CN2901579Y - Heat conductive element - Google Patents
Heat conductive element Download PDFInfo
- Publication number
- CN2901579Y CN2901579Y CN 200520142728 CN200520142728U CN2901579Y CN 2901579 Y CN2901579 Y CN 2901579Y CN 200520142728 CN200520142728 CN 200520142728 CN 200520142728 U CN200520142728 U CN 200520142728U CN 2901579 Y CN2901579 Y CN 2901579Y
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- China
- Prior art keywords
- heat
- flange
- heat conducting
- conducting element
- holding part
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- Expired - Fee Related
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Abstract
The utility model is a thermal conductivity component installed on a heating component with exposed a flange whereby conducting the heat from the heating component. The heating component comprises a containing part for the flange to which each side surface of the flange is connected to, which increases the connecting area between the heating component and the flange and improves the heat transfer efficiency of the heating component. The heating component in this utility model can make each side surface of the flange is connected to the containing part, which increases the connecting area between the heating component and the flange and improves the heat transfer efficiency of the heating component. Compared with the existing technology, the heating component in this utility model can greatly increase the connecting area between the heating component and the flange and improves the heat transfer efficiency of the heating component, and meanwhile the utility model has the advantages of the simple structure and the easiness in assembly.
Description
Technical field
The utility model is about a kind of heat conducting element, particularly is arranged on about a kind of being applicable to
Has the heat conducting element in the heater element that exposes flange.
Background technology
As the maincenter part of computer, its importance is self-evident for the central processing unit (CPU, CentralProcessor Unit) of responsible Computing and major control function.Because computer science and technology constantly develops and integrated circuit production technology ground constantly promotes, it is more and more fast to make central processing unit carry out the speed of calculating, yet, the speed that central processing unit is carried out is faster, the corresponding heat that itself the produces height of also can healing, if the heat of failing in time central processing unit to be produced spreads rapidly, then will influence the fail safe of computer operation, promptly can influence the arithmetic speed of central processing unit such as the lasting rising of temperature, make it more and more slow and cause and work as machine, even cause central processing unit to burn.Therefore, for the heat that can make central processing unit is in time derived and fully diffusion, allow central processing unit under normal operating temperature, carry out computing and other inter-related task, the most direct, simple at present method is to install a radiator on central processing unit additional, the heat that central processing unit is produced can shed by this radiator, keeps central processing unit to carry out the stability of computing.
Be usually used in the heat dissipation design in the computer at present, mostly adopt one can carry out heat radiation work with the contacted radiator of the heater element of for example central processing unit, simultaneously, for preferable radiating effect is provided, also fan is set so that active thermal convection effect to be provided mostly on this radiator.Yet, in the small space of for example notebook computer, for example do not have enough height on the heater element of central processing unit and be used to be provided with radiator with some radiating fins, therefore generally be to adopt the design that heat-conducting plate is set on heater element, conduct heat near the set radiator in the outside by for example heat pipe (HeatPipe) again, and the fan of arranging in pairs or groups equally is to carry out active thermal convection.
Relevant above-mentioned heat-conducting plate or the radiator of utilizing is arranged on the heater element, it is as shown in Figure 1 that heat conducting prior art is provided, this heater element 1 surface is to have one to expose flange 11 (heat that heater element 1 work produces all concentrates on this and exposes flange 11), 12 of heat-conducting plates are arranged on this and expose on the flange 11, and expose being equipped with heat-conducting glue (not marking) between the flange 11 to increase both contacts area usually at this heat-conducting plate 12 and this, the heat that this heater element 11 is produced is led apace by this heat-conducting plate 12 and is shed.
Can significantly find out, effective heat transfer area of this heater element 11 only exposes flange 11 and these heat-conducting plate 12 contacted surfaces for this in the prior art, promptly this exposes the end face of flange 11, so the heat conduction efficiency of this heat-conducting plate 12 depends on that this exposes the area size of flange 11, under the situation that can not change heater element 11, the way of prior art has only the volume that increases heat-conducting plate 12 at present, but in the limited space of thin type electronic devices such as for example notebook computer, area or increase highly for heat-conducting plate 12, also be unpractical undoubtedly, therefore still do not have effective solution at present.
Therefore, how to develop a kind of heat conducting element that can solve above-mentioned prior art shortcoming,, can improve its heat-sinking capability, the real problem that needs to be resolved hurrily for present industry not enlarging under the prerequisite of the heat conducting element volume of heat-conducting plate for example.
The utility model content
For solving the shortcoming of above-mentioned prior art, main purpose of the present utility model is to provide a kind of heat conducting element that promotes heat conduction efficiency.
Another purpose of the present utility model is to provide a kind of simple in structure, heat conducting element of being easy to assemble.
For reaching above-mentioned and other purpose, the utility model provides a kind of heat conducting element, being arranged on one has on the heater element that exposes flange, expose flange by this and conduct the heat that this heater element produces, this heater element comprises: this heat conducting element has one in order to hold the holding part of this flange, this each side surface that exposes flange all is contacted with this holding part, has increased this heat conducting element and this exposes the contact area of flange, promotes the heat conduction efficiency of this heat conducting element.
Wherein this heat conducting element also can comprise a heat sink liner, be the inner surface of this holding part of being laid in, plug the gap after the heat that is produced by this heater element is softened, this is exposed in the holding part that flange fits in this heat conducting element fully, wherein, this heat sink liner can be the heat conduction with phase change pad.The basal area of this holding part is to be slightly larger than this heater element, for above-mentioned heat sink liner is set.This heater element can be that a surface has the power component that exposes flange, and wherein, this power component can be the central processing unit that is applied in the computer.The degree of depth of this holding part can guarantee that this exposes each side surface that flange can be contacted with this holding part fully less than this thickness that exposes flange.In addition, this holding part can be a groove, and this heat conducting element can be a heat-conducting plate, for example is aluminium matter heat-conducting plate.
Heat conducting element of the present utility model, can make each side surface that exposes flange of heater element all be contacted with this holding part, increase this heat conducting element and this exposes the contact area of flange, and then promote the heat conduction efficiency of this heat conducting element, compared with prior art, heat conducting element of the present utility model can increase the contact area that exposes flange with heater element greatly, thereby promotes the heat conduction efficiency of heater element really, and the utility model also has characteristics simple in structure, that be easy to assemble simultaneously.
Description of drawings
Fig. 1 is that the side of the heat conducting element assembled state of prior art is cutd open schematic diagram;
Fig. 2 is the decomposing schematic representation of heat conducting element assembled state of the present utility model;
Fig. 3 A is the floor map of heat conducting element of the present utility model; And
Fig. 3 B is that the side of heat conducting element assembled state of the present utility model is cutd open schematic diagram.
Embodiment
Embodiment
See also Fig. 2, it is that the side of heat conducting element 2 assembled states of the present utility model is cutd open schematic diagram, as shown in the figure, this heat conducting element 2 is applicable to that one has the heater element 3 that exposes flange 31, in the present embodiment, this heater element 3 is central processing units, and has and be positioned at its surface exposed flange 31, and the bottom surface of this heat conducting element 2 has correspondence and holds this holding part that exposes flange 31 21.
Please cooperate and consult Fig. 3 A, it is the floor map of heat conducting element 2 of the present utility model, as shown in the figure, these heat conducting element 2 one of them surfaces are provided with one and hold the holding part 21 that this heater element 3 exposes flange 31, and each side surface that this heater element 21 exposes flange 31 all can contact effectively with these holding part 21 inwalls.In the present embodiment, this heat conducting element 2 is one to have the structure of preferable heat conductivility, the structure of making by the aluminum plate material for example, special for example is the heat-conducting plate that is applied in the notebook computer, also can be equiped with for example integrated aluminium heat sink (not marking) on another surface of heat conducting element 2 (end face), help the active thermal convection that provides preferable.
This holding part 21 for example is the structure of groove, and its shape and size are corresponding with the shape that exposes flange 31 and the size of heater element 3, and therefore can hold this exposes flange 31.In the present embodiment, the size of holding part 21 is to be slightly larger than the size that this exposes flange 31, this is exposed flange 31 is accommodated in this holding part 21, so, not only can make things convenient for the assembling operation of heat conducting element 2, also can protect heater element 3 and expose the extruding that flange 31 is not subjected to the periphery of holding part 21 to cause damage; In addition, the degree of depth of this holding part 21 is to be slightly less than the thickness that exposes flange 31, when this exposes in the flange 31 ccontaining holding parts 21, can between these heater element 3 surfaces and this heat conducting element 2, provide a preset clearance, prevent that heat conducting element 2 from touching this heater element 3 surfaces, each side surface that causes exposing flange 31 does not contact fully with this holding part 21.More preferably, holding part 21 is provided in a side of the geometric center position of heat conducting element 2 bottom surfaces, with the harmony that helps dispelling the heat.
In addition, this heat conducting element 2 also can comprise and utilizes a heat sink liner (not marking), it is these holding part 21 inwalls that evenly are laid in, and when the exposing flange 31 and be accommodated in holding part 21 of this heater element 3, be interposed between the inwall that exposes flange 31 and holding part 21, in the present embodiment, this heat sink liner for example is the heat conduction with phase change pad, it can be by the heat of heater element 21 generation when working, its surperficial wax is heated dissolves, fill up holding part 21 and expose preset clearance between the flange 31 with this, make and expose holding part 21 inwalls that flange 31 is fitted in heat conducting element 2 fully.
Please cooperate and consult Fig. 3 B, when assembling, at first provide a heat sink liner, and with its holding part 21 inwalls that evenly are laid in; Then, expose flange 31, press down this heat conducting element 2 again, the flange 31 that exposes of heater element 21 is accommodated in this holding part 21 what the holding part 21 of heat conducting element 2 was right against heater element 3; Then, heat sink liner is filled up holding part 21 and is exposed between the flange 31, makes the flange 31 that exposes of heater element 3 fit tightly holding part 21 inwalls at heat conducting element 2.So, heater element 3 expose flange 31 each side surface holding part 21 of thermal contact conductance element 2 all effectively, can effectively conduct the heat that heater element 3 produces, expose flange 31 effective contacts area with this, promote the heat-conductive characteristic of heat conducting element 2 effectively thereby increase heat conducting element 2.
The length and width that expose flange 31 of supposing this heater element 3 are of a size of 8mm * 12mm, if adopt prior art, and effective heat transfer area of heater element 3 then, the size that is its end face is 96mm
2Accordingly if adopt heat conducting element 2 of the present utility model, wherein, the degree of depth of supposing this holding part 21 is 0.5mm, then heater element 2 increases with this and exposes the surface area that area that flange 31 contacts is each side, therefore, effective contact area of this heater element 2 is: (8+12) * and 2 * 0.5=20mm
2, compared with prior art, whole contact area of the present utility model has improved more than 20%, thereby can improve the heat-conductive characteristic of heat conducting element 2 really effectively.
Therefore, heat conducting element of the present utility model, has a design in order to the holding part that holds flange, make this each side surface that exposes flange all be contacted with this holding part, compared with prior art, can increase this heat conducting element and this exposes the contact area of flange, and then promote the heat conduction efficiency of this heat conducting element, and have the advantage that is easy to assemble simple in structure.
Claims (10)
1. a heat conducting element is arranged on one and has on the heater element that exposes flange, it is characterized in that: this heat conducting element has one in order to hold the holding part of this flange, and this each side surface that exposes flange all is contacted with this holding part.
2. heat conducting element as claimed in claim 1, it is characterized in that this heat conducting element also comprises a heat sink liner, the inner surface of this holding part that is laid in, plug the gap after the heat that this heater element produces is softening, this is exposed in the holding part that flange is fitted in this heat conducting element fully.
3. heat conducting element as claimed in claim 2 is characterized in that, this heat sink liner is the heat conduction with phase change pad.
4. heat conducting element as claimed in claim 1 is characterized in that, the cross dimensions of this holding part is to be slightly larger than this to expose flange.
5. heat conducting element as claimed in claim 1 is characterized in that, this heater element is that a surface has the power component that exposes flange.
6. heat conducting element as claimed in claim 5 is characterized in that, this power component is the central processing unit that is applied in computer.
7. heat conducting element as claimed in claim 1 is characterized in that the degree of depth of this holding part exposes the thickness of flange less than this.
8. heat conducting element as claimed in claim 1 is characterized in that, this holding part is a groove.
9. heat conducting element as claimed in claim 1 is characterized in that, this heat conducting element is a heat-conducting plate.
10. heat conducting element as claimed in claim 1 is characterized in that, this heat conducting element is an aluminium matter heat-conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520142728 CN2901579Y (en) | 2005-12-09 | 2005-12-09 | Heat conductive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520142728 CN2901579Y (en) | 2005-12-09 | 2005-12-09 | Heat conductive element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2901579Y true CN2901579Y (en) | 2007-05-16 |
Family
ID=38085743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520142728 Expired - Fee Related CN2901579Y (en) | 2005-12-09 | 2005-12-09 | Heat conductive element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2901579Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107335121A (en) * | 2011-06-16 | 2017-11-10 | 瑞思迈有限公司 | Humidifier and laminar heating element heater |
| CN109479384A (en) * | 2016-09-27 | 2019-03-15 | 深圳市大疆创新科技有限公司 | Radiator structure, electronic device, holder and aircraft |
| CN110267504A (en) * | 2019-07-19 | 2019-09-20 | 深圳市睿晖新材料有限公司 | A kind of conductive structure |
-
2005
- 2005-12-09 CN CN 200520142728 patent/CN2901579Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107335121A (en) * | 2011-06-16 | 2017-11-10 | 瑞思迈有限公司 | Humidifier and laminar heating element heater |
| US11504495B2 (en) | 2011-06-16 | 2022-11-22 | ResMed Pty Ltd | Humidifier and layered heating element |
| CN109479384A (en) * | 2016-09-27 | 2019-03-15 | 深圳市大疆创新科技有限公司 | Radiator structure, electronic device, holder and aircraft |
| CN110267504A (en) * | 2019-07-19 | 2019-09-20 | 深圳市睿晖新材料有限公司 | A kind of conductive structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070516 Termination date: 20111209 |