CN2720626Y - 散热器 - Google Patents

散热器 Download PDF

Info

Publication number
CN2720626Y
CN2720626Y CN2004200711217U CN200420071121U CN2720626Y CN 2720626 Y CN2720626 Y CN 2720626Y CN 2004200711217 U CN2004200711217 U CN 2004200711217U CN 200420071121 U CN200420071121 U CN 200420071121U CN 2720626 Y CN2720626 Y CN 2720626Y
Authority
CN
China
Prior art keywords
radiating fin
radiator
mentioned
width
airflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004200711217U
Other languages
English (en)
Inventor
陈俊吉
周世文
翁世勋
武湛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2004200711217U priority Critical patent/CN2720626Y/zh
Priority to US11/135,164 priority patent/US20050286232A1/en
Application granted granted Critical
Publication of CN2720626Y publication Critical patent/CN2720626Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器,包括若干具一定间隔的散热鳍片,相邻散热鳍片之间形成若干气流通道,该气流通道具有气流入口及气流出口,该气流通道的气流入口及气流出口的宽度大于其中间部分气流通道的宽度。本实用新型散热器的气流入口和出口的流阻小,有利于提高散热效率。

Description

散热器
【技术领域】
本实用新型涉及一种散热器,尤其是指一种对发热电子元件散热用的散热器。
【背景技术】
随着电脑产业的快速发展,中央处理器等电子元件处理能力不断的升级,其散热用的散热模组也随着多样化,一般使用的散热模组是由散热器与风扇组合而成,其中散热器的一表面与电子元件接触,其另一表面形成若干具一定间距的散热鳍片,在这些散热鳍片之间具有若干气流通道,该散热器与气流通道相通的至少一侧安装一风扇,加快其热对流速度。
目前,所使用的大多数散热器为了增大其散热面积而增大散热鳍片的密度,这种散热器虽然增大散热面积,但同时带来了一个问题,那就是由于同一空间内散热鳍片的总厚度增大,使得散热器气流入口和出口的间距太小,增大气流流阻,降低热对流效率,影响整体散热效率。
【发明内容】
本实用新型的目的在于提供一种气流流阻小的鳍片组合式散热器。
本实用新型散热器,包括若干具一定间隔的散热鳍片,相邻散热鳍片之间形成若干气流通道,该气流通道具有气流入口及气流出口,该气流通道的气流入口及气流出口的宽度大于其中间部分气流通道的宽度。
与现有技术相比,本实用新型散热器由于其气流通道的气流入口及气流出口的宽度大于其中间部分的宽度,气流入口和出口的流阻小,有利于促进热对流速率而提高散热效率。
下面参照附图结合实施例对本实用新型作进一步的说明。
【附图说明】
图1是本实用新型散热器与相关元件的立体分解图。
图2是本实用新型散热器与相关元件的立体组合图。
图3是本实用新型散热器另一实施例的立体分解图。
【具体实施方式】
请参考图1和图2所示,本实用新型散热器10可与风扇20和热管30等元件相配合而固定在中央处理器(图未示)等电子元件上进行散热。该风扇20可通过一固定架22固定于散热器10一侧面,该热管30呈U字形,通过其两端可将散热器10的靠近热源的一端和远离热源的一端热性连接。
该散热器10包括一基座12及若干平行交错排列在基座12表面且具一定间隔的第一散热鳍片14和第二散热鳍片16,这些相邻散热鳍片14、16之间形成若干具有气流入口和气流出口的气流通道146,该基座12底面可与设在电路板(图未示)上的中央处理器(图未示)接触。上述第一散热鳍片14和第二散热鳍片16的主要区别在于,第一散热鳍片14的宽度小于第二散热鳍片16的宽度,当第一散热鳍片14和第二散热鳍片16交错排列时,第一散热鳍片14位于第二散热鳍片16的中部,使第二散热鳍片16的两侧端伸出第一散热鳍片14的两侧端,从而该气流通道146的气流入口和气流出口的宽度大于其中间部分的气流通道146的宽度。
请参考图3所示,是本实用新型另一实施例,该散热器10’与上述实施例的散热器10不同点在于,该散热器10’是由若干相同的散热鳍片14’组成,相邻的散热鳍片14’以相对横向错开的方式排列在基座12’上,即相邻散热鳍片14’的相应端部互相错开不平齐,从而形成若干气流入口和气流出口的宽度大于其中间部分的气流通道146’。
本实用新型是主要提供具有若干气流入口和气流出口的宽度大于其中间部分的气流通道,从而使气流入口和出口流阻小的散热器,故只要使若干散热鳍片交错排列形成若干气流入口和气流出口的宽度大于其中间部分的气流通道即可,例如风扇顶吹式的散热器,其散热鳍片顶端设置风扇,此时,可将散热鳍片顶端设置为高低交错排列的方式,而散热鳍片两侧端设置为上述
实施例中的方式。

Claims (7)

1.一种散热器,包括若干具一定间隔的散热鳍片,相邻散热鳍片之间形成若干气流通道,该气流通道具有气流入口及气流出口,其特征在于:该气流通道的气流入口及气流出口的宽度大于其中间部分气流通道的宽度。
2.如权利要求1所述的散热器,其特征在于:上述散热鳍片包括若干交错排列的第一散热鳍片和第二散热鳍片,该第一散热鳍片的宽度小于第二散热鳍片的宽度,上述第二散热鳍片的两侧端伸出第一散热鳍片的相对两侧端。
3.如权利要求1所述的散热器,其特征在于:上述相邻的散热鳍片以相对横向错开的方式排列形成。
4.如权利要求2或3所述的散热器,其特征在于:上述相邻散热鳍片的高度不等,其顶端以高低交错的方式排列形成。
5.如权利要求2或3所述的散热器,其特征在于:上述散热器还包括一风扇,该风扇固定于散热鳍片的侧端。
6.如权利要求4所述的散热器,其特征在于:上述散热器还包括一风扇,该风扇固定于散热鳍片的顶端。
7.如权利要求1所述的散热器,其特征在于:上述散热器还包括一基座,上述散热鳍片位于基座表面。
CN2004200711217U 2004-06-25 2004-06-25 散热器 Expired - Fee Related CN2720626Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2004200711217U CN2720626Y (zh) 2004-06-25 2004-06-25 散热器
US11/135,164 US20050286232A1 (en) 2004-06-25 2005-05-23 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2004200711217U CN2720626Y (zh) 2004-06-25 2004-06-25 散热器

Publications (1)

Publication Number Publication Date
CN2720626Y true CN2720626Y (zh) 2005-08-24

Family

ID=35009580

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004200711217U Expired - Fee Related CN2720626Y (zh) 2004-06-25 2004-06-25 散热器

Country Status (2)

Country Link
US (1) US20050286232A1 (zh)
CN (1) CN2720626Y (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7343962B2 (en) 2005-11-17 2008-03-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
CN103687423A (zh) * 2012-09-07 2014-03-26 宏碁股份有限公司 电子装置及其散热模块
CN113167457A (zh) * 2018-12-04 2021-07-23 Zkw集团有限责任公司 用于机动车光模块的热沉

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060181848A1 (en) * 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
US20070095509A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation having a heat pipe
CN100518475C (zh) * 2006-06-02 2009-07-22 富准精密工业(深圳)有限公司 散热装置
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
TW200905457A (en) * 2007-07-30 2009-02-01 Inventec Corp Heat-dissipating module
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
TWM358336U (en) * 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
TWM358337U (en) * 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
TWM380512U (en) * 2009-10-29 2010-05-11 Wistron Corp Heat sink and heat-dissipation fins thereof
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
TWI576038B (zh) * 2011-07-13 2017-03-21 鴻準精密工業股份有限公司 散熱裝置
TWI544203B (zh) * 2011-12-05 2016-08-01 技嘉科技股份有限公司 散熱裝置及其組裝方法
CN102724851B (zh) * 2012-06-01 2015-12-16 加弘科技咨询(上海)有限公司 散热装置及散热***
TWI564511B (zh) * 2015-10-14 2017-01-01 國立交通大學 散熱鰭片組
CN107293526B (zh) * 2016-04-01 2019-09-17 双鸿科技股份有限公司 散热装置
CN106852073B (zh) * 2017-01-13 2019-06-07 奇鋐科技股份有限公司 散热模组
JP6855873B2 (ja) * 2017-03-27 2021-04-07 富士電機株式会社 鉄道車両用電力変換装置
US10993352B2 (en) * 2019-01-08 2021-04-27 Te Connectivity Corporation Thermal transfer device for a pluggable module assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4408661A (en) * 1981-09-28 1983-10-11 Thermacore, Inc. Cabinet cooler heat exchanger
US6031720A (en) * 1997-11-14 2000-02-29 The Panda Project Cooling system for semiconductor die carrier
GB2342772A (en) * 1998-10-13 2000-04-19 Kuo Ching Sung Heat dissipating device
US6354367B1 (en) * 2001-02-12 2002-03-12 Rheem Manufacturing Company Air conditioning unit having coil portion with non-uniform fin arrangement
FR2826230B1 (fr) * 2001-06-19 2003-11-07 Bull Sa Dispositif et procede de fixation de circuits integres sur une carte a circuit imprime
EP1485661B1 (en) * 2002-02-28 2010-06-23 Lg Electronics Inc. Heat exchanger for refrigerator
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6847525B1 (en) * 2002-05-24 2005-01-25 Unisys Corporation Forced convection heat sink system with fluid vector control
US6827136B2 (en) * 2002-10-18 2004-12-07 Hon Hai Precision Ind. Co., Ltd. Heat dissipating apparatus and method for producing same
US6859367B2 (en) * 2003-01-03 2005-02-22 Intel Corporation Heat sink attachment device
US7042728B2 (en) * 2003-06-17 2006-05-09 Molex Incorporated Clamping structure and heat dissipating module using same
US7021368B2 (en) * 2003-11-12 2006-04-04 Cpumate Inc. Heat dissipating device with uniform heat points

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7343962B2 (en) 2005-11-17 2008-03-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
CN100464279C (zh) * 2005-11-17 2009-02-25 富准精密工业(深圳)有限公司 散热装置
CN103687423A (zh) * 2012-09-07 2014-03-26 宏碁股份有限公司 电子装置及其散热模块
CN113167457A (zh) * 2018-12-04 2021-07-23 Zkw集团有限责任公司 用于机动车光模块的热沉
CN113167457B (zh) * 2018-12-04 2024-02-09 Zkw集团有限责任公司 用于机动车光模块的热沉

Also Published As

Publication number Publication date
US20050286232A1 (en) 2005-12-29

Similar Documents

Publication Publication Date Title
CN2720626Y (zh) 散热器
CN1691316A (zh) 散热装置
CN201138463Y (zh) 具有导风罩的电脑***
CN101610658B (zh) 散热装置
CN100499983C (zh) 散热装置
CN101060763A (zh) 散热装置
CN102026522A (zh) 散热模组
CN101896054A (zh) 散热装置
CN100421052C (zh) 散热装置
CN1855456A (zh) 热管散热装置
CN101094579A (zh) 热管散热装置
CN102045989A (zh) 热管散热模组
US20080011452A1 (en) Heat sink
TWI334529B (en) Heat dissipation device
CN2672342Y (zh) 导风管及使用该导风管的散热装置
CN200965870Y (zh) 一种中央处理器散热器
US20100139892A1 (en) Heat dissipation device
CN2729902Y (zh) 散热装置
CN2850216Y (zh) 一种散热装置
CN102271479A (zh) 散热装置
CN1295345A (zh) 包含改善的热交换器的散热装置
CN102692979A (zh) 散热装置
CN101677503B (zh) 散热装置
CN2857221Y (zh) 带有导流罩的散热装置
CN101087506A (zh) 散热装置

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050824

Termination date: 20100625