CN205680045U - Fin and computing device - Google Patents
Fin and computing device Download PDFInfo
- Publication number
- CN205680045U CN205680045U CN201620475294.8U CN201620475294U CN205680045U CN 205680045 U CN205680045 U CN 205680045U CN 201620475294 U CN201620475294 U CN 201620475294U CN 205680045 U CN205680045 U CN 205680045U
- Authority
- CN
- China
- Prior art keywords
- fin
- heat dissipation
- dissipation base
- power plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 109
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000004364 calculation method Methods 0.000 claims description 64
- 230000005855 radiation Effects 0.000 claims description 22
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 14
- 239000004519 grease Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 26
- 238000000034 method Methods 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 22
- 238000001816 cooling Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a fin and computing equipment for promote the radiating effect. The computing device includes: the fin adopts heat conduction material, includes: the heat dissipation base is flat; the heat dissipation base comprises a plurality of fins, a heat dissipation base and a plurality of heat dissipation fins, wherein the fins are vertically connected with one surface of the heat dissipation base, at least one cutting groove is formed in each fin, and the plane where the cutting groove is located is respectively vertical to the plane where the heat dissipation base is located and the planes where the fins are located; the computing equipment also comprises a computing board which is attached to the other surface of the heat dissipation base and used for processing tasks. Adopt the utility model provides a computing equipment will calculate power board and the laminating of heat dissipation base, has guaranteed to calculate the biggest area of contact of power board and fin, has promoted the radiating effect, secondly, through cutting one or more grooving on the fin, has shortened fin length, has reduced the windage among the radiating process, has further promoted the radiating effect.
Description
Technical field
This utility model relates to technical field of heat dissipation, particularly to a kind of fin and the equipment of calculating.
Background technology
Along with the development of science and technology, high performance calculating equipment, in order to meet high-performance and portable demand, needs to make to set
Standby calculating and disposal ability are increasingly stronger, and volume but requires more and more less, such demand, makes in calculating device handler
Computing module, the closeness processing the parts such as chip are the highest, and then make the heat that processor produces in running
Increasing.Especially some high performance calculating equipment, get rid of processor running without good fin
Heat produced by, the stability that will result in entirety reduces, and even can shorten the life-span of electronic equipment itself.Thus, Gao Xing
The equipment that can calculate has high requirement to heat radiation.
Under normal circumstances, due to fin and the difference of processor specification, such as, the heat radiation in central processing unit (CPU)
Device, is made up of fin and fan, and production firm is in order to adapt to Circular fan, and fin is also configured as the fan head with fan
The circular configuration that size is identical, and the central processing unit of computer is typically rectangular structure, thus, by circle in computer
Fin contacts with the rectangular surfaces in central processing unit, it is impossible to ensure to be fully contacted.Such heat dissipation technology, for general electricity
For subset, radiating effect or acceptable, but the heat produced when high-capability computing device runs is excessive, so
Heat dissipation technology can not meet the cooling requirements of high-capability computing device, say, that current high-capability computing device
Radiating effect, can not meet the cooling requirements during self-operating, and this is also that a lot of high-performance equipment is running a timing
Need to close the reason of a period of time after between, thus, how to design the calculating equipment that a kind of heat dispersion is good, dissipate to promote
Thermal effect, is a technical problem urgently to be resolved hurrily.
Utility model content
This utility model provides a kind of fin and the equipment of calculating, in order to improving radiating effect.
This utility model provides a kind of calculating equipment, including:
Fin, uses Heat Conduction Material, including:
Heat dissipation base, for tabular；
Multiple fins, are vertically connected with the one side of heat dissipation base, and fin has at least one grooving, and described grooving place is put down
Face is vertical with multiple planes of described heat dissipation base place plane and the plurality of fin place respectively；
Calculation power plate, fits with the another side of heat dissipation base, is used for processing task.
The beneficial effects of the utility model are: fitted with heat dissipation base by calculation power plate, it is ensured that calculate power plate and fin
Maximum contact area, secondly improve radiating effect, by cutting one or more grooving on fin, shorten fin long
Degree, decreases the windage in radiation processes, improves radiating effect further.
In one embodiment, heat dissipation base includes: the first heat dissipation base and the second heat dissipation base；Multiple fins include:
First group of fin and second group of fin；
First heat dissipation base is parallel relatively with the second heat dissipation base plane；
First group of fin and second group of fin are between the first heat dissipation base and the second heat dissipation base.
Having the beneficial effects that of the present embodiment: the calculation power plate that will be responsible for calculating is divided into two pieces to calculate power plate, makes and fin
Contact surface is become two faces from a face, increases contact area, improves radiating effect.
In one embodiment,
At least one is had for the chip processing task on described calculation power plate；
The another side of described heat dissipation base has the number one of at least one groove, the number of described groove and described chip
Cause, the form fit of the chip in the shape of described groove and described calculation power plate correspondence position.
Having the beneficial effects that of the present embodiment: the number of heat dissipation base another side groove and the chip number one calculated on power plate
Cause, the form fit of the chip in shape and calculation power plate correspondence position, thus, when heat dissipation base and calculation power plate laminating, calculation power plate
On chip can have fully embedded in the groove of heat dissipation base, i.e. calculate the chip top on power plate and edge all can be with the heat radiation end
Seated connection touches, and increases the contact area of calculation power plate and heat dissipation base, improves radiating effect.
In one embodiment, described calculating equipment also includes: heat-conducting silicone grease, be used for being filled in described first calculate power plate and
Between first heat dissipation base, and described second calculates between power plate and the second heat dissipation base.
Having the beneficial effects that of the present embodiment: use the good heat-conducting silicone grease of heat conduction be filled in calculation power plate and heat dissipation base it
Between, thus realizing calculation power plate and the seamless link of heat dissipation base, the conduction making heat is more smooth and rapid, improves further
Radiating effect.
In one embodiment, described calculating equipment also includes: master control borad, and wherein, described master control borad is placed in described heat radiation
Sheet is not fitted the side of calculation power plate.
Having the beneficial effects that of the present embodiment: master control borad is placed in fin the side of calculation power plate of not fitting, makes main
Control plate can contact with fin, beneficially master control borad heat radiation.
In one embodiment, described calculating equipment also includes: upper casing and lower casing, and wherein, described upper casing is formed with lower casing
Power plate, the second calculation power plate, fin and the cuboid shell of master control borad is calculated for wrapping up described first.
Having the beneficial effects that of the present embodiment: by upper casing with lower casing by calculation power plate, fin and the master in calculating equipment
Control plate parcel, thus be an entirety by calculating equipment packages, it is simple to carry and assemble.
In one embodiment, described calculating equipment also includes:
Front end assemblies, is fixed in described fin first side vertical with calculation power plate and fin, including:
Front end-plate, centre is provided with hollow rectangle framework；
Front end reticular lamina, is embedded in described hollow rectangle framework；
Aft-end assembly, be fixed in described fin second side relative with described first side and with described front group
Part is parallel relatively, including:
End plate, is fixed on described second side；
Fan installation plate, is fixed on described end plate；
Fan, is fixed on described fan installation plate.
Having the beneficial effects that of the present embodiment: by installing front end assemblies and aft-end assembly on the computing device, so that
Equipment running process is accelerated air circulation, further improving radiating effect.
In one embodiment, the front end-plate in described front end assemblies is fixed on the first side of described fin by screw
Face；
End plate in described aft-end assembly is fixed on the second side of described fin by screw.
Having the beneficial effects that of the present embodiment: by the front end version in front end assemblies being fixed on and calculating power plate and fin hangs down
The first straight side, is fixed on second side relative with the first side, it is possible to cuboid by the end plate in aft-end assembly
Two faces do not wrapped up by upper casing and lower casing in shell are blocked, it is achieved that to calculate equipment fully enclosed.
This utility model also provides for a kind of fin, including:
First heat sink body, is placed in calculating equipment, including:
First heat dissipation base, for tabular；
Multiple first group of fin: vertical with the one side of described first heat dissipation base be connected, on the plurality of first group of fin
Have at least one grooving, described grooving place plane respectively with described first heat dissipation base place plane and the plurality of first group
Multiple planes at fin place are vertical.
First group of fin of first group of fin, first group of fin the beneficial effects of the utility model of first group of fin are: pass through
First group of fin cuts one or more grooving, shortens fin length, decrease the windage in radiation processes, improve scattered
Thermal effect.
In one embodiment, described fin also includes:
Second heat sink body, is placed in calculating equipment, including:
Second heat dissipation base, for tabular；
Multiple second group of fin: vertical with the one side of described second heat dissipation base be connected, on the plurality of second group of fin
Have at least one grooving, described grooving place plane respectively with described second heat dissipation base place plane and the plurality of second group
Multiple planes at fin place are vertical.
Having the beneficial effects that of the present embodiment: by cutting one or more grooving on second group of fin, shorten fin
Length, decreases the windage in radiation processes, improves radiating effect.
In one embodiment, described first heat sink body and described second heat sink body are Heat Conduction Material.
Having the beneficial effects that of the present embodiment: owing to the first heat sink body and the second heat sink body are all Heat Conduction Materials, because of
And heat produced by the calculation power plate that can will fit with heat dissipation base runs through heat dissipation base conduction to fin, further
Improving radiating effect.
Other features and advantages of the utility model will illustrate in the following description, and, partly from description
In become apparent, or by implement this utility model and understand.The purpose of this utility model and other advantages can be passed through
Structure specifically noted in the description write, claims and accompanying drawing realizes and obtains.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Accompanying drawing explanation
Accompanying drawing is used for providing being further appreciated by of the present utility model, and constitutes a part for description, with this practicality
Novel embodiment is used for explaining this utility model together, is not intended that restriction of the present utility model.In the accompanying drawings:
Figure 1A is a kind of structural representation calculating equipment in this utility model one embodiment；
Figure 1B be fully enclosed in this utility model one embodiment after calculate equipment structural representation；
Fig. 2 is the installation site schematic diagram of master control borad 105；
Fig. 3 A is top view (left) and the side view (right) of the first heat sink body 103；
Fig. 3 B is the first heat sink body 103 and structural representation of the first calculation power plate 101；
Fig. 3 C is the structural representation of the first heat sink body 103；
Fig. 3 D is top view (left) and the side view (right) of heat sink body in prior art；
Fig. 4 A is top view (left) and the side view (right) of the second heat sink body 104；
Fig. 4 B is the second heat sink body 104 and structural representation of the second calculation power plate 102.
Detailed description of the invention
In order to be more clearly understood that above-mentioned purpose of the present utility model, feature and advantage, below in conjunction with the accompanying drawings and tool
This utility model is further described in detail by body embodiment.It should be noted that in the case of not conflicting, this reality
Can be mutually combined by the embodiment in novel and the feature in embodiment.
Elaborate a lot of detail in the following description so that fully understanding this utility model, but, this practicality
Novel can implement to use other to be different from mode described here, therefore, protection domain of the present utility model is not subject to
The restriction of following public specific embodiment.
Figure 1A is a kind of structural representation calculating equipment in this utility model one embodiment, and this calculating equipment is high-performance
Calculating equipment, can produce substantial amounts of heat in running.As shown in Figure 1A, Figure 1B and Fig. 4 A, this calculating equipment includes: the
One calculation power plate the 101, second calculation power plate 102 and the fin being placed between the first calculation power plate 101 and the second calculation power plate 102, wherein,
As shown in Figure 3A, this fin includes: the first heat radiation that the first heat dissipation base 1031 and multiple first group of fin 1032 are constituted is main
Body 103, and the second heat sink body that the second heat dissipation base 1041 as shown in Figure 4 A and multiple second group of fin 1042 are constituted
104, wherein, the first heat dissipation base 1031 and multiple fin 1032 vertically connect, the second heat dissipation base 1041 and multiple second group
Fin 1042 vertically connects, first calculate power plate 101 and second calculate power plate 102 respectively with the first heat dissipation base 1031 in Fig. 3 A and
The second heat dissipation base 1041 in Fig. 4 A does not has the side of fin to fit, is used for processing appointing received by calculating equipment
Business.
Calculating equipment will can produce in running the first calculation power plate 101 He of two pieces of rectangles of processor of heat
Second calculates power plate 102 substitutes, thus, make the calculation power plate of generation heat have contact bigger with fin than traditional processor
Area, secondly, in calculating the power plate course of processing, is processed as calculating power plate and the first heat dissipation base 1031 and second in fin
The on all four rectangular configuration of shape of heat dissipation base 1041, so that first calculates power plate the 101, second calculation power plate 102 and heat radiation
The first heat dissipation base 1031 and the second heat dissipation base 1041 in sheet can completely overlapped be fitted, thus, farthest increase
Calculation power plate and the contact area of fin.Such design, enables calculating equipment to keep long lasting for running without sending out
The situation that in generating apparatus, heat is too high.
The beneficial effects of the utility model are: first, and the calculation power plate that will be responsible for calculating is divided into two pieces to calculate power plate, make and dissipate
The contact surface of backing is become two faces from a face, increases contact area, improves radiating effect, secondly, calculates power plate for two pieces
And laminating overlapping with the two of fin heat dissipation bases respectively, i.e. calculating power plate is overlapping with cooling fin fin base, it is ensured that each
Calculation power plate and the maximum contact area of fin, improve radiating effect further.
In one embodiment, first power plate the 101, second calculation power plate the 102, first heat dissipation base 1031 and the second heat radiation are calculated
Base 1,041 4 is equivalently-sized rectangular configuration, and the plane at four places is parallel.
Having the beneficial effects that of the present embodiment: calculate 102, the first heat radiation end of power plate by arranging the first calculation power plate 101, second
Seat 1031 is the most identical with the second heat dissipation base 1,041 4 shape size, so that calculation power plate and heat dissipation base can be the heaviest
Folded, make the contact area of calculation power plate and heat dissipation base reach maximum, improve radiating effect.
In one embodiment,
At least one is had for the chip processing task on calculation power plate；
The another side of heat dissipation base has at least one groove, and the number of groove is consistent with the number of chip, the shape of groove
Form fit with the chip calculated on power plate correspondence position.
In existing calculating equipment, generally only have surface area relatively big and caloric value larger chip (such as computer CPU and GPU)
Need separate heat sinks to be installed to realize chip cooling cooling purpose.Fig. 3 D is the top view (left) of heat sink body in prior art
With side view (right), it can be seen that in prior art, heat dissipation base is not provided with groove, thus, it is impossible to ensure heat dissipation base
With being fully contacted of chip, thus radiating effect is the best.
And in this programme, the first calculation power plate 101 and the second calculation power plate 102 have multiple chip, if each chip
One separate heat sinks is installed, relatively costly, and installation process is complicated, it is clear that and it is inappropriate, for solving this problem, we
In case, as shown in Figure 3 A and Figure 3 B, the heat radiation using a first sufficiently large fin 103 to solve the first calculation power plate 101 is asked
Topic, its first heat dissipation base 1031 can cover all chips 1035 on the first calculation power plate 101, and, the first heat dissipation base 1031
On have multiple groove 1034, it is identical that the number of these grooves 1034 calculates chip 1035 number on power plate 101 with first, and first
After heat dissipation base 1031 and the first calculation power plate 101 laminating, chip 1035 can embed in the groove 1034 of same position, thus, make
The top of chip 1035 can contact with the first heat dissipation base 1031 with both sides therein, increases contact area.
In like manner, as shown in Figure 4 A and 4 B shown in FIG., same employing one the second sufficiently large fin 104 solves the second calculation power plate
The heat dissipation problem of 102, its second heat dissipation base 1041 can cover all chips 1045 on the second calculation power plate 102, and, second dissipates
Having multiple groove 1044 on backing 104, it is identical that the number of these grooves 1044 calculates chip 1045 number on power plate 102 with second,
And after the second fin 104 and the second calculation power plate 102 laminating, chip 1045 can embed in the groove 1044 of same position, from
And, make the top of chip 1045 can contact with the second heat dissipation base 1041 with both sides therein, increase contact area.
Having the beneficial effects that of the present embodiment: the number of heat dissipation base another side groove and the chip number one calculated on power plate
Cause, the form fit of the chip in shape and calculation power plate correspondence position, thus, when heat dissipation base and calculation power plate laminating, calculation power plate
On chip can have fully embedded in the groove of heat dissipation base, i.e. calculate the chip top on power plate and edge all can be with the heat radiation end
Seated connection touches, and increases the contact area of calculation power plate and heat dissipation base, improves radiating effect.
In one embodiment, first calculates between power plate 101 and the first heat dissipation base 1031, and second calculates power plate 102
With second be filled with heat-conducting silicone grease between heat dissipation base 1041.
It is usually the rigid material that the heat conduction such as metal are good owing to calculating power plate and heat dissipation base, thus, calculating power plate and dissipating
When hot base connects, even if its surface is the brightest and the cleanest, space all can be had to occur when contacting with each other, the air in these spaces is
The non-conductor of heat, can hinder the heat conduction to fin.And heat-conducting silicone grease is exactly one can be filled in these spaces,
Make the most smooth and easy rapid flexible material of conduction of heat.
Secondly, the heat-conducting silicone grease in such scheme can also use heat conductive silica gel pad to substitute.
Having the beneficial effects that of the present embodiment: use the good heat-conducting silicone grease of heat conduction be filled in calculation power plate and heat dissipation base it
Between, thus realizing calculation power plate and the seamless link of heat dissipation base, the conduction making heat is more smooth and rapid, improves further
Radiating effect.
In one embodiment, as shown in Figure 1A, calculating equipment also includes: master control borad 105, and wherein, master control borad 105 is placed in
Fin is not fitted the side of calculation power plate.
In the present embodiment, master control borad 105 calculates power for controlling the first calculation power plate 101, second by wired or wireless signal
Plate 102 and fan 112, as in figure 2 it is shown, master control borad 105 is also rectangular configuration, the length of master control borad 105 and the upper table of fin
The width in face is identical, and the upper surface of fin is fixed on by screw in the corner of this master control borad 105, and this fin sets near calculating
Standby front end-plate 108, and carry out clamping with this front end-plate 108, and, owing to the height of front end-plate 108 is higher than fin, because of
And, when encapsulation, certain altitude can be vacated above fin, master control borad 105 is placed in above fin, it is also possible to make full use of
The interior zone of calculating equipment, the encapsulating structure making calculating equipment is compacter.
Having the beneficial effects that of the present embodiment: master control borad 105 is placed in fin the side of calculation power plate of not fitting, makes
Master control borad 105 can contact with fin, and beneficially master control borad 105 dispels the heat.
In one embodiment, calculating equipment also includes: upper casing 106 and lower casing 107, wherein, and upper casing 106 and lower casing 107
Formed and calculate power plate 102, fin and the cuboid shell of master control borad 105 for parcel the first calculation power plate 101, second.
Having the beneficial effects that of the present embodiment: by upper casing 106 with lower casing 107 by the calculation power plate in calculating equipment, heat radiation
Sheet and master control borad 105 wrap up, thus are an entirety by calculating equipment packages, it is simple to carry and assemble.
In one embodiment, calculating equipment also includes: front end assemblies and aft-end assembly, wherein,
Front end assemblies is fixed in described fin first side vertical with calculation power plate and fin, including front end-plate 108
With front end reticular lamina 109, front end-plate 108 is provided with hollow rectangle framework, and front end reticular lamina 109 is embedded in this hollow rectangle framework
In；
Aft-end assembly, be fixed in described fin second side relative with described first side and with described front group
Part is parallel relatively, including end plate 110, fan installation plate 111 and fan 112, the one side of end plate 110 and the second of fin
Fitting in side, thus is fixed on the second side of fin, and the another side of end plate 110 is fitted with fan installation plate 111, uses
Fixing fan installation plate 111, the side not being connected with end plate 110 in fan installation plate is connected with fan, thus, it is achieved
Fan is fixed.
In front end assemblies, the area of front end-plate 108 is greater than front end reticular lamina 109, front end-plate 108 and front end reticular lamina
109 are rectangle, in the centre of front end-plate 108, there is a hollow rectangle framework, this hollow rectangle framework and front end reticular lamina
The area of 109 is identical, is used for inlaying this front end reticular lamina 109.In aft-end assembly, end plate 110, fan installation plate 111 are all
For rectangular box structure, end plate 110 is connected with fan installation plate 111, and the guard of fan 112 is rectangular configuration, size with
Fan installation plate 111 is consistent, and the side being not connected with end plate 110 in the guard of fan 112 and fan installation plate 111 is carried out even
Connect, end plate 110, fan installation plate 111 and fan 112 will be in turn connected to form aft-end assembly.
Having the beneficial effects that of the present embodiment: by installing front end assemblies and aft-end assembly on the computing device, so that
Equipment running process is accelerated air circulation, further improving radiating effect.
In one embodiment, the front end-plate 108 in front end assemblies is fixed on the first side of fin by screw；
End plate 110 in aft-end assembly is fixed on the second side of fin by screw.
By Figure 1A it can be seen that in cuboid shell, only four faces are wrapped up with lower casing 107 by upper casing 106, will heat radiation
Two sides vertical with calculation power plate and fin in sheet, two faces the most do not wrapped up by upper casing 106 and lower casing 107 are as heat radiation
First side of sheet and the second side, wherein, the front end-plate 108 in front end assemblies is fixed on the first side of fin by screw
Face, the end plate 110 in aft-end assembly is fixed on the second side of fin by screw.So, will not by upper casing 106 with
Two faces of lower casing 107 parcel shelter from, it is achieved that calculate the fully enclosed of equipment.Wherein, by all parts roots in Figure 1A
According to the description of previous embodiment carry out fully enclosed after calculate equipment structure as shown in Figure 1B.
Having the beneficial effects that of the present embodiment: by by the front end-plate 108 in front end assemblies and the first of cuboid shell
Bottom surface is attached and is attached with cuboid shell the second bottom surface by aft-end assembly, it is achieved thereby that to cuboid shell two
Blocking of individual bottom surface, it is achieved that to calculate equipment fully enclosed.
Fig. 3 A is to be applied to the top view of the first heat sink body 103 in the fin of aforementioned computing device in this utility model
(left) and side view (right), as shown in Figure 3A, this fin includes: the first heat dissipation base 1031 and multiple first group of fin 1032
The first heat sink body 103 constituted；
First heat dissipation base 1031 and multiple first group of fin 1032 are vertically connected；
At least one grooving 1033 is had on multiple first group of fin 1032；
Grooving 1033 place plane respectively with the first heat dissipation base 1031 place plane and multiple first group of fin 1032 institute
Multiple planes vertical.
Fig. 3 C is the structural representation of the first heat sink body 103, in fig. 3 c, in the first heat sink body 103 multiple first
Group fin 1032 is vertically connected with the first heat dissipation base 1031, has multiple grooving 1033, cut on multiple first group of fin 1032
The plane at groove 1033 place is many with the plane at the first heat dissipation base 1031 place and multiple first group of fin 1032 place respectively
Individual plane is vertical.
Although it is understood that be all two groovings 1033 shown in Fig. 3 A and Fig. 3 C, but applying in reality
In, a grooving can be the most only set or plural grooving is set.
By Fig. 3 D it can be seen that in prior art, fin 31 does not exist grooving, this results in fin 31 length too
Long, windage is excessive, thus radiating effect is the best.
The beneficial effects of the utility model are: by cutting one or more grooving 1033 on first group of fin 1032,
Shorten fin length, decrease the windage in radiation processes, improve radiating effect.
In one embodiment, as shown in Figure 4 A, fin also includes: the second heat dissipation base 1041 and multiple second group of fin
The second heat sink body 104 that sheet 1042 is constituted；
Second heat dissipation base 1041 and multiple second group of fin 1042 are vertically connected；
At least one grooving 1033 is had on multiple second group of fin 1042；
Grooving 1033 place plane respectively with the second heat dissipation base 1041 place plane and multiple second group of fin 1042 institute
Multiple planes vertical.
In this second heat sink body 104, multiple second group of fin 1042 are vertically connected with the second heat dissipation base 1041, many
Have multiple grooving 1033 on individual second group of fin 1042, the plane at grooving 1033 place respectively with the second heat dissipation base 1041 place
Plane vertical with multiple planes at multiple second group of fin 1042 place.
It can also be seen that this second heat sink body 104 is symmetrical with the first heat sink body 103 from Fig. 2, first
With second group of fin in the side being connected with first group of fin 1032 in heat dissipation base 1031 and the second heat dissipation base 1041
1042 sides connected are relative and parallel.
Owing to the second heat sink body 104 and the first heat sink body 103 are symmetrical, namely the structure of the second heat sink body 104 with
Symmetrical configuration shown in Fig. 3 C.
Having the beneficial effects that of the present embodiment: by cutting one or more grooving 1033 on second group of fin 1042, contracting
Short fin length, decreases the windage in radiation processes, improves radiating effect.
In one embodiment, the first heat sink body 103 and the second heat sink body 104 are Heat Conduction Material.
In the present embodiment, the first heat sink body 103 and the second heat sink body 104 are Heat Conduction Material.It is to say, composition
First heat dissipation base 1031 of the first heat sink body and first group of fin 1032, and the second heat radiation of composition the second heat sink body
Base 1041 and second group of fin 1042 are Heat Conduction Material, in actual applications, consider for durable new angle, thus, adopt
The metal material good with heat conduction is advisable, and in the metal material that heat conduction is good, common are silver, copper and aluminum, the heat conduction of silver
Property optimal, but for cost-effective purpose, the most more employing copper or aluminum make heat dissipation base and fin.
Having the beneficial effects that of the present embodiment: owing to heat dissipation base, fin are all Heat Conduction Materials, thus can by with heat radiation
Heat produced by the calculation power plate of base laminating runs through heat dissipation base conduction to fin.
In the description of this specification, term " is installed ", " being connected ", the term such as " connection " all should be interpreted broadly, such as,
" connecting " can be fixing connection, it is also possible to is to removably connect, or is integrally connected；" being connected " can be to be joined directly together, also
Can be indirectly connected to by intermediary.For the ordinary skill in the art, on can understanding as the case may be
State term concrete meaning in this utility model.
In the description of this specification, the description of term " embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that the specific features, structure, material or the feature that combine this embodiment or example description are contained in of the present utility model at least one
In individual embodiment or example.In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment
Or example.And, the specific features of description, structure, material or feature can be in any one or more embodiments or examples
In combine in an appropriate manner.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for this
For the technical staff in field, this utility model can have various modifications and variations.All in spirit of the present utility model and principle
Within, any modification, equivalent substitution and improvement etc. made, within should be included in protection domain of the present utility model.
Claims (11)
1. one kind calculates equipment, it is characterised in that described calculating equipment includes:
Fin, uses Heat Conduction Material, including:
Heat dissipation base, for tabular；
Multiple fins, are vertically connected with the one side of heat dissipation base, fin have at least one grooving, described grooving place plane divide
Not vertical with multiple planes of described heat dissipation base place plane and the plurality of fin place；
Calculation power plate, fits with the another side of heat dissipation base, is used for processing task.
Calculate equipment the most as claimed in claim 1, it is characterised in that heat dissipation base includes: the first heat dissipation base and second dissipates
Hot base；Multiple fins include: first group of fin and second group of fin；
First heat dissipation base is parallel relatively with the second heat dissipation base plane；
First group of fin and second group of fin are between the first heat dissipation base and the second heat dissipation base.
Calculate equipment the most as claimed in claim 1, it is characterised in that
At least one is had for the chip processing task on described calculation power plate；
The another side of described heat dissipation base has at least one groove, and the number of described groove is consistent with the number of described chip, institute
State the shape of groove and the form fit of the chip on described calculation power plate correspondence position.
Calculate equipment the most as claimed in claim 1, it is characterised in that described calculation power plate includes: first calculates power plate and second calculates
Power plate；
Described calculating equipment also includes:
Heat-conducting silicone grease, is used for being filled in described first and calculates between power plate and the first heat dissipation base, and described second calculate power plate and
Between second heat dissipation base.
Calculate equipment the most as claimed in claim 1, it is characterised in that described calculating equipment also includes:
Master control borad, wherein, described master control borad is placed in described fin the side of calculation power plate of not fitting.
Calculate equipment the most as claimed in claim 4, it is characterised in that described calculating equipment also includes: upper casing and lower casing；
Wherein, described upper casing and lower casing are formed and are used for wrapping up described first calculation power plate, the second calculation power plate, fin and master control borad
Cuboid shell.
Calculate equipment the most as claimed in claim 1, it is characterised in that described calculating equipment also includes:
Front end assemblies, is fixed in described fin first side vertical with calculation power plate and fin, including:
Front end-plate, centre is provided with hollow rectangle framework；
Front end reticular lamina, is embedded in described hollow rectangle framework；
Aft-end assembly, is fixed in described fin second side relative with described first side and puts down with described front end assemblies
Row is relative, including:
End plate, is fixed on described second side；
Fan installation plate, is fixed on described end plate；
Fan, is fixed on described fan installation plate.
Calculate equipment the most as claimed in claim 7, it is characterised in that the front end-plate in described front end assemblies is fixed by screw
The first side in described fin；
End plate in described aft-end assembly is fixed on the second side of described fin by screw.
9. a fin, it is characterised in that described fin includes:
First heat sink body, is placed in calculating equipment, including:
First heat dissipation base, for tabular；
Multiple first group of fin: vertical with the one side of described first heat dissipation base be connected, the plurality of first group of first group of fin
Have at least one grooving on fin, described grooving place plane respectively with described first heat dissipation base place plane and the plurality of
Multiple planes at first group of fin place are vertical.
10. fin as claimed in claim 9, it is characterised in that described fin also includes:
Second heat sink body, is placed in calculating equipment, including:
Second heat dissipation base, for tabular；
Multiple second group of fin: vertical with the one side of described second heat dissipation base be connected, the plurality of second group of fin has to
A few grooving, described grooving place plane respectively with described second heat dissipation base place plane and the plurality of second group of fin
Multiple planes at place are vertical.
11. fin as claimed in claim 10, it is characterised in that described first heat sink body and described second heat radiation are main
Body is Heat Conduction Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620475294.8U CN205680045U (en) | 2016-05-23 | 2016-05-23 | Fin and computing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620475294.8U CN205680045U (en) | 2016-05-23 | 2016-05-23 | Fin and computing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205680045U true CN205680045U (en) | 2016-11-09 |
Family
ID=57436724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620475294.8U Active CN205680045U (en) | 2016-05-23 | 2016-05-23 | Fin and computing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205680045U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
| CN109588020A (en) * | 2018-12-29 | 2019-04-05 | 深圳市优必选科技有限公司 | A kind of robot cooling system and robot |
| WO2023186147A1 (en) * | 2022-04-02 | 2023-10-05 | 北京嘉楠捷思信息技术有限公司 | Heat dissipation apparatus and computing device |
-
2016
- 2016-05-23 CN CN201620475294.8U patent/CN205680045U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
| CN108594975B (en) * | 2018-07-12 | 2023-11-21 | 常州天能博智能***科技有限公司 | Operation board card heat radiation structure |
| CN109588020A (en) * | 2018-12-29 | 2019-04-05 | 深圳市优必选科技有限公司 | A kind of robot cooling system and robot |
| WO2023186147A1 (en) * | 2022-04-02 | 2023-10-05 | 北京嘉楠捷思信息技术有限公司 | Heat dissipation apparatus and computing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204539700U (en) | Radiator, electric-controlled box and air conditioner | |
| CN205680045U (en) | Fin and computing device | |
| US20140116656A1 (en) | Heat dissipation module and electronic device with the same | |
| CN203840687U (en) | Heat radiator, circuit board heat radiation structure, and electronic device | |
| JP2016528736A (en) | Multilayer heat spreader assembly with separate convection fins | |
| CN205693973U (en) | A kind of pcb board assembly | |
| CN206790875U (en) | Radiator and veneer | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN105120631A (en) | CPU cooling device with graphene thermal silicone grease cooling layer | |
| CN205176774U (en) | Take fin of graphite alkene bed course | |
| CN2901579Y (en) | Heat conductive element | |
| WO2018000906A1 (en) | Chip heat-dissipation structure and set-top box | |
| CN208159101U (en) | Electronic device and electronic equipment | |
| CN203378192U (en) | Long strip-shaped heat dissipation piece | |
| CN207116002U (en) | Heat abstractor and mainboard | |
| CN206042641U (en) | Electronic device | |
| CN205750682U (en) | Server | |
| JP6540358B2 (en) | Heat dissipation structure, case and portable terminal | |
| CN204408831U (en) | Solid conductive heat silica gel piece | |
| CN208141327U (en) | A kind of computer CPU heat sink | |
| CN211240607U (en) | Novel heat dissipation device | |
| CN211792205U (en) | Deep micro-hole type server circuit board | |
| CN208402312U (en) | A kind of high efficiency and heat radiation mainboard | |
| CN201364542Y (en) | Computer chassis provided with plate-fin type cooling units | |
| CN208954974U (en) | A kind of euthermic chip component and its radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211216 Address after: Room 101, block C, building 27, phase I, Zhongguancun Software Park, No. 8, Dongbei Wangxi Road, Haidian District, Beijing 100094 Patentee after: Canaan Creative Co.,Ltd. Address before: 310000 Room 1203, 12/F, Building 4, No. 9, Jiuhuan Road, Jianggan District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Canaan Creative Information Technology Ltd. |
|
| TR01 | Transfer of patent right |