CN101965100B - Thick film circuit, pin frame, circuit board and combination thereof - Google Patents
Thick film circuit, pin frame, circuit board and combination thereof Download PDFInfo
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- CN101965100B CN101965100B CN2010102559360A CN201010255936A CN101965100B CN 101965100 B CN101965100 B CN 101965100B CN 2010102559360 A CN2010102559360 A CN 2010102559360A CN 201010255936 A CN201010255936 A CN 201010255936A CN 101965100 B CN101965100 B CN 101965100B
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- thick film
- pad
- welding assembly
- circuit board
- circuit
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- 238000003466 welding Methods 0.000 claims description 49
- 239000011159 matrix material Substances 0.000 claims description 31
- 239000010408 film Substances 0.000 description 93
- 238000000034 method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The embodiment of the invention discloses a thick film circuit, a circuit board and combination thereof, in particular to a pin assembly structure of the thick film circuit and a circuit board using the thick film circuit. Pins of the thick film circuit are arranged in a staggered way. When a plurality of thick film circuits are arranged in parallel on a circuit, adjacent pins of two thick film circuits are sequentially inserted into gaps formed by the staggered arrangement of the pins of the other party, so that the distance between the two thick film circuits is shortened, the density of the thick film circuits on the circuit board is increased and the development of the circuit board to miniaturization is facilitated simultaneously.
Description
Technical field
The present invention relates to a kind of electronic circuit, particularly a kind of thick film circuit and use the circuit board combination of this thick film circuit.
Background technology
Thick film circuit is used very extensive as the element circuit carrier in electronic product fields such as communication, household electrical appliances.
Like Fig. 1, a kind of thick film circuit of prior art has thick film matrix and pin, and this pin is fixed on this thick film matrix through draw-in groove, and to thick film matrix both sides separately, plane of common formation, all pin bottoms.This thick film circuit is a mode of utilizing silk-screen to be shaped; Go up (also can add components and parts such as electric capacity, diode in case of necessity) such as printed circuit conductor, thick-film resistors at substrate (like ceramic wafer) earlier; Make pad at an end of thick film then, and pin, welding back that assembling is shaped are in advance accomplished.Compare individual resistors, the electric capacity processed with thin-film technique, thick-film technique has makes simple, good reliability, and helps the advantage of circuit heat radiation.
But the both wings of this thick film circuit pin are connected as a single entity, and are symmetrically distributed, and leadframe structure is as shown in Figure 2 before its assembling.Play the many of I/O connection and supporting role the intercell connector 4 of pin 3 by two ends connected, the both wings of pair of pins are connected as a single entity, and have assembled the connection that the back pair of pins provides an I/O mouth.
Along with the microminiaturized development of electronic product, the use of thick film circuit on printed circuit board (PCB) can get more and more, and therefore when needing a plurality of thick film circuit board on the printed circuit board (PCB), situation as shown in Figure 3 will appear in the pin arrangements of these a plurality of thick film circuits.Therefore the parallel Surface Mount arrangement of a plurality of monocrepid thick film circuits need take a large amount of veneer layout/wiring space, is unfavorable for the raising of circuit board density and the microminiaturization of product.
Summary of the invention
Take circuit-board laying-out/wiring space when a plurality of thick film circuits of prior art are parallel to be arranged on the circuit board for overcoming; The shortcoming of the raising of restricting circuits plate density and the miniaturization of products, the embodiment of the invention provides a kind of thick film circuit, nead frame, circuit board and combination thereof that can effectively improve circuit board density.
For reaching above-mentioned first purpose, the technical scheme that the embodiment of the invention adopts is: a kind of thick film circuit is provided, and it comprises a thick film matrix and is located at a plurality of pins of this thick film matrix bottom that these a plurality of pins are staggered arranging in these thick film matrix both sides.
For reaching above-mentioned second purpose; The technical scheme that the embodiment of the invention adopts is: a kind of nead frame is provided; This nead frame and the assembling of thick film matrix form thick film circuit; It comprises a junction, and this connecting portion comprises one first cantilever and be located at a plurality of pins on this first cantilever that the pad of corresponding thick film matrix reserves the vacant locations of the pin of the staggered thick film matrix opposite side of installing with it between these a plurality of pins.
For reaching above-mentioned the 3rd purpose; The technical scheme that the embodiment of the invention adopts is: a kind of circuit board is provided; This circuit board is provided with one first pad; This first pad comprises one first row welding assembly and secondary series welding assembly, and this first row welding assembly and secondary series welding assembly are equipped with a plurality of solder joints, and these a plurality of pads are staggered arranges and corresponding with the pin of thick film circuit thick film matrix both sides.
For reaching above-mentioned the 4th purpose; The technical scheme that the embodiment of the invention adopts is: a kind of circuit board combination with thick film circuit is provided; It comprises that a circuit board and is located at the thick film circuit on this circuit board; This thick film circuit is provided with a plurality of pins, and these a plurality of pins are staggered in these thick film matrix both sides arranges and be welded on this circuit board.
Visible by technique scheme; The pin of embodiment of the invention thick film circuit adopts staggered mode of arranging; As a plurality of thick film circuits are parallel when being installed on the circuit, the pin that two thick film circuits are adjacent inserts the vacancy of the other side's pin because of interlocking and arranging and form successively, has shortened the distance between two thick film circuits; Strengthened the density of the thick film circuit on the circuit board, helped circuit board simultaneously and develop to microminiaturization.
Description of drawings
Fig. 1 is the sketch map of prior art thick film circuit.
Fig. 2 is a prior art thick film circuit nead frame sketch map.
Fig. 3 is a plurality of thick film circuits of prior art parallel sketch map of arranging on circuit board.
Fig. 4 is an embodiments of the invention thick film circuit perspective view.
Fig. 5 is the sketch map of the preferable enforcement row of the preceding pin configuration of thick film circuit assembling of the present invention.
Fig. 6 is the sketch map of preceding another embodiment of pin configuration of thick film circuit assembling of the present invention.
The pad sketch map of the circuit board that Fig. 7 can be used with thick film circuit board for the present invention.
Fig. 8 is the sketch map of a plurality of thick film circuits of the present invention parallel first embodiment that arranges on circuit board.
Fig. 9 is the sketch map of a plurality of thick film circuits of the present invention parallel second embodiment that arranges on circuit board.
Figure 10 is the sketch map of a plurality of thick film circuits of the present invention parallel the 3rd embodiment that arranges on circuit board.
Embodiment
Following with reference to the accompanying drawing preferred embodiment that develops simultaneously, the present invention is done further explain.
The circuit board combination with thick film circuit that preferred embodiment of the present invention is described comprises a circuit board and is located at the thick film circuit on this circuit board.
See also Fig. 4, thick film circuit 10 comprises a thick film matrix 11 and a plurality of pin 13.These thick film matrix 11 inside are provided with circuit, and its top is provided with user's paste card cap 12, and the bottom is provided with a plurality of pads 14 that link to each other with the I/O interface.This user's paste card cap 12 is used to make things convenient for the subscriber set paster.These a plurality of pins 13 are welded on the pad 14, and staggered this thick film matrix 11 both sides that are arranged in, therefore the just corresponding I/O interface of pin 13.Said staggered arranging is meant that when a side had pin to draw on the pad 14 of thick film matrix 11, the corresponding position of its opposite side just can be vacated in the embodiment of the invention, and the like.More than be merely the preferred embodiments of pin 13 arrangement modes, it is interlaced that the staggered rule of arranging of the pin of thick film circuit is not limited to single pin, also can be that a plurality of pins are interlaced.As shown in Figure 5, be a plurality of thick film circuits parallel second embodiment that arranges on circuit board: the pin staggered rows mode for cloth of thick film circuit is staggered in twos.And for example shown in Figure 6, be a plurality of thick film circuits parallel the 3rd embodiment that arrange on circuit board: to be that single pin is staggered, two pins of three pin alternation sums are staggered be arranged in order the pin arrangement mode of thick film circuit.It is thus clear that but the staggered rows mode for cloth of the pin of thick film circuit is very flexible vary.
See also Fig. 7,, be used for comprising a junction 20 and a plurality of pin 13 with the nead frame of thick film matrix 11 assemblings for realizing thick film circuit 10 pins 13 staggered arranging.This connecting portion 20 comprises one first cantilever 21 and one second cantilever 23, be connected through intercell connector 22 between this first cantilever 21 and second cantilever 23, and its junction is equipped with cut groove (indicating).These a plurality of pin 13 staggered being arranged on this first cantilever 21 and second cantilever 23, the one of which end is unsettled, and the other end links to each other with first cantilever 21 or second cantilever 23.For the ease of separating with this connecting portion 20 by a plurality of pins 13; The junction of this connecting portion 20 and these a plurality of pins 13 can be provided with cut groove (like the V-type groove etc.); Perhaps will these a plurality of pins 13 with this connecting portion between be arranged to be connected (a kind of syndeton of similar stamp hole), perhaps other separated structures of being convenient to well known in the prior art.。Distance between these a plurality of pins that are crisscross arranged 13 is corresponding with the pad 14 of thick film matrix 11.A unsettled end of this pin 13 is provided with two columns 130, and the spacing of this two column 130 is corresponding with the thickness of thick film matrix 11.The column 130 of the free end of these a plurality of pins 13 is arranged and is formed a draw-in groove, cooperates with thick film matrix 11.
When the thick film matrix 11 of thick film circuit 10 is assembled with nead frame; Only need thick film matrix 11 is put into draw-in groove; Make each column 130 of pad 14 and pin 13 corresponding and weld together; Then intercell connector 22, first cantilever 21 and second cantilever 23 are removed along cut groove, just can be accomplished the assembling of thick film matrix 11 and pin 13.
Please continue to consult Fig. 8, nead frame also can only comprise one first cantilever 21, and promptly first cantilever 21 and second cantilever 23 are separate structures.The pad 14 of corresponding thick film matrix 11 reserves the vacant locations of the pin 13 of staggered thick film matrix 11 opposite sides of installing with it between the pin 13 on this first cantilever 21 at this moment.During assembling, only need 21 staggered the cooperating with thick film matrix 11 of two first cantilevers just can.
The present invention also provides a kind of circuit board that uses above-mentioned thick film circuit.
In order to use thick film circuit 10 provided by the invention; Reach the purpose of effective raising thick film circuit board circuit 10 density; The present invention also provides a kind of circuit board that can be used with this thick film circuit 10, and this circuit board can be a printed circuit board (PCB), also can be the circuit board of other types.
See also Fig. 9, be the local pad sketch map of circuit board.This circuit board 20 is provided with a plurality of parallel first pad 021 and second pads 022 of arranging; This first pad 021 comprises the first row welding assembly 210 and secondary series welding assembly 211; Every row welding assembly has a plurality of pads 212, and the pad of this first row welding assembly 210 and secondary series welding assembly 211 212 is staggered arranges and corresponding with the pin 13 of thick film matrix 11 both sides of thick film circuit 10.This second pad, 022 structure is identical with this first pad 021; Also comprise the first row welding assembly 220 and secondary series welding assembly 221; The secondary series welding assembly 211 of its first row welding assembly 220 and first pad 021 is adjacent; Pad 222 on it is inserted into the vacancy of secondary series welding assembly 211 pads 212 of first pad 021 successively, forms the layout that interleave is arranged with it.
See also Figure 10, be a plurality of thick film circuits parallel first embodiment that arranges on circuit board.After the welding of thick film circuit and circuit board, thick film circuit 10 is gone up parallel arranging at circuit board (figure does not show), and adjacent thick film circuit 10,10 ' sides adjacent pin 13,13 ' interleave are arranged on the circuit board.The pin 13 of thick film circuit 10 is inserted into the vacancy between thick film circuit 10 ' the sides adjacent pin 13 ' successively, thereby the spacing between the thick film matrix 11 of thick film circuit 10 ' and thick film circuit 10 ' is dwindled, and has practiced thrift wiring space.
Can find out by preferred embodiment of the present invention; The pin of thick film circuit of the present invention adopts staggered mode of arranging; As a plurality of thick film circuits are parallel when being installed on the circuit, the pin that two thick film circuits are adjacent inserts the vacancy of the other side's pin because of interlocking and arranging and form successively, has shortened the distance between two thick film circuits; Strengthened the density of the thick film circuit on the circuit board, helped circuit board simultaneously and develop to microminiaturization.
The above is merely preferred embodiment of the present invention, is not to be used to limit protection scope of the present invention.All any modifications of within spirit of the present invention and principle, being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. circuit board; This circuit board be provided with one first pad and with one second pad of the first pad parallel arranged; This first pad comprises one first row welding assembly and secondary series welding assembly; This first row welding assembly and secondary series welding assembly are equipped with a plurality of pads, it is characterized in that: the pad of this first row welding assembly and the pad of secondary series welding assembly be staggered arranges and corresponding with the pin of thick film circuit thick film matrix both sides.
2. circuit board as claimed in claim 1; It is characterized in that: this second pad; Comprise one first row welding assembly and secondary series welding assembly, this first row welding assembly and secondary series welding assembly are equipped with a plurality of pads, and the pad of this first row welding assembly and secondary series welding assembly pad are staggered arranges; The first row welding assembly of this second pad is adjacent with the secondary series welding assembly of first pad; Pad on first welding assembly of this second pad is inserted between the first pad secondary series welding assembly pad successively, forms the layout that interleave is arranged with it, and corresponding with the pin of thick film circuit thick film matrix both sides.
3. circuit board combination with thick film circuit; It comprises that a circuit board and is located at the thick film circuit on this circuit board; It is characterized in that, said circuit board be provided with one first pad and with one second pad of the first pad parallel arranged, this first pad comprises one first row welding assembly and secondary series welding assembly; This first row welding assembly and secondary series welding assembly are equipped with a plurality of pads; The pad of this first row welding assembly and the pad of secondary series welding assembly are staggered arranges, and this thick film circuit is provided with a plurality of pins, these a plurality of pins in the thick film matrix both sides of this thick film circuit staggered arrange and respectively with the pad welding of circuit board.
4. the circuit board combination with thick film circuit as claimed in claim 3 is characterized in that: these a plurality of pads are staggered arranges and corresponding with the pin of thick film circuit thick film matrix both sides.
5. the circuit board combination with thick film circuit as claimed in claim 4; It is characterized in that: this circuit board is provided with and parallel second pad of arranging of first pad; Comprise one first row welding assembly and secondary series welding assembly; This first row welding assembly and secondary series welding assembly are equipped with a plurality of pads; And the pad of this first row welding assembly and secondary series welding assembly pad are staggered arranges; The first row welding assembly of this second pad is adjacent with the secondary series welding assembly of first pad, and the pad on first welding assembly of this second pad is inserted into the vacancy of the first pad secondary series welding assembly pad successively, forms the layout that interleave is arranged with it.
6. the circuit board combination with thick film circuit as claimed in claim 5; It is characterized in that: this has, and corresponding second pad is provided with a thick film circuit, the pin cross arrangement of the sides adjacent of the thick film circuit on the pin of the thick film circuit of this second pad and first pad on the circuit board of thick film circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102559360A CN101965100B (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and combination thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102559360A CN101965100B (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and combination thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710073585 Division CN101022099A (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and assembly thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101965100A CN101965100A (en) | 2011-02-02 |
| CN101965100B true CN101965100B (en) | 2012-07-04 |
Family
ID=43517750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102559360A Active CN101965100B (en) | 2007-03-16 | 2007-03-16 | Thick film circuit, pin frame, circuit board and combination thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101965100B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103341715B (en) * | 2013-07-05 | 2015-02-18 | 上海沪工汽车电器有限公司 | Clamping mould of spot welding of rectangular circuit board and L-shaped plate leading-out foot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306541A (en) * | 1990-03-13 | 1994-04-26 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board and terminal board with staggered conductive pads |
| CN2817074Y (en) * | 2005-08-24 | 2006-09-13 | 华为技术有限公司 | Multi-substrate thick-film circuit |
| US7109722B2 (en) * | 2004-06-10 | 2006-09-19 | International Business Machines Corporation | Apparatus and method for PCB smoke and burn detection and prevention |
-
2007
- 2007-03-16 CN CN2010102559360A patent/CN101965100B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306541A (en) * | 1990-03-13 | 1994-04-26 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board and terminal board with staggered conductive pads |
| US7109722B2 (en) * | 2004-06-10 | 2006-09-19 | International Business Machines Corporation | Apparatus and method for PCB smoke and burn detection and prevention |
| CN2817074Y (en) * | 2005-08-24 | 2006-09-13 | 华为技术有限公司 | Multi-substrate thick-film circuit |
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| Publication number | Publication date |
|---|---|
| CN101965100A (en) | 2011-02-02 |
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Effective date of registration: 20211221 Address after: 450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after: xFusion Digital Technologies Co., Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |