dpi leicht eingebaut werden können. Somit kann das Gehäuse91 sowohl für das Sensorsubstrat7 für 300 dpi als auch für das Sensorsubstrat7 für 600 dpi gemeinsam genutzt werden, so daß sich ferner der Effekt einstellt, daß eine Lesequalität hoher Präzision gewährleistet wird. - Anstelle der Vertiefungen
91a des Gehäuses91 sind ferner eine Vielzahl von Vorsprüngen, die einen Durchmesser von ungefähr 0,2 mm und unterschiedliche Höhe haben, zwischen dem Bildsensor von 600 dpi und dem Bildsensor von 300 dpi jeweils an der transparenten Platte entlang einer Leserichtung in Positionen gebildet, die außerhalb des Auftreffbereichs von reflektiertem Licht sind, das auf die transparente Platte fällt, und Löcher, in welche die Vorsprünge passen, sind in vorbestimmten Positionen des Gehäuses9 gebildet. - Dabei kann der gleiche Effekt erzeugt werden. Somit kann, wie
20 zeigt, durch die richtige Verwendung der transparenten Platte52 für 600 dpi, die niedrigere Vorsprünge hat, und der transparenten Platte52 für 300 dpi, die höhere Vorsprünge hat, die Distanz zwischen der transparenten Platte52 und dem Sensorsubstrat7 geändert werden. - Während die transparente Platte
5 oder die transparente Platte51 an dem Gehäuse9 mittels Klebstoff in dem die Vertiefungen91a aufweisenden Gehäuse91 festgelegt ist, ist die die Vorsprünge aufweisende transparente Platte52 an dem Gehäuse9 durch das Ineinandergreifen der Vorsprünge und der Löcher festgelegt. - Bei der vorliegenden Ausführungsform sind dabei Einrichtungen zum Ändern des Abstands zwischen der transparenten Platte und dem Sensorsubstrat für den Fall beschrieben worden, daß die Spezifikationen der Auflösung des Bildwandlers verschieden sind. Zum Zweck der Unterscheidung von Geldscheinen oder dergleichen wird jedoch ein Farbbildwandler verwendet, der zusätzlich zu den Rot-, Grün- und Blaulichtquellen mit einer IR-Lichtquelle und einer UV-Lichtquelle ausgebildet ist, so daß die Einrichtungen auch für das Einstellen einer Differenz der konjugierten Länge des Bildwandlers nutzbar sind, die durch die Wellenlängendifferenz zwischen dem jeweiligen Licht verursacht ist.
- Ausführungsform 7
- Bei den Ausführungsformen 1 bis 6 ist ein Paar der ausgeschnittenen Bereiche (
7 ) oder ein Paar von vorstehenden Bereichen (13 ) der transparenten Platte paarweise separat an zwei Positionen der Vorderseite und der Rückseite ausgebildet, wobei der zweiteilige Aufbau an der Oberfläche parallel zu der Richtung ist, in der das Originaldokument getragen wird; aber auch dann, wenn die ausgeschnittenen Bereiche oder die vorstehenden Bereiche separat in mehr Positionen gebildet sind, etwa als zwei Paare von ausgeschnittenen Bereichen oder zwei Paare von vorstehenden Bereichen mit einer vierteiligen Struktur oder mehr, kann die gleiche Wirkung erzeugt werden. - Wie
21 ferner zeigt, kann die transparente Platte53 , die in Kombination einen ausgeschnittenen Bereich und einen vorstehenden Bereich hat, Licht in einer Richtung konvergent machen. Wenn also der ausgeschnittene Bereich und der vorstehende Bereich in einer Zone nahe der Grenze von einem der Halbleiterchips6 , die über den Zwischenraum (Lgap) zwischen den Halbleiterchips6 angeordnet sind, ausgebildet sind, kann das Licht auf das Grenz-Bildaufnahmeelement11e des anderen Halbleiterchips6 konvergent gemacht werden. - Dabei sind bei der transparenten Platte der Ausführungsformen 1 bis 7 der vorliegenden Erfindung die ausgeschnittenen Bereiche oder die vorstehenden Bereiche an der unteren Oberfläche der transparenten Platte entsprechend dem umgebenden Bereich von Ebenen der Bildaufnahmeelemente
11 über dem Zwischenraum (Lgap) zwischen den Halbleiterchips6 ausgebildet. In einem Fall jedoch, in dem die transparente Platte hinreichend dünn ist, können die ausgeschnittenen Bereiche oder die vorstehenden Bereiche selbst dann, wenn sie an der oberen Oberfläche der transparenten Platte ausgebildet sind, nahe dem Bildaufnahmeelement11 ausgebildet sein und können somit eine entsprechende Wirkung erzeugen. - Ferner ist bei dem Bildwandler der Ausführungsformen 1 bis 7 der Erfindung die transparente Platte eine integrierte geformte Struktur. Es wird aber auch empfohlen, die Dicke der transparenten Platte zu verringern und die transparenten Platten separat nur nahe dem Lgap anzuordnen.
- Ferner wird bei dem Bildwandler der Ausführungsformen 1 bis 7 der Erfindung als transparente Platte ein Kunststoffmaterial oder Natronglas verwendet, das eine Brechzahl (n) von ungefähr 1,5 hat. Wenn jedoch gebrochenes Licht, das steil gemacht ist und aus einer größeren Distanz abgegeben wird, auf die Seite eines gewünschten Grenz-Bildaufnahmeelements
11e aufgebracht wird, kann auch die Verwendung von transparentem Kristall oder Quarz, das eine Brechzahl (n) von ungefähr 2,0 hat, eine entsprechende Wirkung erzeugen. - Wie vorstehend beschrieben, gibt es bei dem in den Ausführungsformen 1 bis 7 gezeigten Bildwandler einen großen Zwischenraum zwischen den benachbarten Halbleiterchips, und auch wenn das Bildaufnahmeelement
11 in diesem Bereich nicht vorhanden ist, kann das tatsächliche Licht von dem Originaldokument (z. B. einem Geldschein) von dem Grenz-Bildaufnahmeelement11e des Halbleiterchips empfangen werden. - Somit kann der Bildwandler ein Ausgangsbild hoher Wiedergabetreue mit hoher Präzision lesen. Da ferner die Interpolation eines imaginären Bildaufnahmeelements als Bilddaten zum Zweck der unregelmäßigen Erhöhung der Anzahl von Bildaufnahmeelementen nicht durchgeführt wird, kann die Signalverarbeitung des Bildwandlers einfach durchgeführt werden.
Claims (5)
- Bildwandler, der folgendes aufweist: – eine Lichtquelle (
1 ), die Licht auf ein aufzunehmendes Objekt richtet; – eine Linse (4 ), die in einer Richtung verläuft, die zu einer Richtung senkrecht ist, in der das aufzunehmende Objekt bewegt wird, und die von dem aufzunehmenden Objekt reflektiertes Licht über eine vorbestimmte Lesebreite konvergent macht; – ein Sensorsubstrat (7 ), auf dem eine große Anzahl von Halbleiterchips (6 ), von denen jeder eine Vielzahl von Bildaufnahmeelementen (11 ) hat, linear angeordnet sind, um das von der Linse (4 ) konvergent gemachte reflektierte Licht zu empfangen; – eine transparente Platte (5 ,51 ,52 ,53 ), die zwischen der Linse (4 ) und dem Sensorsubstrat (7 ) angeordnet ist und nahe einem Zwischenraum zwischen den benachbarten Halbleiterchips (6 ) mit mindestens einem von ausgeschnittenen Bereichen und von vorstehenden Bereichen ausgebildet ist; und – ein Gehäuse (9 ), das zumindest die Linse (4 ), das Sensorsubstrat (7 ) und die transparente Platte (5 ,51 ,52 ,53 ) aufnimmt oder hält. - Bildwandler nach Anspruch 1, dadurch gekennzeichnet, daß die transparente Platte (
5 ,51 ,52 ,53 ) mindestens einen von den ausgeschnittenen Bereichen und von den vorstehenden Bereichen separat an einer Oberfläche aufweist, die zu der Richtung parallel ist, in der das aufzunehmende Objekt bewegt wird. - Bildwandler nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die transparente Platte (
53 ) in einem unterteilten Zustand ausgebildet ist, wobei die ausgeschnittenen Bereiche und die vorstehenden Bereiche gemischt angeordnet sind. - Bildwandler nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die transparente Platte (
5 ,51 ,52 ,53 ) Lichtabfangbereiche (30 ) an den Oberflächen ihrer ausgeschnittenen Bereiche und/oder vorstehenden Bereiche hat, die zu der Achse des Lichtwegs parallel sind. - Bildwandler, der folgendes aufweist: – eine Lichtquelle (
1 ), die Licht auf ein aufzunehmendes Objekt richtet; – eine Linse (4 ), die in einer Richtung verläuft, die zu einer Richtung senkrecht ist, in der das aufzunehmende Objekt bewegt wird, und die von dem aufzunehmenden Objekt reflektiertes Licht über eine vorbestimmte Lesebreite konvergent macht; – ein Sensorsubstrat (7 ), auf dem eine große Anzahl von Halbleiterchips (6 ), von denen jeder eine Vielzahl von Bildaufnahmeelementen (11 ) hat, linear angeordnet ist, um das von der Linse (4 ) konvergent gemachte reflektierte Licht zu empfangen; – eine transparente Platte (5 ,51 ,52 ,53 ), die zwischen der Linse (4 ) und dem Sensorsubstrat (7 ) angeordnet ist und nahe einem Zwischenraum zwischen den benachbarten Halbleiterchips (6 ) mit mindestens einem von ausgeschnittenen Bereichen und von vorstehenden Bereichen ausgebildet ist; und – ein Gehäuse (9 ), das zumindest die Linse (4 ), das Sensorsubstrat (7 ) und die transparente Platte (5 ,51 ,52 ,53 ) auf solche Weise aufnimmt oder hält, daß eine Distanz zwischen der transparenten Platte (5 ,51 ,52 ,53 ) und dem Sensorsubstrat (7 ) veränderlich ist.
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JP (1) | JP3829853B2 (de) |
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US7162052B2 (en) | 1998-04-16 | 2007-01-09 | Digimarc Corporation | Steganographically encoding specular surfaces |
JP4320656B2 (ja) * | 2005-12-13 | 2009-08-26 | 三菱電機株式会社 | 画像読取装置 |
JP4522952B2 (ja) * | 2006-01-18 | 2010-08-11 | 三菱電機株式会社 | 画像読取装置 |
JP2007249475A (ja) | 2006-03-15 | 2007-09-27 | Mitsubishi Electric Corp | 画像読取装置及び紙幣読取方法 |
JP4215071B2 (ja) | 2006-04-28 | 2009-01-28 | 三菱電機株式会社 | イメージセンサ及びその製造方法 |
JP4424360B2 (ja) * | 2007-02-26 | 2010-03-03 | 三菱電機株式会社 | イメージセンサ |
CN101388940B (zh) * | 2007-09-13 | 2013-01-23 | 威海华菱光电股份有限公司 | 高照度接触式图像传感器 |
JP4609530B2 (ja) * | 2008-06-11 | 2011-01-12 | 三菱電機株式会社 | 画像読取装置 |
JP4697494B1 (ja) | 2010-02-24 | 2011-06-08 | 三菱電機株式会社 | イメージセンサ用ic及びそれを用いた密着型イメージセンサ |
CN101951456B (zh) * | 2010-10-13 | 2015-12-16 | 威海华菱光电股份有限公司 | 一种高分辨率的线阵图像读取装置 |
CN103067430A (zh) * | 2011-10-21 | 2013-04-24 | 中兴通讯股份有限公司 | 一种板间通信的方法及通信设备 |
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JPH06218985A (ja) | 1993-01-28 | 1994-08-09 | Rohm Co Ltd | 光学素子チップおよびこれを利用した光学的書き込みまたは読み取り装置 |
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US6865000B2 (en) * | 1994-12-06 | 2005-03-08 | Canon Kabushiki Kaisha | Image reading apparatus for grouping sensors according to characteristics |
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JP2003101724A (ja) | 2001-09-25 | 2003-04-04 | Konica Corp | 画像読取装置及び画像形成装置 |
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ITMI20042236A1 (it) | 2005-02-19 |
US6969838B2 (en) | 2005-11-29 |
JP3829853B2 (ja) | 2006-10-04 |
CN1678012A (zh) | 2005-10-05 |
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