CN2548394Y - 小型可插拔收发模组壳体 - Google Patents

小型可插拔收发模组壳体 Download PDF

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CN2548394Y
CN2548394Y CN02234181U CN02234181U CN2548394Y CN 2548394 Y CN2548394 Y CN 2548394Y CN 02234181 U CN02234181 U CN 02234181U CN 02234181 U CN02234181 U CN 02234181U CN 2548394 Y CN2548394 Y CN 2548394Y
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receiving module
transmitting
sfp
earthing device
module casing
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黄竞亿
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Hongteng Precision Technology Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0058Casings specially adapted for optoelectronic applications
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6582Shield structure with resilient means for engaging mating connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/939Electrical connectors with grounding to metal mounting panel

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种小型可插拔收发模组壳体,其包括分别采用单片金属板一体成型的一框架和一矩形接地装置。其中该框架包括两侧壁、一侧壁盖、一顶板、一底板及一后盖。该框架上设有多个内向弹片。该接地装置上设有多个外向接地弹片,且其底部中央设有一外向舌片。该框架的前部装配于一矩形面板的开口内,与该面板之间形成一缝隙,该矩形接地装置套接于框架的前部,且与上述所说缝隙紧密配合。该外向舌片遮蔽该框架的一弹性锁片与面板间的间隙。

Description

小型可插拔收发模组壳体
【技术领域】
本实用新型是关于一种应用于光通信***的收发模组壳体,尤指一种小型可插拔(Small Form-Factor Pluggable,SFP)收发模组壳体,其可收容用于高速率传输数据的界面转换器。
【背景技术】
在光通信***中,收发模组提供电界面与光数据链路间的双向数据传输。其可接收电编码数据信号,并将其转换为相应的光信号后在光网络中传输;同时收发模组也可接收光编码数据信号,并将其转换为电信号后传输到电界面。
通常,收发模组安装在主机、输入/输出***、***设备或交换机的印刷电路板上。小型可插拔收发模组通常插接于一安装在印刷电路板上的金属壳体中,该金属壳体一般包括两平行侧壁、一矩形顶板、一矩形底板、一前端及一后端,其易于相互连接,且容易安装于印刷电路板上,用于消除静电积累并作为电磁屏蔽壳体。
现有的收发模组壳体包括一安装于矩形面板开口中的入口部分,收发模组壳体邻近该入口部分设有多个外向突起的接地弹片,其邻接矩形面板开口边缘。该收发模组壳体在入口部分进一步包括一弹性锁片以锁固该小型可插拔收发模组于该壳体内,为方便弹性锁片操作以解除锁固于壳体内的小型可插拔收发模组,在该弹性锁片与矩形面板开口的边缘间会形成一缝隙。工作时,电磁波会穿过该缝隙,使该壳体不能为连接界面提供充分防止电磁干扰的保护。
此外,现有的小型可插拔收发模组壳体无特别的接地结构与***其中的小型可插拔收发模组外壳相连接。另外,现有的小型可插拔收发模组壳体仅通过定位脚使其支撑在印刷电路板上,而不具备卡锁机构,以致壳体焊接于印刷电路板时,会因焊料回流而脱离印刷电路板,造成焊接失败。
【发明内容】
本实用新型的目的在于提供一种小型可插拔收发模组壳体,其具备优良的电磁屏蔽性能,且在焊接时能够稳定固持于印刷电路板上、且制造方便、成本低廉。
本实用新型的目的是这样实现的:提供一小型可插拔收发模组壳体,其包括一框架及一套接于该框架前部的接地装置,该框架包括一顶板、一底板、一后盖及两侧壁,该接地装置设有至少一外向舌片与面板的一表面接触。多个内向接地弹片设有于框架前部的顶部、底部及两侧,该内向接地弹片伸入该壳体内与对应收发模组接触;多个卡扣脚、针眼脚和固持脚由框架侧壁伸出;该框架与矩形接地装置分别采用单片金属一体成型。
与现有技术相比,本实用新型的优点在于:该小型可插拔收发模组壳体包括多个外向及内向接地弹片,利于接地及防止电磁干扰;壳体包括多个引脚,在焊接时可将壳体稳固地安装于印刷电路板上。
【附图说明】
图1是本实用新型第一实施例小型可插拔收发模组壳体的立体分解图。
图2是图1所示小型可插拔收发模组壳体的立体组合图。
图3是图1所示小型可插拔收发模组壳体框架组装前的部分立体图。
图4是图1所示小型可插拔收发模组壳体框架组装前的后视图。
图5是图1所示小型可插拔收发模组壳体框架的仰视图。
图6是图2所示小型可插拔收发模组壳体安装于一印刷电路板上,且套于一矩形面板开口处的示意图。
图7是本实用新型第二实施例小型可插拔收发模组壳体的立体分解图。
图8是图7所示小型可插拔收发模组壳体的立体组合图。
图9是图8所示小型可插拔收发模组壳体安装于一印刷电路板上,且套于一矩形面板开口处的示意图。
图10是图6所示组合与位于壳体外的小型可插拔收发模组的示意图。
图11是图6所示组合与收容于其中的小型可插拔收发模组的剖面图。
【具体实施方式】
请参阅图1至图3,本实用新型第一实施例小型可插拔收发模组壳体1,包括一框架10及一矩形接地装置90。该框架10为平行六面体,一般采用单片材料(如金属板)一体成型,也可用两片单一材料制成。其包括一第一侧壁2a、一第二侧壁2b、一侧壁盖3、一顶板4、一底板5、一后盖及两弹性臂8a与8b,该后盖包括一外板6及一内板7。接地装置90一般采用单片材料(如金属板)一体成型,其套接于框架10的前部。
第一、第二侧壁2a、2b在框架最前端分别设有两内向接地弹片24,且下边缘延伸出多个卡扣脚21、针眼脚22及支撑脚23。第一侧壁2a上部设有多个弹性卡扣26,上边缘设有多个固定片27,且其后端边缘设有一小凹槽25。弹性臂8a、8b分别从第一及第二侧壁2a、2b后端向内延伸。
侧壁盖3由顶板4延展而成,并且与第一侧壁2a交叠,其设有多个开口31,以与第一侧壁2a的弹性卡扣26卡合。侧壁盖3与顶板4连接处设有多个矩形狭槽33,以与第一侧壁2a的固定片27卡合。顶板4前部设有三个内向接地弹片41,其中间及后部具多个通孔42以散热。
请参阅图3至图5,后盖的外板6由顶板4延展而成,其内表面向内延伸出一弹片61以与内板7卡合。内板7由第二侧壁2b延展而成,其底边缘延伸出多个卡扣脚71,一突起73位于内板7的自由端,其与第一侧壁2a的凹槽25卡合。
底板5比顶板4短,其前部中央有一弹性锁片52,该弹性锁片52稍微朝框架10内延伸,使之与相应小型可插拔收发模组400(请参照图11)卡合。弹性锁片52的两侧具有两内向接地弹片51a、51b,其间距较大,以确保弹性锁片52较宽而具有充分弹力。一卡扣脚53从底板5延伸而出,其位于底板中央,从底板5延伸而出,在底板5后端也有两卡扣脚54延伸而出。
卡扣脚21、针眼脚22及支撑脚23与其对应第一侧壁2a、2b共面。卡扣脚21、53、54及71分别从第一、第二侧壁2a、2b及底板5、内板7延伸而出,其包括延伸体212、532、542及712和偏移圆端211、531、541及711。其中偏移圆端211稍微向框架10的前部或后部弯曲,不同于偏移圆端211,偏移圆端531、541及711稍微朝向第一侧壁2a或第二侧壁2b。针眼脚22包括一椭圆体221及一椭圆孔222。椭圆体221的宽度与印刷电路板300(请参照图6)上对应的通孔相配合,使其可压入通孔,并且与印刷电路板300紧密结合。支撑脚23包括一伸长体232及一圆端231。
请再参阅图1和图2,接地装置90包括一顶盖91、一相对于顶盖91的底板95、位于顶盖91与底板95之间的第一和第二侧壁93a与93b。该第一侧壁93a仅与底板95一体连接,第二侧壁93b与顶盖91及底板95一体连接。该顶盖91上设有三外向接地弹片912,侧壁93a及93b上设有二外向接地弹片932,底板95上设有二外向接地弹片952,底板95中央设有一外向舌片954,底板95中央在舌片954上方有一个较大的空间955,以利于弹性锁片52的末端在其内部移动,二外向接地弹片952位于外向舌片954的两侧。
请再参阅图2和图3,组装框架10时,内板7的突起73与第一侧壁2a的凹槽25卡合,顶板4及侧壁盖3相互弯曲,以利于侧壁盖3紧扣于第一侧壁2a,外板6的内向弹片61与内板7卡合,使其置于合适位置,第一侧壁2a上的弹性卡扣26与侧壁盖3上的开口31卡合,其上的固定片27与矩形狭槽33卡合,因此侧壁盖3固定第一侧壁2a以形成框架10。弹性臂8a及8b设于内板7之上方,以利于相应小型可插拔收发模组(参照图10)从框架10弹出。
组装壳体1时,接地装置90通常采用点焊或粘附等方法套接在框架10的前端。另外,接地装置90也可用卡勾(图未示)安装于框架10的前端。接地装置90上的外向接地弹片912、932及952分别与框架10的顶板4、第一侧壁2a、第二侧壁2b及底板5的接地弹片41、24及51a与51b相对设置。外向舌片954处于底板5的弹性锁片52下,其自由端处于壳体1之下。
请配合参阅图5和图6,壳体1安装于印刷电路板300上时,卡扣脚21、53、54、71及针眼脚22穿过印刷电路板300上对应的通孔302。卡扣脚21、53、54及71上的偏移圆端211、531、541及711弹压印刷电路板300对应的通孔302,且至少一对圆端向相反方向延展,使其卡扣于对应通孔302的相对边缘,而保持平衡。针眼脚22压入印刷电路板300上的对应通孔302,且与其紧密配合。支撑脚23抵接于印刷电路板300的上表面304。卡扣脚21、53、54及71上的偏移圆端211、531、541及711以及针眼脚22的椭圆体221将壳体1锁固于印刷电路板300上,从而无论是否焊接,壳体1均能紧密且稳定安装于印刷电路板300上。如果壳体1是由焊接而固定于印刷电路板300上,卡扣脚21、53、54及71与针眼脚22可在焊接回流过程中防止壳体1在印刷电路板300上移动。此外,支撑脚23支撑分离壳体1与印刷电路板300,利于精确焊接。
使用时,壳体1与印刷电路板300的组装体固连在一带有面板200的机壳内(如通讯设备的机壳等,图未示)。面板200至少有一个开口202,且与印刷电路板300垂直。套接有接地装置90的框架10前部***面板200的开口202。接地装置90的外向接地弹片912、932及952抵顶在面板200上的开口202对应四周边缘(未标示)。外向舌片954抵顶于面板200的内表面203。弹性锁片52、接地弹片51a及51b与面板的开口202的下底边缘间形成一个空隙(未标示)。外向舌片954可作为电磁干扰的防护体,用以防止任何通过该空隙的干扰电磁。同时,该外向舌片954提供充足的空间,以利于小型可插拔收发模组400(请参照图11)从壳体1插拔时弹性锁片52的上下移动。
请配合参阅图10和图11,安装在壳体1中的小型可插拔收发模组400具有一导电外表面402。一个卡扣404位于模组400上,与壳体1的弹性锁片52卡合。第一侧壁2a与2b、顶板4及底板5上对应的内向接地弹片24、41、51a及51b伸入壳体1的空腔(未标示)内,与小型可插拔收发模组400的电传导外表面402接触。因此,内向接地弹片24、41、51a、51b,外向接地弹片912、932、952及外向舌片954配合,确保小型可插拔收发模组400、框架10、接地装置90与面板200间具有多路电性连接,从而,壳体1提供多路接地途径以有效防止电磁干扰。
请参阅图7至图9,本创作第二实施例小型可插拔收发模组壳体1′,其结构与第一实施例小型可插拔收发模组壳体1相似。但壳体1 ′包括一矩形接地装置90′,其代替第一实施例的接地装置90。该接地装置90′在其底板95′中心部分处设有两个外向舌片954′。两个外向接地弹片952′分别位于外向舌片954′两侧。该接地装置90′也有外向接地弹片912′及932′。外向舌片954′抵顶于面板200的内表面203上。框架10上的内向接地弹片24、41、51a、51b,外向接地弹片912′、932′、952′及外向舌片954′相互配合,确保小型可插拔收发模组400、框架10、接地装置90′与面板200间具有多路电性连接。从而,壳体1 ′提供多路接地途径以防止电磁干扰。
此外,接地装置也可以是仅与底板5连接的接地面板,其具有外向舌片,可实现与壳体1及1′对应的接地装置90及90′相同的功能。

Claims (10)

1.一种小型可插拔收发模组壳体,是安装于一机壳内,用以收容一收发模组,其包括:一框架,该框架包括一顶板、一底板、一后盖及位于顶板及底板之间的两侧壁,其特征在于该壳体还包括一接地装置,该接地装置是与框架电性连接,该接地装置包括至少一外向舌片与机壳的一面板的一表面接触。
2.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该面板设有至少一开口,该壳体的一部分***该开口中,接地装置进一步设有至少一外向接地弹片,该外向接地弹片可与该面板开口的对应四周边缘接触。
3.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该接地装置具有合适的尺寸,使其紧密套接于该框架前部。
4.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该框架和接地装置可分别由一单片金属板制成
5.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该接地装置点焊于框架前部。
6.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该接地装置采用至少一卡勾安装于框架前部。
7.如权利要求1小型可插拔收发模组壳体,其特征在于该框架在前部设有多个内向接地弹片。
8.如权利要求7所述的小型可插拔收发模组壳体,其特征在于该内向接地弹片伸入该壳体内与对应收发模组接触,以提供多个接地通路及防止电磁干扰。
9.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该框架的底板上设有一弹性锁片,该接地装置的外向舌片是定位于该弹性锁片的下方。
10.如权利要求1所述的小型可插拔收发模组壳体,其特征在于该壳体每一侧壁具有多个向下延伸而成的针眼脚及卡扣脚,并且至少有一对卡扣脚具有偏移圆端。
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