CN106163092B - Manufacturing method of circuit board structure with heat dissipation function - Google Patents
Manufacturing method of circuit board structure with heat dissipation function Download PDFInfo
- Publication number
- CN106163092B CN106163092B CN201610690928.6A CN201610690928A CN106163092B CN 106163092 B CN106163092 B CN 106163092B CN 201610690928 A CN201610690928 A CN 201610690928A CN 106163092 B CN106163092 B CN 106163092B
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- layer
- heat dissipation
- circuit board
- semiconductor device
- board structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a method for manufacturing a circuit board structure with a heat dissipation function, which is used for manufacturing the circuit board structure with the heat dissipation function and comprises the following steps: laying an integrated chip on the chip mounting layer; laying a semiconductor device on the semiconductor device mounting layer; arranging the substrate layer, the insulating layer, the heat dissipation layer, the surface mounting element mounting layer and the circuit wiring for later use; laying circuit wires on a substrate layer; attaching the surface-mounted component to the finished surface-mounted component mounting layer; assembling a chip mounting layer provided with an integrated chip, a semiconductor device mounting layer provided with a semiconductor device, a surface mounting element mounting layer provided with a surface mounting element, a substrate layer, an insulating layer and a heat dissipation layer which are arranged in order into a circuit board structure with a heat dissipation function; the influence on the whole circuit board structure due to the setting error of a certain layer is effectively avoided, and the quality of the whole circuit board structure can be guaranteed while the process efficiency is improved by the separately-arranged process mode.
Description
Technical Field
The invention relates to the field of circuit structures and the like, in particular to a manufacturing method of a circuit board structure with a heat dissipation function.
Background
The circuit board has the name: the printed circuit board comprises a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The Circuit Board can be called as a Printed Circuit Board or a Printed Circuit Board, and the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called as a Flexible Circuit Board) which is a Flexible Printed Circuit Board made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers.
First, a single panel, on the most basic PCB, the components are concentrated on one side and the wires are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product.
The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection.
The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.
Disclosure of Invention
The invention aims to provide a circuit board structure manufacturing method with a heat dissipation function, which is manufactured by utilizing a step-by-step flow process, wherein a chip mounting layer and a semiconductor device mounting layer are completely arranged, then the rest layers are arranged, circuit wiring is arranged, a surface mounting element mounting layer is completely arranged, and finally the whole structure is arranged, so that the influence on the whole circuit board structure due to the arrangement error of a certain layer can be effectively avoided, the separately arranged process mode is adopted, the process efficiency can be improved, and the quality of the whole circuit board structure can be guaranteed.
The invention is realized by the following technical scheme: a circuit board structure manufacturing method with a heat dissipation function is used for manufacturing the circuit board structure with the heat dissipation function and comprises the following steps:
1) laying an integrated chip on the chip mounting layer, and placing for later use;
2) laying a semiconductor device on the semiconductor device mounting layer, and placing for later use;
3) arranging the substrate layer, the insulating layer, the heat dissipation layer, the surface mounting element mounting layer and the circuit wiring for later use;
4) after the step 3), laying circuit wires on the substrate layer;
5) after the step 4), attaching the surface-mounted element on the finished surface-mounted element mounting layer, and placing for later use;
6) according to the design structure of the circuit board structure with the heat dissipation function, a chip mounting layer provided with an integrated chip, a semiconductor device mounting layer provided with a semiconductor device, a surface mounting element mounting layer provided with a surface mounting element, a base plate layer, an insulating layer and a heat dissipation layer which are arranged after being arranged are assembled into the circuit board structure with the heat dissipation function.
In order to further better implement the invention, the following arrangement structure is particularly adopted: the circuit board structure with the self-heat dissipation function is provided with a substrate layer, a semiconductor device mounting layer, an insulating layer and a chip mounting layer, wherein the semiconductor device mounting layer is arranged on one surface of the substrate layer; a heat dissipation layer is also arranged on the opposite surface of the substrate layer on which the semiconductor device mounting layer is arranged; and circuit wiring is also arranged on the surface of the substrate layer, which is contacted with the semiconductor device mounting layer and the heat dissipation layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: a semiconductor device is also provided on the semiconductor device mounting layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: the semiconductor device is arranged on the surface of the semiconductor device mounting layer, which is contacted with the insulating layer or/and the substrate layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: and a surface mounting element mounting layer is also arranged between the chip mounting layer and the insulating layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: an integrated chip is disposed on the chip mounting layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: and a plug connector is arranged on the side surface of the chip mounting layer.
In order to further better implement the invention, the following arrangement structure is particularly adopted: the circuit wiring adopts copper foil.
In order to further better implement the invention, the following arrangement structure is particularly adopted: the substrate layer is a beryllium oxide plate, the semiconductor device mounting layer is a ceramic plate with a hole cavity, and the insulating layer is a polymer plate with a buried hole.
In order to further better implement the invention, the following arrangement structure is particularly adopted: the heat dissipation layer adopts an integrated radiator.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the invention is manufactured by using a step-by-step flow process, firstly, the chip mounting layer and the semiconductor device mounting layer are completely arranged, then, the rest layers are arranged, secondly, the circuit routing is carried out, then, the surface mounting element mounting layer is completely arranged, and finally, the whole structure is arranged, so that the influence on the whole circuit board structure due to the arrangement error of a certain layer can be effectively avoided, the separately arranged process mode is adopted, the process efficiency can be improved, and the quality of the whole circuit board structure can be ensured.
The bottom layer of the circuit board structure with the self-heat dissipation function is provided with the heat dissipation layer for dissipating heat of the whole circuit board structure, so that the use performance of the circuit board structure is effectively improved, and circuit components with different power consumptions are packaged in a layering mode by adopting a layering arrangement technology, so that the use performance and the service life of the whole circuit structure are effectively improved.
Drawings
Fig. 1 is a schematic diagram of the structure of the present invention.
The packaging structure comprises a connector 1, an integrated chip 2, a chip mounting layer 3, a surface mounting element mounting layer 4, an insulating layer 5, a semiconductor device mounting layer 6, a semiconductor device 7, a substrate layer 8, a circuit wire 9 and a heat dissipation layer 10.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Example 1:
the utility model provides a circuit board structure preparation method from area heat dissipation function, utilize substep flow technology to make, at first carry out complete setting with chip installation layer and semiconductor device installation layer, then put in order all the other layers, secondly carry out the circuit and walk the line installation, then carry out complete setting to surface mounting component installation layer, carry out the setting of overall structure at last, can effectually avoid influencing whole circuit board structure because certain layer sets up the mistake, its separately process mode that sets up, guarantee the quality of whole circuit board structure when can improve process efficiency, as shown in FIG. 1, set to following structure especially: the circuit board structure with the heat dissipation function is manufactured and comprises the following steps:
1) laying an integrated chip 2 on the chip mounting layer 3, and placing for later use;
2) laying a semiconductor device 7 on the semiconductor device mounting layer 6, and placing for later use;
3) arranging the substrate layer 8, the insulating layer 5, the heat dissipation layer 10, the surface mounting element mounting layer 4 and the circuit wiring 9 for later use;
4) after the step 3), laying circuit wiring 9 on the substrate layer 8;
5) after the step 4), attaching the surface-mounted component on the finished surface-mounted component mounting layer 4, and placing for later use;
6) according to the design structure of the circuit board structure with the heat dissipation function, the chip mounting layer 3 provided with the integrated chip 2, the semiconductor device mounting layer 6 provided with the semiconductor device 7, the surface mounting element mounting layer 4 provided with the surface mounting element and the arranged substrate layer 8, the insulating layer 5 and the heat dissipation layer 10 are assembled into the circuit board structure with the heat dissipation function.
Example 2:
in this embodiment, the heat dissipation layer is arranged on the bottom layer of the circuit board structure to dissipate heat of the whole circuit board structure, so as to effectively improve the usability of the circuit board structure, and the layered arrangement technology is adopted to perform layered packaging on circuit components with different power consumptions, so as to effectively improve the usability and the service life of the whole circuit structure, as shown in fig. 1, the following arrangement structure is particularly adopted: the circuit board structure with the self-heat dissipation function is provided with a substrate layer 8, a semiconductor device mounting layer 6, an insulating layer 5 and a chip mounting layer 3, wherein the semiconductor device mounting layer 6 is arranged on one surface of the substrate layer 8, the insulating layer 5 is arranged on the opposite surface, provided with the substrate layer 8, of the semiconductor device mounting layer 6, and the chip mounting layer 3 is arranged on the opposite surface, provided with the semiconductor device mounting layer 6, of the insulating layer 5; a heat dissipation layer 10 is also provided on the substrate layer 8 on the side opposite to the semiconductor device mounting layer 6.
When the design is used, set up heat dissipation layer 10 at the bottommost layer, paste in the top on heat dissipation layer 10 and establish base plate layer 8, set up semiconductor device mounting layer 6 in the top on base plate layer 8, set up insulating layer 5 in the top of semiconductor device mounting layer 6, set up chip mounting layer 3 in the top of insulating layer 5, carry out the categorised setting of consumption with semiconductor and integrated chip class circuit device, can make whole circuit board structure's heat dispersion obtain improving to promote circuit board structure's life.
Example 3:
the present embodiment is further optimized on the basis of any of the above embodiments, and further to better implement the present invention, the present invention can facilitate the circuit communication of various devices of the circuit, as shown in fig. 1, particularly adopts the following arrangement structure: and circuit traces 9 are also arranged on the surfaces of the substrate layer 8, which are in contact with the semiconductor device mounting layer 6 and the heat dissipation layer 10.
Example 4:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, the semiconductor devices in the circuit can be individually arranged on the circuit board structure layer, so as to avoid the occurrence of poor heat dissipation when a large power consumption device and a small power consumption device are mixed, as shown in fig. 1, the following arrangement structure is particularly adopted: a semiconductor device 7 is also provided on the semiconductor device mounting layer 6.
Example 5:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, it is convenient to meet different design requirements or different heat dissipation requirements, as shown in fig. 1, the following arrangement structure is particularly adopted: the semiconductor device 7 is provided on a surface of the semiconductor device mounting layer 6 in contact with the insulating layer 5 or/and the substrate layer 8, and the semiconductor device 7 may be provided on an upper surface or/and a lower surface of the semiconductor device mounting layer 6 when designed for use.
Example 6:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, a layer structure can be separately configured for mounting surface mount components, so that the whole circuit board structure is more compact and thinner, as shown in fig. 1, the following configuration structure is particularly adopted: a surface mount component mounting layer 4 is further provided between the chip mounting layer 3 and the insulating layer 5.
Example 7:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, an integrated chip with larger relative power consumption can be mounted by using a single mounting layer, so as to avoid the occurrence of uneven heat dissipation and influence on the service life during mixed mounting, and as shown in fig. 1, the following arrangement structure is particularly adopted: an integrated chip 2 is provided on the chip mounting layer 3.
Example 8:
the present embodiment is further optimized on the basis of any of the above embodiments, and further, in order to better implement the present invention, it is convenient to introduce an external signal to the circuit board structure, as shown in fig. 1, the following arrangement structure is particularly adopted: a plug 1 is provided on a side surface of the chip mounting layer 3.
Example 9:
the present embodiment is further optimized on the basis of any of the above embodiments, and in order to further implement the present invention, the conductivity between the components can be improved, as shown in fig. 1, the following arrangement structure is particularly adopted: the circuit trace 9 is made of copper foil.
Example 10:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, as shown in fig. 1, the following arrangement structure is particularly adopted: the substrate layer 8 is a beryllium oxide plate, the semiconductor device mounting layer 6 is a ceramic plate with a hole cavity, and the insulating layer 5 is a polymer plate with a buried hole.
Example 11:
the present embodiment is further optimized based on any of the above embodiments, and further to better implement the present invention, the present invention can have a better heat dissipation effect, as shown in fig. 1, the following arrangement structure is particularly adopted: the heat dissipation layer 10 adopts an integrated heat sink.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A circuit board structure manufacturing method with a heat dissipation function is characterized in that: the circuit board structure with the heat dissipation function is manufactured and comprises the following steps:
1) laying an integrated chip (2) on the chip mounting layer (3), and placing for later use;
2) laying a semiconductor device (7) on the semiconductor device mounting layer (6), and placing for standby;
3) arranging the substrate layer (8), the insulating layer (5), the heat dissipation layer (10), the surface mounting element mounting layer (4) and the circuit wiring (9) for standby;
4) after the step 3), laying circuit wiring (9) on the substrate layer (8);
5) after the step 4), attaching the surface-mounted element on the finished surface-mounted element mounting layer (4), and placing for later use;
6) according to the design structure of the circuit board structure with the heat dissipation function, a chip mounting layer (3) provided with an integrated chip (2) and a semiconductor device mounting layer (6) provided with a semiconductor device (7) are assembled into the circuit board structure with the heat dissipation function by attaching a surface mounting element mounting layer (4) provided with a surface mounting element and a base plate layer (8), an insulating layer (5) and a heat dissipation layer (10) which are arranged after finishing.
2. The method for manufacturing a circuit board structure with a heat dissipation function according to claim 1, wherein the method comprises the following steps: the circuit board structure with the self-heat dissipation function is provided with a substrate layer (8), a semiconductor device mounting layer (6), an insulating layer (5) and a chip mounting layer (3), wherein the semiconductor device mounting layer (6) is arranged on one surface of the substrate layer (8), the insulating layer (5) is arranged on the opposite surface, provided with the substrate layer (8), of the semiconductor device mounting layer (6), and the chip mounting layer (3) is arranged on the opposite surface, provided with the semiconductor device mounting layer (6), of the insulating layer (5); a heat dissipation layer (10) is arranged on the opposite surface of the substrate layer (8) on which the semiconductor device mounting layer (6) is arranged; and circuit wiring (9) is also arranged on the surface of the substrate layer (8) which is in contact with the semiconductor device mounting layer (6) and the heat dissipation layer (10).
3. The method for manufacturing a circuit board structure with a heat dissipation function according to claim 2, wherein: a semiconductor device (7) is also provided on the semiconductor device mounting layer (6).
4. The method for manufacturing a circuit board structure with a heat dissipation function according to claim 3, wherein the method comprises the following steps: the semiconductor device (7) is arranged on the surface of the semiconductor device mounting layer (6) which is contacted with the insulating layer (5) or/and the substrate layer (8).
5. The method for manufacturing a circuit board structure with a heat dissipation function according to any one of claims 2-4, wherein: and a surface mounting element mounting layer (4) is also arranged between the chip mounting layer (3) and the insulating layer (5).
6. The method for manufacturing a circuit board structure with a heat dissipation function according to any one of claims 2-4, wherein: an integrated chip (2) is arranged on the chip mounting layer (3).
7. The method for manufacturing a circuit board structure with a heat dissipation function according to any one of claims 2-4, wherein: a plug-in unit (1) is provided on the side surface of the chip mounting layer (3).
8. The method for manufacturing a circuit board structure with heat dissipation function according to claim 3 or 4, wherein: the circuit wiring (9) is made of copper foil.
9. The method for manufacturing a circuit board structure with a heat dissipation function according to any one of claims 2-4, wherein: the substrate layer (8) is a beryllium oxide plate, the semiconductor device mounting layer (6) is a ceramic plate with a hole cavity, and the insulating layer (5) is a polymer plate with a buried hole.
10. The method for manufacturing a circuit board structure with a heat dissipation function according to any one of claims 2-4, wherein: the heat dissipation layer (10) adopts an integrated radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610690928.6A CN106163092B (en) | 2016-08-20 | 2016-08-20 | Manufacturing method of circuit board structure with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610690928.6A CN106163092B (en) | 2016-08-20 | 2016-08-20 | Manufacturing method of circuit board structure with heat dissipation function |
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| Publication Number | Publication Date |
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| CN106163092A CN106163092A (en) | 2016-11-23 |
| CN106163092B true CN106163092B (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610690928.6A Active CN106163092B (en) | 2016-08-20 | 2016-08-20 | Manufacturing method of circuit board structure with heat dissipation function |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1366446A (en) * | 2001-01-19 | 2002-08-28 | 松下电器产业株式会社 | Parts built in module and its making method |
| CN1731915A (en) * | 2004-08-04 | 2006-02-08 | 冲电气工业株式会社 | Multi-layer circuit board device |
| CN101236939A (en) * | 2008-02-26 | 2008-08-06 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device |
| CN104659005A (en) * | 2015-01-23 | 2015-05-27 | 三星半导体(中国)研究开发有限公司 | Packaging device, package stacking structure comprising packaging device, and manufacturing method of packaging device |
| CN105006453A (en) * | 2014-04-17 | 2015-10-28 | 台达电子国际（新加坡）私人有限公司 | Package structure |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| CN205248255U (en) * | 2015-02-04 | 2016-05-18 | 爱思开海力士有限公司 | Encapsulation stack type stacked package |
-
2016
- 2016-08-20 CN CN201610690928.6A patent/CN106163092B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1366446A (en) * | 2001-01-19 | 2002-08-28 | 松下电器产业株式会社 | Parts built in module and its making method |
| CN1731915A (en) * | 2004-08-04 | 2006-02-08 | 冲电气工业株式会社 | Multi-layer circuit board device |
| CN101236939A (en) * | 2008-02-26 | 2008-08-06 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device |
| CN105006453A (en) * | 2014-04-17 | 2015-10-28 | 台达电子国际（新加坡）私人有限公司 | Package structure |
| CN104659005A (en) * | 2015-01-23 | 2015-05-27 | 三星半导体(中国)研究开发有限公司 | Packaging device, package stacking structure comprising packaging device, and manufacturing method of packaging device |
| CN205248255U (en) * | 2015-02-04 | 2016-05-18 | 爱思开海力士有限公司 | Encapsulation stack type stacked package |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
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| CN106163092A (en) | 2016-11-23 |
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Effective date of registration: 20191225 Address after: 516100, Zhenlong County, Guangdong City, Boluo province Huizhou Court Industrial Zone Applicant after: Huizhou Wede circuit Co., Ltd. Address before: 610000 Sichuan Province, Chengdu Tianfu Avenue, No. 69, No. 1421 building 14 layer 1 Applicant before: Chengdu Shida cloud Technology Co. Ltd. |