CN201327611Y - Computer case, mainboard and computer with case and mainboard - Google Patents
Computer case, mainboard and computer with case and mainboard Download PDFInfo
- Publication number
- CN201327611Y CN201327611Y CNU2008201241503U CN200820124150U CN201327611Y CN 201327611 Y CN201327611 Y CN 201327611Y CN U2008201241503 U CNU2008201241503 U CN U2008201241503U CN 200820124150 U CN200820124150 U CN 200820124150U CN 201327611 Y CN201327611 Y CN 201327611Y
- Authority
- CN
- China
- Prior art keywords
- mainboard
- plate body
- cabinet
- heat
- conductive pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer case which comprises a front plate body, a rear plate body, a left plate body, a right plate body, an upper plate body and a lower plate body. One of the front, the rear, the left, the right and the upper plate bodies is a heat-dissipating plate body; a heat conducting pipe is arranged on the first surface of the heat dissipating plate body; at least a heat conducting pad is also arranged on the first surface; and the first surface is an internal surface. The utility model also discloses a mainboard. Circuit elements of the mainboard are arranged on the first surface of the mainboard; main heating elements on the mainboard are arranged on the second surface; the mainboard is mounted in the computer case; the second surface is opposite to one plate body of the computer case; the positions of the main heating elements correspond to the positions of the heat conducting pads on the plate body; and the main heating elements are jointed with the heat conducting pads. The utility model further discloses a computer adopting the case and the mainboard, and utilizes side plates to adopt natural convection mode, thereby achieving the purpose of dissipating heat in the interior of the case.
Description
Technical field
The utility model relates to field of computer technology, refers in particular to a kind of computing machine of considering computer cabinet, the mainboard of computer to dissipate heat design and having this cabinet and mainboard.
Background technology
Along with development of computer, when people select to buy computing machine now, more favor in mainframe box small and exquisite, light, artistic type, so miniaturization becomes the developing direction of present computing machine.Yet when the volume that requires computer cabinet reduces, the heat flow density that is also meaning simultaneously in the cabinet increases, in cabinet in the narrow and small relatively confined space, air is difficult for circulation more, cause central processing unit (CPU) or heat that other components distributed can't diffuse as early as possible to the cabinet outside, form high temperature in cabinet, the therefore computer cabinet that requires for miniaturization solves its heat dissipation problem and is one of matter of utmost importance that cabinet can reach the miniaturization requirement.
The radiating mode of active computer main frame, normally heat radiator is set realizes by fan being installed on mainframe box and being engaged in the thermal source place, therefore the approach that solves miniaturization case radiation problem mainly contains two kinds, and a kind of is the area that strengthens heat radiator, and another kind is the rotating speed that improves fan.Yet owing to the computing machine of miniaturization requires the space in the cabinet less, therefore the volume size and the design space of having limited heat radiator to a certain extent adopt increasing heat radiator mode to strengthen the method for radiating effect and be not suitable for the miniaturization cabinet; Adopt the mode that improves rotation speed of the fan can increase the noise of computer system in addition, influence the people's work mood, bring another worry to the user, therefore simple the employing improved the heat dissipation problem that rotation speed of the fan solves the miniaturization cabinet, neither a perfect solution.
The utility model content
The purpose of technical solutions of the utility model provides a kind of computer cabinet, mainboard and has the computing machine of this cabinet and mainboard, the heat radiation of described cabinet need not to use fan, but utilize side plate to adopt the mode of natural convection, reach the purpose that cabinet inside is dispelled the heat, therefore has the little advantage of noise, and this kind radiating mode do not require the inner space size of cabinet, can not limit the miniaturization of cabinet volume.
For achieving the above object, the utility model provides a kind of computer cabinet, comprise front, rear, left and right and above and below plate body, a wherein plate body of described front, rear, left and right and top plate body is the heat radiation plate body, the first surface of described heat radiation plate body is provided with heat pipe, and also be provided with at least one heat conductive pad on the described first surface, described first surface is an inside surface.
Preferably, above-mentioned computer cabinet, described heat conductive pad is covered in the top of described heat pipe.
Preferably, above-mentioned computer cabinet, described heat radiation plate body is made by aluminum, and described heat conductive pad is made by copper product.
Preferably, above-mentioned computer cabinet, described heat conductive pad be positioned at described heat radiation plate body with computer motherboard on the corresponding position of heater element, described mainboard is installed in the described cabinet, described heater element and described heat conductive pad card mutually close.
Preferably, above-mentioned computer cabinet, described heater element comprise central processing unit and mainboard chip.
Preferably, above-mentioned computer cabinet, the second surface of described heat radiation plate body is formed with a plurality of radiating fins.
The utility model also provides a kind of computer motherboard on the other hand, first circuit component of arranging described mainboard of described mainboard, arrange the main heater element on the described mainboard for second, described mainboard is installed in the computer cabinet, described second wherein plate body with described computer cabinet is relative, the position correspondence of the heat conductive pad on the position of described main heater element and the described plate body, and described main heater element and described heat conductive pad mutually card close.
Preferably, above-mentioned computer motherboard, described main heater element comprises central processing unit and mainboard chip.
The utility model also provides a kind of computing machine more on the one hand, comprises mainboard, central processing unit, mainboard chip and cabinet, and described mainboard, described central processing unit and described mainboard chip all are arranged in the described cabinet;
A wherein plate body of the front, back, left, right, up panel body of described cabinet is the heat radiation plate body, and the first surface of described heat radiation plate body is provided with heat pipe, and also is provided with at least one heat conductive pad on the described first surface, and described first surface is an inside surface;
First circuit component of arranging described mainboard of described mainboard, second main heater element of arranging described mainboard, described mainboard is installed in the described cabinet, described second heat radiation plate body with described cabinet is relative, the position correspondence of the position of described main heater element and described heat conductive pad, and described main heater element and described heat conductive pad mutually card close.
Preferably, above-mentioned computing machine, described heat conductive pad is covered in the top of described heat pipe.
Preferably, above-mentioned computing machine, the second surface of described heat radiation plate body is formed with a plurality of radiating fins.
At least one technical scheme in the above-mentioned embodiment has following beneficial effect, the described computer cabinet of the utility model specific embodiment, mainboard and computing machine, the side plate of the computer cabinet of utilization and mainboard aggregate erection is as the passage of heat to external world's conduction, this side plate is designed to the heat radiating fin structure form, have heat conductive pad and heat-conducting plate, in order to heat radiation, and be arranged on the mainboard back side with the main heater element on the mainboard of this side plate aggregate erection, with heat conductive pad mutually card close, adopt heat conducting mode that heat is dispersed into the outside, therefore the mode of the described computing machine of the utility model specific embodiment employing fan heat radiation that can discard tradition, realize no fan low noise design, this kind radiating mode of described computing machine is lower to the volume requirement of cabinet simultaneously, cabinet can be designed to the cabinet of miniaturization.
Description of drawings
Fig. 1 is the perspective view of the heat radiation plate body of the described computer cabinet of the utility model specific embodiment;
Fig. 2 is the structure synoptic diagram of the heat radiation plate body of the described computer cabinet of the utility model specific embodiment;
Fig. 3 is first structural representation of the described mainboard of the utility model specific embodiment;
Fig. 4 is second structural representation of the described mainboard of the utility model specific embodiment.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with the accompanying drawings and the specific embodiments the utility model is described in detail.
Described computer cabinet of the utility model specific embodiment and computing machine thereof, the mode of the employing fan heat radiation that discards tradition, replacement is dispelled the heat in the mode of heat conduction and thermal convection, the side plate of the computer cabinet of utilization and mainboard aggregate erection is as the passage of heat to external world's conduction, realize the design of no fan low noise, this kind radiating mode is lower to the volume requirement of cabinet simultaneously, cabinet can be designed to the cabinet of miniaturization.
Identical with existing common computer cabinet, the described computer cabinet of the utility model specific embodiment also comprises front, rear, left and right and above and below housing, and in the described computer cabinet of the utility model specific embodiment, wherein housing of this cabinet is set to the plate body that dispels the heat, the aggregate erection of the mainboard of computing machine and this heat radiation plate body, the heat that the main heater element that is arranged on the mainboard is produced by this heat radiation plate body to conduct and the mode of Natural Heat Convection is transmitted to the external world.In the utility model specific embodiment, be aggregate erection and the dismounting that makes things convenient for mainboard and cabinet, preferably a wherein side housing of the left and right side housing of cabinet is set to the plate body that dispels the heat, and this heat radiation plate body is movable side plate, can conveniently disassemble from cabinet.Below will the structure of the described heat radiation plate body of the utility model specific embodiment be described in detail.
Consult the perspective view of Fig. 1 for the heat radiation plate body 1 of the described computer cabinet of the utility model specific embodiment.As Fig. 1, for reaching best radiating effect, this heat radiation plate body 1 is set to a thin aluminum sheet, and a wherein surface 13 of heat radiation plate body 1 has heat pipe 10, extends on this surface 13 to be provided with, in order to the conduction heat.In addition, also be provided with the heat conductive pad of making by copper product, be covered in the top of heat pipe on surface 13.
In the assembling of computing machine, mainboard and described heat radiation plate body 1 aggregate erection, the heat conductive pad of this heat radiation plate body 1 contacts with heater element on the computer motherboard, the heat that heater element produced is transmitted to entire heat dissipation plate body 1 equably by heat conductive pad, heat pipe 10 like this, and heat radiation plate body 1 carries out Natural Heat Convection with outside air.In the utility model specific embodiment, the quantity of set heat conductive pad is two, also be heat conductive pad 11 and heat conductive pad 12 as Fig. 1, but quantity is not limited thereto, can decide according to the quantity of the main heater element that needs outside heat loss through conduction on the mainboard, the size of heat conductive pad 11 and heat conductive pad 12 and shape are to set according to the size and the shape of the heater element that is in contact with it in addition.
As Fig. 2, can also be arranged with a plurality of radiating fins 15 on another surface 14 of described heat radiation plate body 1, in order to increase the area of dissipation of heat radiation plate body 1, reach better radiating effect.
In the prior art, all components of mainboard all are arranged at front face surface, the back side of mainboard and the side plate of computer cabinet are fitted and are installed, and the utility model specific embodiment provides the mainboard of another kind of structure, the main heater element of mainboard is arranged at the back side of mainboard, fit with the heat conductive pad of case radiation plate body, reach best radiating effect.
The structure synoptic diagram of mainboard 2 as described in as Fig. 3 being, Fig. 4 is the Facad structure synoptic diagram of described mainboard 2.Consult Fig. 3 and Fig. 4, in the utility model specific embodiment, CPU 8 that heat dissipation capacity on the mainboard 2 is higher and north bridge chips 9 are arranged at the back side of mainboard, and other circuit components that the heat dissipation capacity of mainboard 2 is lower such as South Bridge chip 6 and internal memory (not shown) are arranged at the front of mainboard 2.Like this, by the setting of this kind structure, when mainboard 2 with as the cabinet housing aggregate erection of Fig. 1 structure the time, the back side of mainboard 2 with the heat radiation plate body 1 surperficial relative installation, CPU 8 is contacted with heat conductive pad 11,12 respectively with north bridge chips 9, need not to install fan like this, promptly the heat that the main thermal source of mainboard 2 can be produced conducts by heat radiation plate body 1.
In addition, the utility model specific embodiment also provides a kind of computing machine with said structure cabinet and mainboard, identical with the computing machine of prior art, this computing machine comprises power supply, hard disk, mainboard, CPU, mainboard chip and cabinet, described power supply, hard disk, mainboard, CPU and mainboard chip all are arranged in the described cabinet, inequality is with the computing machine of prior art, the described computing machine of the utility model specific embodiment does not have fan heat radiation module, but a panel body of cabinet is set to the plate body that dispels the heat, and adopts the mode of conduction and natural convection to dispel the heat.
The plate body of described computer cabinet and mainboard combination is designed to heat radiation plate body 1 structure as shown in Figure 1, and this heat radiation plate body 1 is set to a thin aluminum sheet, and heat radiation plate body 1 is formed with two heat pipes 10 on the surface 13 of cabinet inside setting, in order to conduct heat.Should also be provided with heat conductive pad 11 and the heat conductive pad of being made by copper product 12 in surface 13 in addition, and be covered in the top of heat pipe, the position of north bridge chips is corresponding on the position of heat conductive pad 11 and the mainboard, and the position of CPU is corresponding on the position of heat conductive pad 12 and the mainboard.
The motherboard design of described computing machine is the structure as Fig. 3 and Fig. 4, CPU 8 that thermal value on the mainboard 2 is higher and north bridge chips 9 are arranged at the back side of mainboard, other circuit components that the thermal value of mainboard 2 is lower such as South Bridge chip 6 and internal memory (not shown) are arranged at the front of mainboard.
Described mainboard 2 is installed on described computer cabinet inside, the back side of mainboard 2 is relative with the surface 13 of heat radiation plate body 1, CPU 8 and north bridge chips 9 correspondence respectively are attached on heat conductive pad 11 and the heat conductive pad 12, and by screw mainboard 2 is fixed on the heat radiation plate body 1, make contacting between heater element and the heat conductive pad have convenient pressure.By this kind structure Design, the main thermal source CPU 8 of mainboard 2 and heat that north bridge chips 9 is produced are conducted on the aluminum heat radiation plate body 1 equably by heat conductive pad and heat pipe, utilize this heat radiation plate body 1 to come to carry out Natural Heat Convection at last with outside air as a bigger heat radiator, thereby can abandon existing fan, realize the structural design of no fan low noise.In addition, best, also be disposed with a plurality of radiating fins on this heat radiation plate body 1 and the surface that extraneous space contacts, in order to increase the area of dissipation of heat radiation plate body 1, to obtain better radiating effect.
In addition, the described computing machine of the utility model specific embodiment is by the radiating mode of above structure, to the cabinet inside space without limits, need not consider to install needed installing space of fan module and heat-dissipating space, therefore miniaturization that can limiting computer cabinet volume.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (11)
1. computer cabinet, comprise front, rear, left and right and above and below plate body, it is characterized in that, a wherein plate body of described front, rear, left and right and top plate body is the heat radiation plate body, the first surface of described heat radiation plate body is provided with heat pipe, and also be provided with at least one heat conductive pad on the described first surface, described first surface is an inside surface.
2. computer cabinet as claimed in claim 1 is characterized in that described heat conductive pad is covered in the top of described heat pipe.
3. computer cabinet as claimed in claim 1 is characterized in that, described heat radiation plate body is made by aluminum, and described heat conductive pad is made by copper product.
4. computer cabinet as claimed in claim 1, it is characterized in that, described heat conductive pad be positioned at described heat radiation plate body with computer motherboard on the corresponding position of heater element, described mainboard is installed in the described cabinet, described heater element and described heat conductive pad card mutually close.
5. computer cabinet as claimed in claim 4 is characterized in that, described heater element comprises central processing unit and mainboard chip.
6. computer cabinet as claimed in claim 1 is characterized in that the second surface of described heat radiation plate body is formed with a plurality of radiating fins.
7. computer motherboard, it is characterized in that, first circuit component of arranging described mainboard of described mainboard, arrange the main heater element on the described mainboard for second, described mainboard is installed in the computer cabinet, described second wherein plate body with described computer cabinet is relative, the position correspondence of the heat conductive pad on the position of described main heater element and the described plate body, and described main heater element and described heat conductive pad mutually card close.
8. computer motherboard as claimed in claim 7 is characterized in that, described main heater element comprises central processing unit and mainboard chip.
9. a computing machine comprises mainboard, central processing unit, mainboard chip and cabinet, and described mainboard, described central processing unit and described mainboard chip all are arranged in the described cabinet, it is characterized in that,
A wherein plate body of the front, back, left, right, up panel body of described cabinet is the heat radiation plate body, and the first surface of described heat radiation plate body is provided with heat pipe, and also is provided with at least one heat conductive pad on the described first surface, and described first surface is an inside surface;
First circuit component of arranging described mainboard of described mainboard, second main heater element of arranging described mainboard, described mainboard is installed in the described cabinet, described second heat radiation plate body with described cabinet is relative, the position correspondence of the position of described main heater element and described heat conductive pad, and described main heater element and described heat conductive pad mutually card close.
10. computing machine as claimed in claim 9 is characterized in that described heat conductive pad is covered in the top of described heat pipe.
11. computing machine as claimed in claim 9 is characterized in that, the second surface of described heat radiation plate body is formed with a plurality of radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201241503U CN201327611Y (en) | 2008-11-26 | 2008-11-26 | Computer case, mainboard and computer with case and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201241503U CN201327611Y (en) | 2008-11-26 | 2008-11-26 | Computer case, mainboard and computer with case and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201327611Y true CN201327611Y (en) | 2009-10-14 |
Family
ID=41179578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201241503U Expired - Fee Related CN201327611Y (en) | 2008-11-26 | 2008-11-26 | Computer case, mainboard and computer with case and mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201327611Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103149991A (en) * | 2012-12-26 | 2013-06-12 | 张伟 | Silent non-power-consumption heat dissipation type computer mainframe |
| CN104780744A (en) * | 2015-04-23 | 2015-07-15 | 特变电工西安电气科技有限公司 | Heat radiating system of electrical device |
| CN106232014A (en) * | 2014-04-17 | 2016-12-14 | 和赛仑有限公司 | Radiator structure for portable ultrasonic diagnostic equipment |
| CN108020361A (en) * | 2016-11-03 | 2018-05-11 | 英业达科技有限公司 | Stress test gauge and mainboard stacking pressure test system |
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN111193380A (en) * | 2018-11-15 | 2020-05-22 | 中车株洲电力机车研究所有限公司 | DCU control box |
-
2008
- 2008-11-26 CN CNU2008201241503U patent/CN201327611Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103149991A (en) * | 2012-12-26 | 2013-06-12 | 张伟 | Silent non-power-consumption heat dissipation type computer mainframe |
| CN106232014A (en) * | 2014-04-17 | 2016-12-14 | 和赛仑有限公司 | Radiator structure for portable ultrasonic diagnostic equipment |
| CN104780744A (en) * | 2015-04-23 | 2015-07-15 | 特变电工西安电气科技有限公司 | Heat radiating system of electrical device |
| CN104780744B (en) * | 2015-04-23 | 2017-07-18 | 特变电工西安电气科技有限公司 | A kind of cooling system of electrical equipment |
| CN108020361A (en) * | 2016-11-03 | 2018-05-11 | 英业达科技有限公司 | Stress test gauge and mainboard stacking pressure test system |
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN108429155B (en) * | 2018-04-03 | 2019-07-23 | 伊发控股集团有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN111193380A (en) * | 2018-11-15 | 2020-05-22 | 中车株洲电力机车研究所有限公司 | DCU control box |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201327611Y (en) | Computer case, mainboard and computer with case and mainboard | |
| TWM550838U (en) | Heat dissipating structure of independent graphics card of computer and assembling structure thereof | |
| CN207301961U (en) | A kind of computer cabinet heat conducting and heat radiating device | |
| TWM550836U (en) | Partition for computer host | |
| CN201601889U (en) | Circuit board combination | |
| US20210212238A1 (en) | Server heat dissipation structure | |
| US9772664B1 (en) | Memory heater and heating aid arrangement | |
| TWI328736B (en) | Radiation structure for processors | |
| CN201917860U (en) | Computer mainboard allowing heat dissipation by passive heat dissipating mode | |
| CN206574017U (en) | A kind of server radiator structure | |
| CN2901579Y (en) | Heat conductive element | |
| CN214335615U (en) | Mainboard heat dissipation insulating piece for computer | |
| CN205563435U (en) | Heat radiating part | |
| CN209343264U (en) | A kind of computer system puts device with control panel fixing card | |
| CN210119749U (en) | Heat dissipation device and notebook computer | |
| TW202131780A (en) | A server heat dissipation structure | |
| CN108762443B (en) | T-shaped heat dissipation device applied to computer | |
| CN207718817U (en) | A kind of hard disc of computer radiator structure | |
| CN2755781Y (en) | Integrated radiator | |
| CN206610387U (en) | The independent air guiding heat dissipation device of all-in-one | |
| CN206178631U (en) | High -efficient type CPU radiator | |
| CN209433343U (en) | CPU heat radiation module for notebook | |
| CN215526589U (en) | Accelerated heat dissipation structure of fan-free industrial personal computer | |
| CN212181420U (en) | Full cold guide server | |
| CN201229541Y (en) | Novel heat radiating rack |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091014 Termination date: 20161126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |