CN2929969Y - 横向发光二极管装置 - Google Patents
横向发光二极管装置 Download PDFInfo
- Publication number
- CN2929969Y CN2929969Y CNU2006201210099U CN200620121009U CN2929969Y CN 2929969 Y CN2929969 Y CN 2929969Y CN U2006201210099 U CNU2006201210099 U CN U2006201210099U CN 200620121009 U CN200620121009 U CN 200620121009U CN 2929969 Y CN2929969 Y CN 2929969Y
- Authority
- CN
- China
- Prior art keywords
- circuit
- substrate
- tin
- circuit substrate
- luminous diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006201210099U CN2929969Y (zh) | 2006-06-27 | 2006-06-27 | 横向发光二极管装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006201210099U CN2929969Y (zh) | 2006-06-27 | 2006-06-27 | 横向发光二极管装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2929969Y true CN2929969Y (zh) | 2007-08-01 |
Family
ID=38308341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2006201210099U Expired - Fee Related CN2929969Y (zh) | 2006-06-27 | 2006-06-27 | 横向发光二极管装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2929969Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807639A (zh) * | 2017-04-28 | 2018-11-13 | 日亚化学工业株式会社 | 发光装置 |
JP2022180523A (ja) * | 2017-08-25 | 2022-12-06 | ローム株式会社 | 半導体装置 |
-
2006
- 2006-06-27 CN CNU2006201210099U patent/CN2929969Y/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807639A (zh) * | 2017-04-28 | 2018-11-13 | 日亚化学工业株式会社 | 发光装置 |
CN108807639B (zh) * | 2017-04-28 | 2024-03-08 | 日亚化学工业株式会社 | 发光装置 |
JP2022180523A (ja) * | 2017-08-25 | 2022-12-06 | ローム株式会社 | 半導体装置 |
JP7349544B2 (ja) | 2017-08-25 | 2023-09-22 | ローム株式会社 | 半導体装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: EVERLIGHT ELECTRONICS( SUZHOU) CO., LTD. Free format text: FORMER OWNER: EVERLIGHT ELECTRONICS INDUSTRIAL STOCK CO., LTD. Effective date: 20091225 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20091225 Address after: No. 2135, West Zone, Wujiang Economic Development Zone, Jiangsu, Zhongshan North Road, China: 212000 Patentee after: Billion Optoelectronics (Suzhou) Co., Ltd. Address before: 25, Lane 76, three middle road, Tu Cheng Road, Taipei County, Taiwan, china: Patentee before: Everlight Electronics Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: YIGUANG ELECTRONICS (CHINA) CO., LTD. Free format text: FORMER NAME: YIGUANG ELECTRONICS (SUZHOU) CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Wujiang City, Jiangsu province 215000 Songling Town Economic Development Zone No. 2135 Zhongshan North Road west division operation Patentee after: Everlight Electronics (China) Co.,Ltd. Address before: 212000, Jiangsu, Wujiang Economic Development Zone, West 2135, Zhongshan North Road Patentee before: Everlight Electronics (Suzhou) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070801 Termination date: 20150627 |
|
EXPY | Termination of patent right or utility model |