CN2817074Y - Multi-substrate thick-film circuit - Google Patents
Multi-substrate thick-film circuit Download PDFInfo
- Publication number
- CN2817074Y CN2817074Y CN 200520063637 CN200520063637U CN2817074Y CN 2817074 Y CN2817074 Y CN 2817074Y CN 200520063637 CN200520063637 CN 200520063637 CN 200520063637 U CN200520063637 U CN 200520063637U CN 2817074 Y CN2817074 Y CN 2817074Y
- Authority
- CN
- China
- Prior art keywords
- film circuit
- thick film
- pin
- substrate
- many substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Structure Of Printed Boards (AREA)
Abstract
The utility model aims to solve the technical problem of providing a multi-substrate thick-film circuit so as to overcome the defects of large dimension and big space occupation of the multi-substrate thick-film circuit in the prior art. The utility model has the technical scheme for solving the technical problem that the multi-substrate thick-film circuit comprises a substrate set provided with at least two substrates printed with circuit patterns, and also comprises a lead structure for bearing the substrates, wherein the lead structure is provided with a main body provided with a plurality of leading wires formed by upward extension; a groove for containing the substrates, and leading legs arranged at both sides of the main body are formed between the leading wires.
Description
Technical field
The utility model relates to the manufacturing technology of circuit board in the electronics or the communications field, more particularly, relates to the thick film circuit of element circuit carrier.
Background technology
Thick film circuit is widely used in electronic product fields such as communication, household electrical appliances as the element circuit carrier.Existing thick film circuit is a mode of utilizing silk-screen to be shaped, go up printed circuit figure (as circuit conductor, thick-film resistor etc.) at substrate (as ceramic wafer), also can add components and parts such as electric capacity, diode in case of necessity, and assemble and finish after the pin that is shaped in advance becomes, welds.Individual resistors, electric capacity that the mode that described silk-screen is shaped is made than conventional films technology have and make simple, good reliability, and help the advantage of circuit heat radiation.
As shown in Figure 1, be the schematic diagram of existing one chip thick film circuit, comprise substrate 21, lead-in wire 23 and metal cap 24.But at the two sides of described substrate 21 printed circuit figure or increase device (as electric capacity, diode etc.), and the end at substrate 21 is manufactured with pad 22, so that weld together, and then whole thick film circuit 23 is welded on the circuit board (PCB) by going between with described lead-in wire 23.In order to cooperate the vacuum slot of chip mounter, described metal cap 24 is fixed on the described substrate 21 other end relative with pad 22, and the upper surface of metal cap 24 is made smooth flat.In addition, the leg of described lead-in wire 23 is fixed on the circuit board with the mutual level of circuit board, its mode by paster; The leg of described lead-in wire 23 also can with the perpendicular setting of circuit board, and be fixed on the circuit board by the mode of plug-in unit.
Yet along with the electronic product development trend is more and more microminiaturized, the carrying power consumption that components and parts produced is increasing on the thick film circuit, and the temperature during the thick film circuit operation is also more and more higher.Especially when the substrate that only adopts a slice in height, length limited, the thick film circuit temperature that can reach capacity very soon because of power consumption is higher, and then may cause the unstable of operation or break down.
For this reason, attempt in the prior art to solve the problem that temperature raises by the mode of taking to increase monocrepid formula thick film circuit quantity, but use a plurality of monocrepid thick film circuits need take layout/wiring space of a large amount of PCB, influence the raising of veneer density and the microminiaturization of product.If what increase is the thick film circuit that adopts the fixed form of plug-in unit, also need increase the corresponding insert hole, will produce considerable influence, even may need to increase the PCB number of plies and finish cabling the cabling of PCB at PCB, thereby cause the increase of PCB cost, reduce competitiveness of product.
The utility model content
The technical problems to be solved in the utility model is, a kind of many substrates thick film circuit is provided, and many substrates thick film circuit size is big in the prior art, many shortcomings take up room to solve.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of many substrates thick film circuit, comprise have at least two substrate groups that are printed with the substrate of circuitous pattern, it also comprises the pin configuration that carries described substrate, described pin configuration has main body, the a plurality of lead-in wires that form by extending upward are arranged on described main body, be formed with the groove that holds described substrate between lead-in wire, and the pin that is provided with in described main body both sides.
One end margin of described substrate group is manufactured with pad.
The other end relative with pad is fixed with metal cap on the described substrate group.
The end that described substrate group is manufactured with pad inserts the groove that described lead-in wire forms, and with the corresponding combination of described lead-in wire.
Described pin is the SMD pin that the outside horizontal-extending of described main body is provided with.
Described pin is that described main body is outwards extended the plug-in type pin that is provided with downwards.
Described pin is a single-side pin, and is interspersed and is arranged on the both sides of described substrate group.
Be printed on each on-chip described circuitous pattern and comprise a plurality of series resistances that power consumption equates substantially.
Perhaps, in many substrates thick film circuit described in the utility model, described pin is that described main body is outwards extended the plug-in type pin that is provided with downwards.Described pin is one-sided conducting pin, and is interspersed and is arranged on the both sides of described substrate group.
In many substrates thick film circuit described in the utility model, be printed on each on-chip described circuitous pattern and comprise a plurality of series resistances that power consumption equates substantially.
Implement many substrates thick film circuit of the present utility model, have following beneficial effect: a plurality of substrate bearings have reduced the PCB arrangement space that thick film circuit takies effectively on same pin configuration, improved the density of PCB; By increasing the quantity of substrate, effectively reduced power dissipation density, the temperature when having reduced the thick film operation of substrate, and, the mode that many substrates are integrated, reduced thick film circuit size, reduced its height, help improving the quantity of the PCB in the interpolation frame, improved integrated level.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of the SMD thick film circuit of existing monolithic;
Fig. 2 is the structural representation of an embodiment of many substrates of the utility model thick film circuit;
Fig. 3 is the schematic diagram of the single pin configuration of the many substrates thick film circuit among Fig. 2.
Embodiment
As shown in Figure 2, many substrates thick film circuit of the present utility model pin configuration 40 of comprising substrate group 30 and carrying described substrate group 30.Described substrate group 30 comprises a plurality of substrates, be two substrate A, B in the present embodiment, be shaped on circuitous pattern (as circuit conductor, thick-film resistor etc.) at described substrate A, B perfecting, certainly, the quantity of substrate can decide according to the degree of integration and the power consumption situation of thick film.
As shown in Figure 3, described pin configuration 40 comprise main body 41, upwardly extending a plurality of lead-in wires 42 and the pin 43 that is provided with in described main body 41 both sides on described main body 41.In the present embodiment, corresponding with the quantity of described substrate, described lead-in wire 42 is four, and forms two grooves 44 that are separated between described lead-in wire 42.Described two substrate A, B are installed in respectively in the described groove 44.An end margin that cooperates with described lead-in wire 42 at described substrate A, B is manufactured with corresponding pad (figure does not show), thereby combines with described lead-in wire 42.
As shown in Figure 3, described pin 43 is the SMD pin that described main body 41 outside horizontal-extendings are provided with, and the mode by paster is fixed on whole thick film circuit on the circuit board.In order to cooperate the vacuum slot of chip mounter, the other end relative with pad is fixed with metal cap 50 on described two substrates, and the upper surface of described metal cap 50 is made smooth flat.
Certainly, described pin also can be the plug-in type pin, and promptly described pin outwards extends setting downwards in described main body, and is inserted into (figure does not show) in the circuit board.When adopting the plug-in type pin, described pin is single-side pin (promptly only having the pin of a side to be inserted in the jack on the circuit board), thereby can reduce the jack on the circuit board, is convenient to the cabling of circuit board.And, described pin is designed to be interspersed and is arranged on the both sides of described substrate group, it is pin 1,3,5 ... be arranged on the side of substrate A, pin 2,4,6 ... then be arranged on the side (its numbering can with reference to figure 2) of substrate B, can avoid when being assembled into circuit board, the inclination of whole thick film circuit, and can increase PCB layout space between the adjacent leads.
In addition, in described circuitous pattern, because two substrate A, B are electrically connected with lead-in wire 42 respectively and by common main body 41 electric connection mutually, thereby can be separated into a plurality of series resistances by the circuit that indivedual power consumptions are higher, and being printed on respectively on the different substrates, thereby the power consumption of each substrate of balance.
Two substrate A, B of many substrates thick film circuit of the present utility model are carried on the same pin configuration 40, have reduced the PCB arrangement space that thick film circuit takies effectively, have improved the density of PCB; And by increasing the quantity of substrate, effectively reduced power dissipation density, the temperature when having reduced the thick film operation of substrate, and, the mode that many substrates are integrated, reduced thick film circuit size, reduced its height, help improving the quantity of the PCB in the interpolation frame, improved integrated level.
Claims (8)
1, a kind of many substrates thick film circuit, comprise and have at least two substrate groups that are printed with the substrate of circuitous pattern, it is characterized in that: also comprise the pin configuration that carries described substrate, described pin configuration has main body, the a plurality of lead-in wires that form by extending upward are arranged on described main body, be formed with the groove that holds described substrate between lead-in wire, and the pin that is provided with in described main body both sides.
2, many substrates thick film circuit according to claim 1 is characterized in that, an end margin of described substrate group is manufactured with pad.
3, many substrates thick film circuit according to claim 2 is characterized in that, the other end relative with pad is fixed with metal cap on the described substrate group.
4, many substrates thick film circuit according to claim 2 is characterized in that, the end that described substrate group is manufactured with pad inserts the groove that described lead-in wire forms, and with the corresponding combination of described lead-in wire.
5, many substrates thick film circuit according to claim 1 is characterized in that, described pin is the SMD pin that the outside horizontal-extending of described main body is provided with.
6, many substrates thick film circuit according to claim 1 is characterized in that, described pin is that described main body is outwards extended the plug-in type pin that is provided with downwards.
7, many substrates thick film circuit according to claim 6 is characterized in that, described pin is a single-side pin, and is interspersed and is arranged on the both sides of described substrate group.
8, many substrates thick film circuit according to claim 1 is characterized in that, is printed on each on-chip described circuitous pattern and comprises a plurality of series resistances that power consumption equates substantially.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520063637 CN2817074Y (en) | 2005-08-24 | 2005-08-24 | Multi-substrate thick-film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520063637 CN2817074Y (en) | 2005-08-24 | 2005-08-24 | Multi-substrate thick-film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2817074Y true CN2817074Y (en) | 2006-09-13 |
Family
ID=36996884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520063637 Expired - Fee Related CN2817074Y (en) | 2005-08-24 | 2005-08-24 | Multi-substrate thick-film circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2817074Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290698A (en) * | 2011-07-20 | 2011-12-21 | 聚信科技有限公司 | Vertical soldering system and method for mounting vertical surface-mounted module |
| CN101965100B (en) * | 2007-03-16 | 2012-07-04 | 华为技术有限公司 | Thick film circuit, pin frame, circuit board and combination thereof |
| CN101997185B (en) * | 2009-08-12 | 2012-10-17 | 华为技术有限公司 | Vertical surface-mounted module and combined surface-mounted module |
-
2005
- 2005-08-24 CN CN 200520063637 patent/CN2817074Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965100B (en) * | 2007-03-16 | 2012-07-04 | 华为技术有限公司 | Thick film circuit, pin frame, circuit board and combination thereof |
| CN101997185B (en) * | 2009-08-12 | 2012-10-17 | 华为技术有限公司 | Vertical surface-mounted module and combined surface-mounted module |
| CN102290698A (en) * | 2011-07-20 | 2011-12-21 | 聚信科技有限公司 | Vertical soldering system and method for mounting vertical surface-mounted module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060913 Termination date: 20100824 |