CN2901636Y

CN2901636Y - Internal storage module conductor

Info

Publication number: CN2901636Y
Application number: CNU2005201150233U
Authority: CN
Inventors: 连世雄
Original assignee: HONGLIAN INT TECH Co Ltd
Current assignee: HONGLIAN INT TECH Co Ltd
Priority date: 2005-08-02
Filing date: 2005-08-02
Publication date: 2007-05-16
Anticipated expiration: 2015-08-02

Abstract

The utility model relates to a conduction device of internal storage components, which comprises a base plate, an anchor plate and a conducting medium, wherein the surface of the base plate is provided with circuits, electric components and multiple circuit junction groups are electrically connected with the anchor plate. The anchor plate is arranged on the electric junction groups of the base plate, and is used to contain the internal storage components (for example, a chip) which are to be measured. Besides, the prescribed location of the anchor plate is provided with restricting members of internal storage components. The conducting medium is composed of a plurality of elastic or flexible connecting parts. Thereby a conducting medium of the conductance device can be changed randomly according to a variety of electric components.

Description

The memory subassembly conduction device

[technical field]

The utility model relates to a kind of memory subassembly conduction device, refers in particular to a kind ofly can change the conducting medium member arbitrarily, is suitable for the memory subassembly conduction device package assembly of various memory subassembly assembling conducting.

[background technology]

Memory subassembly processing procedure now all after finishing product, detects each memory subassembly, filters out the memory subassembly that efficient is stablized or reached to operational function, to guarantee quality, reduces the defect rate that is applied to electronic product, and saves back continuation of insurance cost admittedly.Common memory subassembly testing apparatus, with reference to shown in Figure 11, has a circuit board 10, be provided with several memory subassembly bearings 30 in the plate face, be provided with several signal contacts 20 (golden finger) in circuit board 10 1 selected limits, this memory subassembly bearing 30 is can be for the pedestal of the simple and easy plug of memory subassembly, and is inner and be provided with signal contact 40 and device for fastening and other member in it; By this this circuit board 10 is plugged in a motherboard or other checkout equipment with its signal contact 20, can in described several memory subassembly bearings 30, inserts memory subassembly 50 respectively, to carry out the attribute test operation of this memory subassembly 50.

But the memory subassembly testing apparatus of above-mentioned prior art, its internal memory spare bearing 30 structural forms and size etc., be for the memory subassembly 50 in response to specific pattern made, and this memory subassembly bearing 30 is fixed on the circuit board 10 in affixed mode, therefore, cause to be applied to again the memory subassembly of other pattern, the memory subassembly that various electronic product adopted now particularly, will be according to this electronic product demand or characteristic, make its memory subassembly constitute different types,, do not differ from and require to prepare in advance various memory subassembly testing apparatuss if this, relative increase dealer's testing cost, and the management cost of each testing apparatus.

[utility model content]

Main purpose of the present utility model is to provide a kind of memory subassembly conduction device, substrate and base structure improvement by the carrying memory subassembly, make memory subassembly place this pedestal, and be positioned at the top of pedestal one conducting medium, by bringing pressure to bear on this memory subassembly, make its outer power part form electrically conducting of pressure direction via this conducting medium and substrate.

Secondary objective of the present utility model for a kind of memory subassembly conduction device is being provided, makes this memory subassembly not need tip-off to change.

Another purpose of the utility model, for a kind of memory subassembly conduction device is being provided, be implantable conductive medium in a pedestal, its particle with conductive effect is after suffering oppression, its inner particle will be out of shape, and it is deformed into and makes the outer power part required gap on copline that is enough to remedy memory subassembly.

According to above-mentioned purpose, memory subassembly conduction device of the present utility model comprises substrate, pedestal and conducting medium, wherein: the plural circuit junction group that this substrate, its plate face are provided with circuit, electronic building brick and can electrically connect with pedestal; This pedestal on the circuit junction group that is incorporated into substrate, can supply the ccontaining pedestal of tested memory subassembly (for example chip), and is provided with the limited part of memory subassembly in the pedestal chosen place; This conducting medium, for plural elasticity or flexiblely connect the electric conducting material that body constitutes, mat connects the upper and lower ora terminalis of body as contact site; Make conducting medium be arranged in the pedestal by this, make the circuit junction group of its lower edge and substrate constitute electric connection, promptly form this memory subassembly and place this pedestal, and be positioned at the top of pedestal one conducting medium, by bringing pressure to bear on this memory subassembly, make its outer power part form the electronic installation of conducting via this conducting medium and substrate; And the desirable package assembly of changing of this conducting medium of mat, reach and can extensively be suitable for various memory subassembly functions, and utilize conducting medium to be compressed to change and connect its upper and lower edge connecting point position of body, reach between memory subassembly and pedestal required gap on copline.

[description of drawings]

Fig. 1 forms the schematic perspective view of state for the utility model.

Fig. 2 is the schematic perspective view of the utility model decomposing state.

Fig. 3 forms the section partial schematic diagram of state for the utility model.

Fig. 4 is the schematic diagram of the utility model application implementation action and conducting medium.

Fig. 5 is the schematic diagram of another embodiment of the utility model conducting medium.

Fig. 6 is one of another embodiment schematic diagram of the utility model limited part.

Fig. 7 is two of another embodiment schematic diagram of the utility model limited part.

Fig. 8 is three of another embodiment schematic diagram of the utility model limited part.

Fig. 9 is four of another embodiment schematic diagram of the utility model limited part.

Figure 10 is five of another embodiment schematic diagram of the utility model limited part.

Figure 11 is the schematic diagram of existing apparatus for testing chip.

Provide main figure number explanation below

Substrate 1; Circuit junction group 11;

Circuit junction 111; Fixed part 12;

Plug Division 13; Pedestal 2

Containing cavity 21; Limited part 22;

Cover plate 221,221 '; Pushing cover 222;

Elastic parts 223; Elasticity pressing part 224;

Button hook 225; Buckle protuberance 226;

Portion 23 is fixed; Conducting medium 3

Connect body 32; Memory subassembly 50;

Outer power part 501;

[embodiment]

Now with embodiment architectural feature of the present utility model and other effect, purpose are described in detail as follows with reference to the accompanying drawings:

Consult Fig. 1, Fig. 2 and Fig. 3, memory subassembly conduction device described in the utility model comprises that substrate 1, pedestal 2 and conducting medium 3 form, wherein:

Substrate 1, by Figure 1 and Figure 2, can be a circuit board, its plate and (one side or two faces) is provided with circuit, necessary electronic building brick, and can constitute the plural circuit junction group 11 that electrically connects with following pedestal 2, the plural circuit junction 111 that this circuit junction group 11 can be two rows or arranged shape forms (for example contact of printed circuit); Be provided with the fixed part 12 of described pedestal 2 in substrate 1 chosen place, and be provided with the Plug Division 13 (can be golden finger) that can electrically connect fast with motherboard or checkout equipment;

Pedestal 2 is consulted Fig. 1, Fig. 2 and shown in Figure 3, on the circuit junction group 11 that is combined in substrate 1, for having the framework of a penetration state containing cavity 21, for ccontaining conducting medium 3 and memory subassembly 50 (for example chip); This framework shape can be rectangle, circle or other shape, and visual demand cooperates difform pedestal 2 to use, and is not limited to specific; Pedestal 2 chosen places also are provided with the limited part 22 (these limited part 22 execution modes as described later) of memory subassembly 50, and the portion that is fixed 23 that can combine with substrate 1;

Conducting medium 3, consult Fig. 4 and shown in Figure 5, for conducting resinl that resin and conductive powder body constituted or other equivalent material connect body 32 (conductor), make this upper limb that connects body 32 and lower edge as electrical contact site, and make between upper limb and the lower edge and form the shape that electrically communicates along the direction that is stressed; Wherein, this connects column elasticity or the flexible body that body 32 can be as shown in Figure 4 and constitutes, and the continuous several particle that is that also can be as shown in Figure 5 constitutes;

By this, consult Fig. 1 and shown in Figure 3, make this conducting medium 3 be arranged in containing cavity 21 inside of pedestal 2, the circuit junction 111 that connects body 32 lower edges and substrate 1 is formed to be electrically connected, composition can be put memory subassembly 50 on this conducting medium 3, and when pressing down memory subassembly 50, can further make the outer power part 501 of memory subassembly 50 contact, and see through and connect body 32 and form the electronic installation that electrically connects with substrate 1 with conducting medium 3 its upper limbs that connect body 32 by limited part 22.

During the utility model application implementation, see also Fig. 3 to shown in Figure 5, the difference of visual memory subassembly 50 (chip) pattern, select for use the pedestal 2 that can mate to be assembled in substrate 1, and the conducting medium 3 that can mate is inserted respectively in the pedestal 2, order connects body 32 lower edges and substrate 1 and forms and electrically connect, and memory subassembly 50 is placed on the conducting medium 3 of pedestal 2 again, the outer power part 501 that makes memory subassembly 50 with connect body 32 upper limbs and contact the formation electric connection; If this can use pedestal 2 set limited parts 22 and press down memory subassembly 50, make outer power part 501 compressions connect further closely contact of body 32, formation electrically conducts by this.Because, this conducting medium 3 and pedestal 2 are for forming desirable package assembly of changing with substrate 1, make this memory subassembly not need tip-off to change,, reach the function that extensively is suitable for various memory subassembly assembling uses so can reach the effect of changing at any time in response to different memory subassembly 50; Particularly mat connects body 32 and can be compressed, make and connect body 32 its upper and lower edge relative positions of change, so when the circuit junction 111 of power part outside the memory subassembly 50 501 and substrate 1 has disagreement, for reaching the electrical contact function of proofreading and correct memory subassembly 50 and substrate 1, remedy outer power part 501 required gap on copline of memory subassembly 50, make it more attain accurate contact.

As previously mentioned, but this pedestal 2 of the utility model is for being provided with the limited part 22 of fixed memory assembly 50, these limited part 22 execution modes comprise: as Fig. 2 and shown in Figure 6, can be one is provided with the cover plate 221 that can Gong throw in pedestal 2 one sides and constitutes, or shown in the 7th figure, can be a pushing cover 222 is socketed on and is the slip shape on the pedestal 2 and constitutes, or shown in the 9th figure, can be a cover plate 221 ' that covers several pedestals 2 simultaneously constitutes, and be provided with button hook 225 in cover plate 221 ' and do one with the catching groove of pedestal 2 and combine, or shown in the tenth figure, being formed with buckle protuberance 226 in this pedestal 2 constitutes, or other structure that is enough to press down memory subassembly 50 all can be implemented, needn't stick to specified configuration, and a plurality of limited parts 22 can be fixed on the body of rod, in when operation with the body of rod on plural limited part 22 aim at pedestals 2, and do and fasten or fit.

Other is the person, the utility model also can be provided with an elastic parts 223 in addition in limited part 22 corresponding memory subassemblies 50 places, but making these elastic parts 223 elastic force press down memory subassembly 50 connects with conducting medium 3 grades, this elastic parts 223 comprise configurable for arc lamellar body (as shown in Figure 2), meander-like lamellar body (as shown in Figure 6), tiltedly stretch shape lamellar body (as shown in Figure 7) etc., also needn't stick to specified configuration.Other consults shown in Figure 8, and the utility model also can make described limited part 22 adopt elastomeric material to be assembled in pedestal 2, and directly constitutes an elasticity pressing part 224 in limited part 22, reaches the effect of identical elastic parts 223.

In sum, the utility model memory subassembly conduction device really possesses practicality novelty, creativeness.

Claims

1, a kind of memory subassembly conduction device comprises a substrate, it is characterized in that:

Also comprise:

One pedestal has the framework of containing cavity for being incorporated into substrate;

One conducting medium, for plural number can compressedly connect body, with its upper limb and lower edge as junction, make conducting medium be arranged in pedestal, lower edge and substrate are electrically connected, on conducting medium, put memory subassembly, and utilize a location structure that this memory subassembly limit is placed on the conducting medium, make memory subassembly connect body and the electric connection of substrate formation with connecting that the body upper limb contact and see through.

2, memory subassembly conduction device as claimed in claim 1, it is characterized in that: this substrate is a circuit board, in the plural circuit junction group that the plate face is provided with circuit, necessary electronic building brick and electrically connects with the pedestal formation, the plural circuit junction that this circuit junction group can be two rows or arranged shape forms; This substrate chosen place is provided with the fixed part of pedestal and the Plug Division that can electrically connect fast with motherboard or checkout equipment.

3, as claim 1 a described memory subassembly conduction device, it is characterized in that: this pedestal is provided with the portion that is fixed that combines with substrate.

4, as claim 1 a described memory subassembly conduction device, it is characterized in that: this connects body and can be made of column elasticity or flexible body.

5, as memory subassembly conduction device as described in the claim 1, it is characterized in that: this connects body and can constitute by being continuous several particles.

6, as claim 1 a described memory subassembly conduction device, it is characterized in that: the pedestal chosen place can be provided with a limited part.

7, as the 6th described memory subassembly conduction device of claim, it is characterized in that: described limited part can be provided with the cover plate that can Gong throw by pedestal one side and be constituted.

8, as the 6th described memory subassembly conduction device of claim, it is characterized in that: described limited part can be combined with the catching groove of pedestal and constituted by a separate type cover plate with button hook.

9, as the 6th described memory subassembly conduction device of claim, it is characterized in that: described limited part can be pushing cover and is socketed on and is the slip shape on the pedestal and constitutes.

10, as the 6th described memory subassembly conduction device of claim, it is characterized in that: described limited part can be by constituting with the integrated buckle protuberance of pedestal.

11, as claim 6 a described memory subassembly conduction device, it is characterized in that one: described limited part is included in corresponding memory subassembly place and is provided with an elastic parts in addition.

12, as memory subassembly conduction device as described in the 6th of the claim, it is characterized in that: described limited part can adopt elastomeric material to be assembled in pedestal, and directly constitutes an elasticity pressing part.

13, as claim 6 a described memory subassembly conduction device, it is characterized in that: a plurality of limited parts are fixed on the body of rod, in when operation with the body of rod on plural limited part aim at pedestal, and do and fasten or fit.