CN85103290A - Strippable solder mask - Google Patents
Strippable solder mask Download PDFInfo
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- CN85103290A CN85103290A CN198585103290A CN85103290A CN85103290A CN 85103290 A CN85103290 A CN 85103290A CN 198585103290 A CN198585103290 A CN 198585103290A CN 85103290 A CN85103290 A CN 85103290A CN 85103290 A CN85103290 A CN 85103290A
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Abstract
The present invention relates to a kind of strippable solder mask composition.Said composition comprises, ethenoid resin, the mixture of Microcrystalline Wax and solvent.With said composition as film coating, in being exposed to solder flux before, provide a kind of temporary transient mask layer to the selecteed place of circuit.This solder mask is peeled off easily.
Description
The composition that the present invention relates to a kind of temporary transient coating is used for being immersed in the substrate (or being used thing) of scolder.The part that this mask layer can stop solder attach to be coated with to substrate.
It is by ethenoid resin that this coating composition promptly prints agent, wax, and appropriate solvent formation.This seal agent can be screen printed and by thermocoagulation to substrate, typically be printed wiring.This coating is easy to remove from substrate by strip off, and can not be employed again.
Existing solder mask has many deficiency or shortcomings that limit them and use.Existing solder mask, very sensitive when being exposed in the solder flux to corroding, show unsuitable viscosity and intensity.Unfavorable scratch, crackle and part are peeled off and are caused making us dissatisfied or have spot or the product of spot.In some cases, solder mask is subjected to that the influence of acid corrosion is reticulated structure or the crack occurs in the solder flux.
Known solder mask is the milk sap based on composition.Although it can be peeled off, character is too sticking so that carry out silk screen printing and just be difficult to implement.
Scolder masking layer based on epoxy material also is well-known, using with not long ago, needs to dope catalyzer or stiffening agent in the short period of time.Therefore, long shelf-lifeing can not be arranged.
In addition, known solder mask based on epoxy material in use can suffer undesirable spot.
The United States Patent (USP) of Jia Bulike (Gabrick) points out that the solder mask layer composition is used to make printed circuit board (PCB) the 4th, 240, No. 945.Said composition comprises the mixture of Synolac and alkylating aminoresin, a spot of hydrocarbon resin, mineral filler and organic solvent.Although a patent in back has pointed out that this solder mask has some characteristics preferably, it is not a kind of strippable solder mask.
Other patent has been pointed out that can take off or strippable mask layer, and they can not directly be used as solder mask, so this masking layer time of can not bearing immersed solder institute's inherent severe condition.For example, point out that the coating that can take off is used for porous article such as footwear the 3rd, 034, No. 915 of Koln Bu Luosi (Kornbluth).Protect article to exempt from the infringement of making dirty or wearing and tearing with this coating in production process.After machining, peel off coating again.Cohan Bu Luosi points out to adopt ethenoid resin such as vinyl chloride vinyl acetate copolymer.Utilize mineral oil to serve as lubricating oil.This patent is illustrated, and by form obstacle between sedimentary reticulation and shielded surface, this mineral oil can stop reticulation to avoid being connected on the surface.This patent is further illustrated because other composition of mineral oil and solution is incompatible, thus it be tending towards on shielded surface, being precipitated out, thereby make plastics film from shielded surface isolation.Such mask layer can not stand immersed solder time institute's inherent severe condition.
The defence prospectus T900017 of Ge De (Gerdy) suggestion, composition is used for the object of filming as auto parts as the coating of protection.Said composition comprises petroleum wax, ethylene-acrylic acid isobutyl ester multipolymer, vinyl-vinyl acetate copolymer and rosin ester.The content of petroleum wax is 30 to 60%, and more much higher than amount disclosed by the invention.
Composition of the present invention can stand the working condition of the harshness relevant with the purposes of its expectation.Said composition can be done silk screen printing and add thermocoagulation on substrate.So adhesion strength and chemical resistance that the film coating that forms is expressed are enough to stand to be exposed in the hot solder under 230 ℃.The substrate that is coated with is subjected to the protection part of film spot neither can occur can not produce spot yet.This film is easy to be removed by peeling off.Said composition has long advantage of shelf-lifeing.
The objective of the invention is to produce and a kind ofly not only be used for silk screen printing owing to peel off easily, so also may be used on easily being removed again on other object of filming afterwards.
Another object of the present invention provides a composition, and said composition is generated a film coating, and it can stand to exist in high temperature and the solder flux the corrosive chemicals.
But but another purpose of the present invention provides the solder mask of a thermocoagulation silk screen printing, and this mask layer can still keep clean surface by peeling off from being removed with thing on the substrate.
Further purpose of the present invention provides the composition of a solder mask, and wherein each composition tool has good consistency.
Further purpose of the present invention is to produce one to have sufficient intensity and adhering film, prevents to besmirch in brazing process or speckle.
Further purpose of the present invention is the compound method of composition, and it comprises release agent and binder resin, and its ratio causes the harsh temperatures and the etching condition that can stand typical immersed solder can constitute film coating, and the bad effect of unlikely generation.
Further purpose of the present invention is the compound method of a composition, and said composition has shelf-lifeing of at least one month, and can directly be used as solder mask, and needn't carry out further preparation process.
Further purpose of the present invention provides cheapness and the method easy to use of a kind of solder mask printed wiring or other object of filming.
Further purpose of the present invention provides a kind of method of solder mask printed wiring, wherein in order to make circuit card weld into other element, can easily remove mask layer by peeling off.
The hot coagulable resin of said composition is a kind of ethenoid resin.The thick film coating made from these resins is good flexibility and tear resistance.The gratifying ethenoid resin that can obtain from commerce is the Bo Erdeng ethene VC 410M that the chemical department of Bo Erdeng (Borden) company makes.Available other can provide ideal intensity and flexible ethenoid resin.Can adopt polyvinyl chloride, polyvinylidene dichloride, polyvinyl acetate, polyvinyl alcohol and polyvinylacetal homopolymer.Polyvinyl chloride also can be used with the polyethylene and ethylene copolymers of poly-ethyl acetate or polyvinylidene dichloride.But the said ethenoid resin in front also can be united use with one poly-, the compound oligomeric and pre-polymerization of traditional copolymerization.Ethene with other-more such mixtures of polymers can be used for controlling viscosity or solidification rate, also have these convertible as hardness and flexibility.
In composition, the content of ethenoid resin is about 15% to 50%(weight).The content of ethenoid resin preferentially selects about 25% for use to 35%(weight), and be preferably about 30%(weight).
The enforceable solvent of the present invention is Gamma Butyrolactone preferably.Other solvent adapts to, but does not limit the compound that comprises the positive acetone of weevil base, Methyl isobutyl ketone and methyl ethyl diketone.The consumption that solvent in final composition is suitable is about 30% to 90%(weight).
Wax helps the strippability of said composition.At the used wax of the present invention is the micro crystal material that can choose from various synthesis types or natural type.For example hexadecyl, ceryl or triacontyl ester and their mixture adapt to.From plant tissue and the wax sample that obtains of the brazil wax of mainly forming (carnauba wax) by cerinic acid triacontyl ester be available.The wax such as the paraffin that obtain from oil also are available.The wax that is used for said composition can be by the New Jersey from commercial this wax that obtains, Jersey City Frank B.The Luo Si NO.1972 that Luo Si company makes.
In composition, must control the amount of wax.The concrete consumption of the wax that requires will reach the strippability that rete requires.Wax as release agent will allow film to remove easily.But, found that wax can influence the adhesion strength of rete too much conversely.Therefore, film may be rubbed wrinkle, and can not suitably protect the object that is coated with.
The consumption of wax is about 5% to 15% by weight.Preferably its consumption is 10%.The ratio of resin and wax is about 4: 1 to 2: 1, is about 2.5: 1 to 3.5: 1 preferably, and is preferably about 3: 1.
Other one side of the present invention comprises the existence of high-visibility pigment, and promptly under the irradiation of UV-light, it makes the weldering masking layer is visible.Comprising such pigment can be to being carried out O﹠E by the area that is coated with thing and circuit before and after film is removed.Inspection after peeling off can guarantee by clean fully with the film on the thing, and the inspection before peeling off can guarantee do not having bald spot point or unwanted spot on thing.Be specially adapted to the surrounding environment light sensitive electronic devices with regard to high-visibility pigment of the present invention.
A kind of high-visibility pigment of Gong selecting for use is the Dayglow Z-14IMP that daylow color company (Day-Glo Co-lor Corp) makes.This pigment can be suitable for this composition, and its consumption is about 0.1 to 1.0%, preferably is about 0.5%(weight).
Can prepare and use composition of the present invention with following method.Mixed ethylene resin, solvent and wax.Allow this mixture by one three roller shape shredder, make it complete homogenizing.By silk screen printing, immersed solder or be coated with this mixture of brush handle or composition is coated onto by with on the thing.Preferably be heated to about 150 ℃ about 5 minutes and make it to solidify.But temperature range is about 125 ℃ to 165 ℃, and holding time is about 2 to 180 minutes.Solidify and on the belt transmission drying machine, to carry out.
The example that provides below is as illustration of the present invention, and do not limit the scope of the invention.
The example I
Get 30 gram Gamma Butyrolactones, 20 Ke Boerdeng ethenoid resin VC 113R(Borden Vinyl VC 113R resin), 10 gram dibutyl phthalates, 6 gram brazil waxs and the traditional blue dyestuff of 3 grams are added in Haber's special formula N-50 mixing tank (Hobart Model N-50mixer).After stir forming mixture, this mixture is delivered in the three roller shredders of Luo Sishi (Ross Model) 2.5～5 and made complete homogenizing.With silk screen printing this mixture or composition are coated in by with on the thing, and in fact at 165 ℃, said composition is solidified in 20 minutes.
The example II
Following one-tenth is distributed to mixing 56.8 gram Gamma Butyrolactones in the special formula N-50 of the Haber mixing tank, 28.4 Ke Boerdeng ethenoid resin VC 401M, 0.5 restrain known daylow Z-14 IMP(Dayglow Z-14IMP) fluorescence dye, and 9.1 Kroes, 1972 waxes (Ross 1972 Wax).After stir forming mixture, this mixture is delivered in the three roller shape shredders of Luo Si formula 2.5～5 and made complete homogenizing.With silk screen printing said composition is coated onto on the substrate, and in fact said composition is solidified in 20 minutes at 165 ℃.
Prepare film according to above example I and II, this film is done the test of fusing solder flux as the scolder masking layer.Solder flux is 60/40 zinc/plumbous Kester (Kester) 1544 compositions.
This film shows good soldering resistance.Under 230 ℃, record this film and be exposed to and stood in the solder flux 4 minutes.Because typical immersed solder process only needs to expose several seconds like this, so weather resistance shown in the present is appreciable.
In example I and this two example of II above, observe this film, it still keeps slick coating, and it shows not rotten or solder flux is produced ill effect.And find protected by this film by the surface with thing.
In two examples of example I and II, this mask layer is expressed easy separability.By as easy as rolling off a log the removing of this mask layer of strip off, it is clean and uninfluenced that remaining surface is actually.In the example II, check film, the situation that under the irradiation of UV-light, can observe this film by fluorescence dye.
The service condition of having found quite thick coating is best.Preferred thickness is about 50 microns.Too thin when what print, if be lower than 35 microns, then this film just is not easy strip off.
The wide ranges of the work viscosity of the present composition. Available solvent dilution said composition according to circumstances. For example, serigraphy does not need too high viscosity. But good spreadability is again without the need for too low viscosity. Found that suitable degree of being sticked with scope is about 5000 to 6500 centipoises.
It is long that composition of the present invention has the time of shelving. Guarantee one month shelf-life, and also can expect to obtain to be higher than 1 year shelf-life.
Reference best implementation method of the present invention is to understand the present invention. As long as can understand the improvement of doing by the present invention for those skilled in the art, change and replacement, include in the present invention. Therefore, be necessary to consist of wide accessory claim and consist of the spirit and scope of the present invention with a kind of method.
Claims (7)
1, allow on thing such as printed wiring, selecting the method for soldering to comprise:
(a) be coated in composition and formed film coating on the surface with thing, wherein composition comprises:
(1) ethene resin, its consumption are about 15% to 50% (weight);
(2) organic solvent, its consumption is about 30% to 90%; With
(3) Microcrystalline Wax, its consumption is about 5% to 15%;
(b) at high temperature solidify film coating, material is solidified with time enough;
(c) this is used thing and film coating in the solder flux of fusing in exposure during the reasonable time;
(d) remove by this film coating of strip off after, used thing by this of this film coating protection, in fact changed and can be welded to advance element and needn't do further preparation.
2, in accordance with the method for claim 1, wherein film coating is by being screen-printed to this quilt with on the thing.
3, in accordance with the method for claim 2, wherein at about 125 ℃ to 165 ℃, solidify this film coating under about 2 to 180 minutes.
4, in accordance with the method for claim 2, wherein on the belt transmission drying machine, solidify this film coating.
5, in accordance with the method for claim 1, the ratio of therein ethylene resin and Microcrystalline Wax is about 4: 1 to 2: 1.
6, in accordance with the method for claim 5, the ratio of therein ethylene resin and Microcrystalline Wax is about 3.5: 1,2.5: 1.
7, in accordance with the method for claim 1, wherein the thickness of film coating is about 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN198585103290A CN85103290A (en) | 1985-04-30 | 1985-04-30 | Strippable solder mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN198585103290A CN85103290A (en) | 1985-04-30 | 1985-04-30 | Strippable solder mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN85103290A true CN85103290A (en) | 1986-10-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN198585103290A Pending CN85103290A (en) | 1985-04-30 | 1985-04-30 | Strippable solder mask |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN85103290A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360397B (en) * | 2007-08-03 | 2011-09-21 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN103774145A (en) * | 2014-03-01 | 2014-05-07 | 陈廷 | Method for covering metal foil on copper-cladded plate |
| CN103819957A (en) * | 2014-03-01 | 2014-05-28 | 陈廷 | Manufacturing method for covering metal foil on copper-clad plate |
| CN103819956A (en) * | 2014-03-01 | 2014-05-28 | 陈廷 | Pen for covering metal foils on copper-clad plate |
| US9545011B2 (en) | 2015-05-13 | 2017-01-10 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
| CN106563894A (en) * | 2016-10-20 | 2017-04-19 | 长沙理工大学 | Strippable welding flux mask layer composition |
| CN108655380A (en) * | 2018-05-11 | 2018-10-16 | 佛山市高明利钢精密铸造有限公司 | A kind of aluminium alloy cast ingot removing surface method |
| CN111669895A (en) * | 2019-03-08 | 2020-09-15 | 皮考逊公司 | Method of forming a patterned solder mask layer, method of manufacturing a printed circuit board and/or an electrical component, and article |
| CN116285542A (en) * | 2023-03-16 | 2023-06-23 | 咸宁南玻节能玻璃有限公司 | Tearable masking film coating, preparation method thereof and method for preparing coated pattern glass by using tearable masking film coating |
-
1985
- 1985-04-30 CN CN198585103290A patent/CN85103290A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360397B (en) * | 2007-08-03 | 2011-09-21 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN103774145A (en) * | 2014-03-01 | 2014-05-07 | 陈廷 | Method for covering metal foil on copper-cladded plate |
| CN103819957A (en) * | 2014-03-01 | 2014-05-28 | 陈廷 | Manufacturing method for covering metal foil on copper-clad plate |
| CN103819956A (en) * | 2014-03-01 | 2014-05-28 | 陈廷 | Pen for covering metal foils on copper-clad plate |
| CN103819957B (en) * | 2014-03-01 | 2016-08-17 | 叶雨玲 | The manufacture method of the coating of metal forming is covered for copper-clad plate |
| US9545011B2 (en) | 2015-05-13 | 2017-01-10 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
| US10327336B2 (en) | 2015-05-13 | 2019-06-18 | International Business Machines Corporation | Dry film solder mask composite laminate materials |
| CN106563894A (en) * | 2016-10-20 | 2017-04-19 | 长沙理工大学 | Strippable welding flux mask layer composition |
| CN108655380A (en) * | 2018-05-11 | 2018-10-16 | 佛山市高明利钢精密铸造有限公司 | A kind of aluminium alloy cast ingot removing surface method |
| CN111669895A (en) * | 2019-03-08 | 2020-09-15 | 皮考逊公司 | Method of forming a patterned solder mask layer, method of manufacturing a printed circuit board and/or an electrical component, and article |
| CN116285542A (en) * | 2023-03-16 | 2023-06-23 | 咸宁南玻节能玻璃有限公司 | Tearable masking film coating, preparation method thereof and method for preparing coated pattern glass by using tearable masking film coating |
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