CN2657347Y - 传接模组壳体组合 - Google Patents

传接模组壳体组合 Download PDF

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CN2657347Y
CN2657347Y CNU032731833U CN03273183U CN2657347Y CN 2657347 Y CN2657347 Y CN 2657347Y CN U032731833 U CNU032731833 U CN U032731833U CN 03273183 U CN03273183 U CN 03273183U CN 2657347 Y CN2657347 Y CN 2657347Y
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module casing
connects
circuit board
printed circuit
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黄竞亿
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种传接模组壳体组合，用以屏蔽收容于其中的多个传接模组，其包括一盖体、多个传接模组壳体及多个屏蔽底板。该传接模组壳体并列排布于盖体之下，多个卡持部从传接模组壳体上延伸出并穿过盖体的相应槽；盖体还包括多个安装脚，其收容于印刷电路板的相应收容孔中；传接模组壳体收容于印刷电路板的收容空间，将屏蔽底板固持于印刷电路板及相应的传接模组壳体上以完成传接模组壳体组合的安装。

Description

传接模组壳体组合
【技术领域】
本实用新型涉及一种用于屏蔽电磁干扰的传接模组壳体组合。
【背景技术】
传接模组作为通常应用于接口通信设备中，而在不同信号间进行转换(如将光、电信号相互转换，或将不同电信号相互转换)，且通常单独置于外壳中以屏蔽电磁干扰。现有技术的传接模组难以于电路板上实现高密度安装。所以，需要提供一种改进的廉价屏蔽外壳组件，使得多个传接模组易于在电路板上实现高密度安装。
【发明内容】
本实用新型的目的在于提供一种传接模组壳体组合，用于容置多个传接模组，且该传接模组壳体组合能够简便地组装于电路板上。
本实用新型所述的传接模组壳体组合，用以屏蔽收容于其中的多个传接模组，其包括一盖体、多个传接模组壳体及多个屏蔽底板。该传接模组壳体并列排布于盖体之下，多个卡持部从传接模组壳体上延伸出并穿过盖体的相应槽；盖体还包括多个安装脚，其收容于印刷电路板的相应收容孔中；传接模组壳体收容于印刷电路板的收容空间，将屏蔽底板固持于印刷电路板及相应的传接模组壳体上以完成传接模组壳体组合的安装。
本实用新型传接模组壳体组合可容置多个传接模组，并使传接模组紧密结合安装于印刷电路板上，装配简单、成本低。
【附图说明】
图1是本实用新型传接模组壳体组合与印刷电路板的组装立体图。
图2是图1无面板的立体图。
图3是本实用新型传接模组壳体组合固定在印刷电路板的立体分解图。
图4是图1传接模组壳体组合与印刷电路板的另一个角度的立体分解图。
图5是本实用新型传接模组壳体组合的分解立体图。
【具体实施方式】
请参照图1至图4，本实用新型传接模组壳体组合100包括多个传接模组壳体1、一盖体2和多个屏蔽底板9。传接模组壳体1相互平行，并分别内置传接模组4；盖体2与传接模组壳体1相扣合，并与印刷电路板3电性连接；屏蔽底板9对应安装在传接模组壳体1后部的末端及印刷电路板3，设有多个矩形窗口81的前面板8装配于印刷电路板3，传接模组壳体1的前端延伸出窗口81。
请结合参照图4和图5，传接模组壳体1包括一上盖6和一下盖7，其是由导电材料制成。上盖6包括顶壁61及两个沿其相下延伸的第一侧壁62，该顶壁61前端设有多个接地弹性臂611，顶壁61上开设有多个通孔613，利于传接模组4工作过程中的散热，顶壁61与第一侧壁62交接处开设有多个第一卡槽612a，该交接处的前端和末端设有多个第二卡槽612b。下盖7包括一第一底壁71及两个沿其向上延伸的第二侧壁72。第一底壁71间的宽度小于顶壁61的宽度，多个接地弹性部711分别于第一底壁71和第二侧壁72的前端向外延伸。一释放部712从第一底壁71前端的中部以一定角度向内延伸，为固定传接模组4于传接模组壳体1中，一三角开口713设于释放部712上，而与内置传接模组壳体1中的传接模组4底部凸块(图未示)卡配，将释放部712下压即可从传接模组壳体1中取出传接模组4。多个卡持部720a和凸起720b沿第二侧壁72垂直向上沿伸，卡持部720a与上盖6的相应第一卡槽612a齿合，且每一卡持部720a有一肘状齿合部，凸起720b与上盖6的相应第二卡槽612b齿合；一对卡扣722由两第二侧壁72伸出，用于配合屏蔽底板9；一对弹性臂723从第二侧壁72的末端相向向内弯折，当将传接模组4***传接模组壳体1中时，弹性臂723被压缩变形，当传接模组4从传接模组壳体1取出时，释放部712被压下，同时弹性臂723被释放，从而将传接模组4推出传接模组壳体1。两第二侧壁72上设有多个散热孔703。
组装传接模组壳体1时，上盖6与下盖7相卡合，第一侧壁62重叠于第二侧壁72上，下盖7的卡持部720a穿过上盖6上相对应的第一卡槽612a，凸起720b分别焊接于上盖6上相对应的第二卡槽612b，即完成传接模组壳体1的组装。
请结合参照图3和图4，盖体2包括一顶面板21、两侧面板22、一前面板23和一后面板(图未示)，该盖体2是由导电材料制成。顶面板21平坦呈矩形，其上设有两列狭槽211，狭槽211与侧面板22相互平行，当将传接模组壳体1平行装配到盖体2上时，通孔210和狭槽211分别与传接模组壳体1的通孔613和卡持部720a对应卡接。顶面板21的宽度大于多个传接模组壳体1宽度的总和，以确保多个传接模组壳体1置于盖体2时相邻传接模组壳体1间有一定的间隙。前面板23沿盖体2的前端垂直向上延伸以提高盖体2的强度，两侧面板22和后面板分别由顶面板21向下延伸。多个通孔210设置于顶面板21、侧面板22及后面板以利于传接模组4工作散热。多个安装脚221由侧面板22和后面板向下延伸，侧面板22和后面板的高度小于传接模组壳体1的高度。
将传接模组壳体1组装于盖体2上时，传接模组壳体1的卡持部720a穿过盖体2的狭槽211，传接模组壳体1相对于盖体2向后推，使得传接模组壳体1的前端裸露于盖体2之外，将传接模组壳体1焊接于盖体2，从而完成多个传接模组壳体1与盖体2之组装。
参照图3，印刷电路板3设有一矩形的收容空间31，收容孔32、33及多个电连接器5，其中，收容孔32环绕收容空间31，收容孔33位于一侧收容孔32的后面，与该侧收容孔32相应平行，电连接器5与印刷电路板3电性连接。
参照图2和图3，屏蔽底板9包括第二底壁91、两个第三侧壁93和一背面(图未示)，该屏蔽底板9是由导电材料制成。其中，背面沿底壁91之末端向上延伸，第三侧壁93上设有一对开孔930，用于接收传接模组壳体1的卡扣722，一对安装脚95沿背面的上边缘向上延伸，对应***印刷电路板3的收容孔33中，每个安装脚95的中间设有针眼。
请结合参照图1和图2，当将传接模组壳体组合100装配到印刷电路板3上时，盖体2的安装脚221***印刷电路板3上的对应收容孔32中，传接模组壳体1收容于印刷电路板3的收容空间31中，且其底部低于印刷电路板3，前面板8设有多个窗口81，传接模组壳体1的前端分别延伸出窗口。传接模组壳体1的接地弹性臂611、711紧贴于窗口81的内端面，电连接器5位于收容空间31的后端，且延伸至相应传接模组壳体1的后部，当传接模组4***相对应的传接模组壳体1时，其末端对应与电连接器5电性连接。传接模组壳体1底部的后端若无屏蔽壳将会受到电磁干扰，屏蔽底板9贴于印刷电路板3底边且覆盖相应的电连接器5，屏蔽底板9的开孔930与下盖7的第二侧壁72上的卡扣722相齿合。从而使得屏蔽底板9与传接模组壳体1相配合且装配于印刷电路板3上。
本实用新型传接模组壳体组合100通过盖体2收容多个传接模组壳体1，通过将盖体2的安装脚221***印刷电路板3对应的收容孔32中，即可将传接模组壳体1固定于印刷电路板3上，简化了多个传接模组4于印刷电路板3上的组装。另外，传接模组壳体1的底部延伸出印刷电路板3，以降低传接模组壳体组合100在印刷电路板3上的高度，从而缩小了传接模组壳体组合100在印刷电路板3上的装配体积。

Claims (10)

1.一种传接模组壳体组合，用于容置多个传接模组，可安装在印刷电路板上，其特征在于，包括多个导电传接模组壳体、一导电盖体和多个导电屏蔽底板，其中每个传接模组壳体可容置一个传接模组，所述传接模组壳体粘附且固持于盖体下，该盖体装配于印刷电路板上，传接模组壳体通过印刷电路板上的收容空间延伸出印刷电路板的下表面，屏蔽底板安装在传接模组壳体的下表面及相应传接模组壳体的底部。
2.如权利要求1所述的传接模组壳体组合，其特征在于：所述传接模组壳体并列排布于盖体下。
3.如权利要求1所述的传接模组壳体组合，其特征在于：所述传接模组壳体与盖体上设有多个散热通孔。
4.如权利要求1所述的传接模组壳体组合，其特征在于：所述粘附于盖体上的相邻传接模组壳体间留有间隙。
5.如权利要求1所述的传接模组壳体组合，其特征在于：所述屏蔽底板包括一底壁、两侧壁及由此向上延伸之后壁。
6.如权利要求5所述的传接模组壳体组合，其特征在于：至少有一安装脚沿屏蔽底板的侧壁或后壁向上延伸或由盖体延伸。
7.如权利要求5所述的传接模组壳体组合，其特征在于：屏蔽底板的侧壁叠于相应传接模组壳体，屏蔽底板的两侧壁设置有一对开孔，用于收容传接模组壳体之卡扣。
8.如权利要求1所述的传接模组壳体组合，其特征在于：多个卡持部从传接模组壳体伸出，收容于该盖体的相应狭槽。
9.一种传接模组壳体组合，用于容置多个电性或光电次组件，可安装在印刷电路板上，其特征在于，包括一导电性壳体和多个导电屏蔽底板，其中，该壳体包括多个狭槽，分别用于收容电性或光电次组件；狭槽间及壳体与外部均不是完全屏蔽，每一狭槽的一底角通过一通孔裸露于外部环境之中；每一可增强壳体抗屏蔽效果的导电屏蔽底板固持于相应狭槽且覆盖上述通孔。
10.如权利要求9所述的传接模组壳体组合，其特征在于：狭槽的至少一侧壁上设有含有一对卡扣的连接装置，该连接装置还包括一对设置于屏蔽底板上的扣环，该扣环与狭槽的卡扣对应扣合。
CNU032731833U 2003-03-12 2003-06-25 传接模组壳体组合 Expired - Fee Related CN2657347Y (zh)

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US10/387,821 US6729905B1 (en) 2003-03-12 2003-03-12 Transceiver cage assembly
US10/387,821 2003-03-12

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