CA1252909A

CA1252909A - Modular circuit board units mounted on printed circuit board for forming module-in-module connection and circuit arrangement

Info

Publication number: CA1252909A
Application number: CA000531538A
Authority: CA
Inventors: Walter Schmidt
Original assignee: Oerlikon Contraves AG
Current assignee: Rheinmetall Air Defence AG
Priority date: 1986-03-11
Filing date: 1987-03-09
Publication date: 1989-04-18
Also published as: JPS62213268A; EP0238915B1; EP0238915A1; DE3776371D1

Abstract

INVENTOR: WALTER SCHMIDT

INVENTION: MODULAR CIRCUIT BOARD UNITS MOUNTED ON PRINTED
CIRCUIT BOARD FOR FORMING MODULE-IN-MODULE CONNECTION
AND CIRCUIT ARRANGEMENT

ABSTRACT OF THE DISCLOSURE

A multilayer connection and circuit arrangement for integrated semiconductor and hybrid elements is disclosed.
Modular units are arranged on at least one side of a support structure or element bearing a printed circuit board containing a number of recesses disposed in a matrix arrangement therein. The modular units are arranged in the matrix-like recess arrangement and are secured in a detachable manner on this support structure or element. Each individual modular unit is operatively interconnected with the printed circuit board of the support structure or element and comprises a, for instance, multi-layer printed circuit board on which a number of passive and/or active electrical components are disposed. These electrical components are operatively connected with the printed circuit board of the modular unit which is bonded by laminating to a base panel.

Description

~2.,~

BACKGROU_D OF THE INVENTION

The present invention generally relates to a new and improved connection and circuit arrangement for integrated semiconductor and hybrid units.

The technological development of such type of circuit arrangements containing several integration planes has led to an ever increasing number of electronic functions to be arranged in a limited space~ The relatively complex circuit arrangements of this kind give raise to relatively high manufacturing costs, since the possibly necessary functional tests are time-consuming due to the complexity of the electrical circuitry. Also subsequent modifications of such circuit arrangements may be effected only at high expenditure, so that new designs are frequently required. On the other hand, the high packiny and power density required for such types of circuit arrangemants has lead to undesirably high heat formation which, in the presence of alternating st~ress or loads, may cause the formation of cracks or fissures in the soldered connections.

SUMMAP~Y OF THE INVE:NTION

Therefore, with the foregoing in mind, it is a primary object of the present invention to provide an ~2...~1D9 improved connection and circuit arrangement with high packing density of the components and superior operational reliability so that there do not arise the aforementioned drawbacks and shortcomings of the prior art constructions.

A further significant object of the present invention aims at providiny a new and improved desi~n of a circuit arrange,ment which may be developed and manufactured at low cost and requirès only moderate testing activities.

Now in order to implement these and still further objects of the invention, which will become more readily apparent as the description proceeds, the connection and circuit arrangement of the present invention is manifested by the features that a number of passive and/or active electrical components are disposed on a preferably multi-layer printed circuit board and are electrically interconnected therewith. ~he printed circuit board bearing or provided with these electrical components is laminated to a base panel~ ~he electrical components, the printed circuit carrying the electrical components and the base panel form essentially one modular unit. A plurality of such modular units are arran~ed in a matrix arrangement on a support structure or element provided, in turn, with at least one printed circuit board on one side or surface of the support structure or element and serving ~or electrical contact with the modular units, and the modular units are secured to this support structure or element in a detachable manner.

B~IEF DESCRIPTION OF THE DRAWINGS
-The invention will be better understood and objects other than those set forth above, will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein throughout the various figures of the drawings there ha~e been generally used the same reference characters to denote the same or analogous components and wherein:

Figure 1 is a schematic and perspective view of a connection and circuit arrangement containing a printed circuit board with a matrix or matrix-like arrangement of the modular units;

Figu~e 2 is ~ schematic sectional view of a modular unit;

Figura 3 is a fragmentary sectional view of the connection and circuit arrangement containing the printed circuit board according to the showing of Figure 1 and with modular units disposed on both surfaces;

Figure 4 is a perspective view of a modified construction of modular unit; and Figure 5 is a sectional view of a modular printed circuit board system or assembly with a plurality of modular units and arranged in a tower or stack configuration.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Describing now the drawings, it is to be understood that to simplify the showing thereof, only enough of the structure of the various exemplary embodiments of the inventive connection and circuit arrangement has been illustrated therein as is needed to enable one skilled in the art to readily understand the underlying principles and concepts of ~his invention. Turning now specifically to Figure 1 of the drawings, the connection and circuit arrangement illustrated therein by way of example and not limitation will be seen to comprise a connection and circuit arrangement 45~ provided at an end or lateral face thereof with an interconnect or connection bar or ledge stxucture 35 and with a matrix arrangement composed of a plurality of modular unlts or modules 10 possessing essentially the same dimensions. ~hese modular units or modules 10 possess a, for instance, quadrangular configuration, preferably a substantially square-shaped configuration and are fastened to one side or surface of a support structure or element 30 in a detachable manner by means of threaded bolts or scxews 36 or other conventional attachment means or expedients. On the opposite side or surface of the support structure or element 30 there may be disposed other modular units which have not been particularly depicted in Figure 1, but may comprise an arrangement like the modular units 10' of the structure shown in Figure 3 whi~ch will be considered more fully hereinafter.

Figure 2 shows a sectional view of a modular unit or module on an enlarged scale and conveniently designated by reference numeral 10 or 10', as the case may be, and forming essentially one structural unit. Each such modular unit or module 10 or 10' basically comprises a metallic base panel or plate 16 containing a stepped or offset portion 16', a flexible preferably multi-layer printed circuit board 17 (multi-layer) as well as a plurality of passive and/or active electrical components 11, 12, 13, 14 and 15 disposed in a matrix arrangement on this printed circuit board 17. The flexible multi~layer printed circuit board 17 is laminated, such as thermocompression bonded to the base panel 16. The stepped or offset portion 1~' of the base panel or plate 16 bears a substantially frame-shaped elastic intermediate layer 19 which is preferably manufactured from an elastomeric material and functions as a compression or pressure element ser~ing to absorb mechanical stress in the arrangement.

A contact element or pad 18 corresponding in shape essentially to the shape of the intermediate layer or spacer structure 19 is connected to the printed circuit board 17 by means of the contact or connecting conductors or structure 20. In a preferred embodiment the contact or connecting conductors 20 are formed by the flexible ends or peripheral portions of the printed circuit board 17 (see Figure 4), which at least on two sides are bent to extend downwardly past the base panel or plate 16 and are positioned between the intermediate layer 19 and the contact element or pad 18, as shown in Figure ~. Each individual modular unit or module 10 or 10', as the case may be, can be cover~d by means of an appropriately formed cover member or hood or lid 40 covering the electrical components 11 to 15 t as schematically indicated in Figure 2 by a chain-dotted line.

Figure 3 shows in sectional view a portion of the support structure or element 30 with ~odular units or modules 10 and 10' disposed on both sides or surfaces thereof~

The support structure or element 30 comprises a first metallic plate 26 and a second metallic plat~ 27.
These first and second plates 26 and 27 are spaced from one another by appropriately arrang~d spacer elements, such as lamellae or plates 28 which are dlsposed in inclined relationship to one another and positioned, for instance, such that there is formed a honeycombed structure. These spaced and parallely positioned first and second plates 26 and 27 are attached to each other by the spacer lamellae or plates 28 to form a hollow space 25 between these two plates 26 and 27 and which hollow space 25 assures for good heat transfer or dissipation between the two spaced plates 26 and 27.

These two spaced plates 26 and 27 of the support structure or element 30 are bondingly laminated to associated printed circuit boards 21 and 23 which are pre~erably multi-layer printed circuit boards provided with appropriately configured recesses 22 and 24 for receiving and thermally connecting or attaching the related stepped or offset portion 16' of the base panel or plate 16 of each modular unit 10 to these two plates 26 and 27. In the assembled state the modular units 10 and 10' are disposed in the recesses 22 and 24 through their stepped or offset portions 16' and fastened by means of the screws 36 or the like on the s~pport structuxe or element 30 a~ainst the restoring force of the elastic intermediate layer or spacer 19, as shown in Figure 1. This results, on the one hand, in a good thermal connection of the stepped or offset portion 16' with the respective plates 26 and 27 and, on the other hand, assures for a likewise good electrical contact between the contact pads or elements 18 and their opposite counter-contacts on the multi-layer printed circuit boards 21 and 23. These multi-layer printed circuit boards 21 and 23 are electrically connected with the printed circuit boards 17 through the connection conductors or lines 20.

Figure 4 shows in perspective view a modular unit 110 or 110', as the case may be, provided with a cover member or hood or lid~140. In contrast to the modular units 10 and 10' of the embodiment of Figure 2, here the connecting structures or connecting conductors 120 and 120' are configured to possess a greater surface and their peripheral portions protrude laterally from the depicted arrangement.
Additionally, there is partially visible the stepped or offset portion 16' of the base panel 16.

Figure 5 shows a multiple printed circuit board system 50 comprising two support structures or elements 30 equipped with the modular units 110 and 110' on both surfaces or sides as well as a further support structure or element 30' provided with modular units 110' on one surface or side.
The support structures or elements 30 and 30l, here shown in a simplified Eorm, are spaced from one another by means of the frame structures or parts 52 and 53 and bear by means of their not particularly referenced edges upon these frame structures or parts 52 and 53 provided with enclosing support or beaxing surfaces.

_ 9 _ ~ 2.~

The resultant housing-like encased printed circuit board system 50 is covered by means of an upper cover or hood 51 and a lower cover or hood 54. The components or parts 51, 52, 53 and 54 are mutually sealed by means of conventional seals 55, 55' and 55'' and are fastened together into a tower-like structural unit or stack structure by not particularly show screws or other conventional attachment means~ The spaced support structures or elements 30 and 30' are interconnected by means of contact pins or elements 56 and 57 which are preferably of resilient construction and which extend to, and are in contact with, the contact surfaces of the printed circuit boards 21 and 23. The hollow spaces 130 between the modular units llO and 110' are foamed with a conventional material, such as a dielectric material, to form a so-called pressure pad 60, 61 an~ 62. In this case, the screw connection 36 shown in Figura 1 may be omitted.

Plug-in connections 65, 66 and 67 are arranged on the upper cover or hood 51 of the printed circuit board system 50 and are appropriately spaced from each other.
These pl~g~in connections 65, 66 and 67 are connacted by means of conductoxs or lines 65', 66' and 67' with appropriate plug-in sockats 68 and 69 located on the uppermost support structure or element 30'.

~..5~

It should be emphasized that the modular units 10, 10' and 110, 110', by virtue of their standardized size, may be manu~actured at comparatively low cost and may be designed in an optimal way with regard to development, manufacture, testing and reliability of the circuit structures. The dimensions required for the modular units 10, 10' and 110, 110' a~e moderate with regard to circuit technology and allow a simple, separate and functional testing of each individual modular unit.

~rrO~
The printed cixcuit board~45 equipped with the modular units 10, 10' as well as the printed circuit board system or assembly 50 equipped with the modular units 110 and 110' assure optimal heat elimination or dissipation. The thermal energy is transferred from the electronic components (semiconductor components) 11, 12, 13, 14 and 15 via the base panel 16 to the support structures or elements 30 and 30' provided with the hollow space 25, and this thus prevents damage due to local overheating.

Claims

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1. A connection and circuit arrangement for integrated semiconductor and hybrid units comprising:
a first printed circuit board;
a plurality of electrical components arranged on and electrically connected to the first printed circuit board;
a base panel laminated to said printed circuit board;
said base panel, first printed circuit board and plurality of electrical components substantially defining a modular unit, at least one support structure provided with a second printed circuit board on one surface thereof; and a plurality of said modular units being disposed and electrically interconnected in a matrix arrangement on said at least one support structure and fastened thereon in a detachable manner.

2. The connection and circuit arrangement as defined in claim 1, wherein:
said first printed circuit board defines a multi layer printed circuit board.

3. The connection and circuit arrangement as defined in claim 1, wherein:
said electrical components comprise at least active electrical components.

4. The connection and circuit arrangement as defined in claim 1, wherein:
said electrical components comprise at least passive electrical components.

5. The connection and circuit arrangement as defined in claim 1, wherein:
said electrical components comprise both passive and active electrical components.

6. The connection and circuit arrangement as defined in claim 1, wherein:
said at least one support structure has opposite surfaces;
said plurality of modular units comprising modular units which are detachably disposed in a substantially matrix arrangement on each of said opposite surfaces of said at least one support structure; and an interconnect bar arranged at an end surface of said at least one support structure.

7. The connection and circuit arrangement as defined in claim 1, further including:
at least two of said support structures;
each of said at least two support structures being provided with a respective plurality of said modular units;
said respective plurality of said modular units superimposed in a spaced arrangement and disposed on said at least two support structures;
means for enclosing said plurality of modular units and said at least two support structures to define an encased printed circuit board system; and means for electrically interconnecting said respective plurality of modular units with one another.

8. The connection and circuit arrangement as defined in claim 7, wherein:
said support structures and said respective plurality of modular units are arranged such as to form therebetween hollow spaces which are pressure foamed with a foamable material.

9. The connection and circuit arrangement as defined in claim 1, wherein:
said base panel defines a metallic base panel;

said support structure comprising a pair of spaced metallic plates intermediate of which there is formed a hollow space; and said plurality of said modular units together with said metallic base panels being arranged upon one of the spaced metallic plates of said support structure.

10. The connection and circuit arrangement as defined in claim 9, further including:
a substantially frame-shaped elastic intermediate layer disposed between a predetermined one of said metallic plates of said support structure and said metallic base panels of said modular units.

11. The connection and circuit arrangement as defined in claim 10, further including:
connecting conductor means extending from each of said base panels of said modular units below a peripheral portion of said base panels;
a contact pad; and said connecting conductor means being disposed between said elastic intermediate layer and said contact pad.

12. The connection and circuit arrangement as defined in claim 1, wherein:

said support structure comprises two plates arranged in substantially spaced parallel relationship with respect to one another; and a plurality of lamellae arranged in inclined relationship to one another and secured to said two plates.

13. The connection and circuit arrangement as defined in claim 2, wherein:
said second printed circuit board is laminated with said support structure and is provided with a plurality of recesses for receiving said modular units;
said recesses being disposed in a substantially matrix-like arrangement; and said modular units being positioned in said substantially matrix-like arrangement of recesses.

14. The connection and circuit arrangement as defined in claim 7, further including:
said enclosing means including a housing having a cover and plug elements arranged at said cover; and electrical contact elements and conductor means for operatively interconnecting said support structures with one another and with said plug elements arranged at the housing cover.