CU22592A3 - Módulo con una caja y una placa base - Google Patents
Módulo con una caja y una placa baseInfo
- Publication number
- CU22592A3 CU22592A3 CU1997116A CU1997116A CU22592A3 CU 22592 A3 CU22592 A3 CU 22592A3 CU 1997116 A CU1997116 A CU 1997116A CU 1997116 A CU1997116 A CU 1997116A CU 22592 A3 CU22592 A3 CU 22592A3
- Authority
- CU
- Cuba
- Prior art keywords
- box
- conductive plate
- force
- module
- fittings
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Connection Or Junction Boxes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1996111631 DE19611631C1 (de) | 1996-03-25 | 1996-03-25 | Modul mit einem Gehäuse und einer Grundplatte |
Publications (1)
Publication Number | Publication Date |
---|---|
CU22592A3 true CU22592A3 (es) | 2000-02-10 |
Family
ID=7789277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CU1997116A CU22592A3 (es) | 1996-03-25 | 1997-10-15 | Módulo con una caja y una placa base |
Country Status (2)
Country | Link |
---|---|
CU (1) | CU22592A3 (de) |
DE (1) | DE19611631C1 (de) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1844657U (de) * | 1961-10-12 | 1962-01-11 | Sihn Kg Wilhelm Jun | Bauteil aus kunststoff fuer gehaeuse elektrischer geraete. |
DE2713650C2 (de) * | 1977-03-28 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | Fügeverbindung zweier Kunststoffteile |
DE4215041C3 (de) * | 1991-05-22 | 1997-09-25 | Siemens Ag | Elektronisches Steuergerät |
-
1996
- 1996-03-25 DE DE1996111631 patent/DE19611631C1/de not_active Expired - Lifetime
-
1997
- 1997-10-15 CU CU1997116A patent/CU22592A3/es unknown
Also Published As
Publication number | Publication date |
---|---|
DE19611631C1 (de) | 1997-08-21 |
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