CN2362257Y - Cooling device for electronic element and device - Google Patents
Cooling device for electronic element and device Download PDFInfo
- Publication number
- CN2362257Y CN2362257Y CN 98249217 CN98249217U CN2362257Y CN 2362257 Y CN2362257 Y CN 2362257Y CN 98249217 CN98249217 CN 98249217 CN 98249217 U CN98249217 U CN 98249217U CN 2362257 Y CN2362257 Y CN 2362257Y
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating substrate
- radiating
- circuit board
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiating device for electronic components. The heat radiating device for electronic components comprises a circuit board, an electronic component, an upper heat radiating base board and a lower heat radiating base board, wherein, a plurality of leading legs arranged on the bottom surface is arranged on the upper surface of the circuit board; a heat radiating opening arranged under the electronic component is arranged on the circuit board; the upper heat radiating base board is arranged between the electronic component and the circuit board and crossed above the heat radiating opening; the area of the upper heat radiating base board is larger than the area of the bottom surface of the electronic component; the upper heat radiating base board is provided with a leading leg slot, through which the leading legs can penetrate; the lower heat radiating base board is arranged under the circuit board; an extending part extruded into the heat radiating opening.
Description
The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for electronic devices and components.
In electronic product, the solution of heat dissipation problem is always a major issue, and especially in the application of integrated circuit, its heating phenomenon often influences its performance of product, dispels the heat when bad, the unstable product quality phenomenon is often arranged, even influence the useful life of product.
In the heat abstractor of known electronic product, common has with the cross-ventilated fan-type device of compulsory type, as apply to the heat abstractor of host computer or other relatively large electronic installations, in addition, heat abstractor at indivedual electronic components is also arranged, this type of device mainly applies on the relatively large integrated circuit or supply unit, be installed on the circuit board 1 as the electronic devices and components among Fig. 12, and heat radiation fin keel 3 generally is to place on the electronic devices and components 2, absorbs the heat energy that it is produced with the last plane by electronic devices and components 2.
Yet, in some electronic devices and components, plane has specific function (as window, sensing element or other likes of CCD integrated circuit and CMOS integrated circuit) on it, the side directly is provided with heat abstractor thereon, for solving the heat dissipation problem of these type of electronic devices and components, its heat abstractor is changed to as shown in Figure 2; Among Fig. 2, one has the electronic devices and components 2 of window 21 on, be installed on the circuit board 1, because of last window 21 often has special purposes, so known heat radiation fin keel 2 as shown in Figure 1 can't apply on the electronic devices and components 2 of Fig. 2, but for reaching the heat radiation purpose, guarantee operational quality, so heat-radiating substrate 4 on is set in electronic devices and components 2 and 1 of circuit board, derive by the last heat-radiating substrate 4 of below in order to the heat that electronic devices and components 2 are produced, and be diffused in the ambient air, certainly, last heat-radiating substrate 4 also need comprise the pin groove 41 that the pin 23 of the sub-components and parts 2 of powering passes through.
In above-mentioned known heat-radiating device of electric component, though last heat-radiating substrate 4 can be derived heat by the below of electronic devices and components, but its radiating mode, be earlier by the contact heat conduction of electronic devices and components with last heat-radiating substrate 4, when treating the outer rim of the supreme heat-radiating substrate 4 of heat diffusion, heat could be disengaged; But, on circuit board, the setting of other electronic devices and components is still arranged, so space that is provided with of having limited last heat-radiating substrate 4, cause the outer rim of the outer rim of heat-radiating substrate 4 and electronic devices and components very approaching, last heat-radiating substrate 4 has almost completely blocked contacting of electronic devices and components belows and air, loses cross-ventilated function, the heat sinking function that this can influence heat-radiating substrate 4 inevitably influences the thermolysis of electronic devices and components.
The heat abstractor that provides a kind of radiating efficiency high is provided main purpose of the present utility model, by the setting of electronic devices and components below radiating opening, increases the heat-dissipating space of electronic devices and components below, effectively promotes the effect to cooling electronic component.
Another purpose of the present utility model is to provide a kind of heat abstractor of being convenient to heat diffusion, by the last heat-radiating substrate that is arranged at electronic devices and components belows and be positioned at below the heat-radiating substrate and run through the radiating opening of circuit board, effectively the heat diffusion that electronic devices and components produced is gone out.
For achieving the above object, the utility model is taked following measure:
The heat abstractor that is used for electronic devices and components of the present utility model comprises:
One circuit board, it has a upper surface and a lower surface;
One electronic devices and components, a plurality of pins of its bottom surface are located at the upper surface top of circuit board;
Heat-radiating substrate on one;
It is characterized in that: circuit board is provided with a radiating opening that runs through circuit board thickness, and radiating opening is positioned at place, electronic devices and components below.
Described heat abstractor is characterized in that, the described heat-radiating substrate of going up is arranged between described electronic devices and components and the described circuit board, traverses above described radiating opening.
Described heat abstractor is characterized in that, the described area of going up the area of heat-radiating substrate greater than described electronic devices and components bottom surface, and last heat-radiating substrate also has the pin groove that the pin of the sub-components and parts of powering passes through.
Described heat abstractor is characterized in that, also comprises heat-radiating substrate, is arranged at the below of described circuit board, and following heat-radiating substrate is provided with an extension, and extension is in order to charging into described radiating opening, and contacts with the bottom surface of described electronic devices and components.
Described heat abstractor is characterized in that, also comprises heat-radiating substrate, is arranged at the below of described circuit board; Be provided with a perforation arm that passes described radiating opening between last heat-radiating substrate and the following heat-radiating substrate.
Described heat abstractor is characterized in that, is separated with a distance between described down heat-radiating substrate and circuit board, and following heat-radiating substrate is also fixedlyed connected with circuit board by one group of retaining element.
Described heat abstractor is characterized in that, described retaining element is a screw.
Described heat abstractor is characterized in that, the described heat-radiating substrate of going up is provided with at least two in order to increase the radiating groove of going up heat-radiating substrate and air contact area.
Described heat abstractor is characterized in that, described heat-radiating substrate down is provided with at least two radiating grooves in order to heat-radiating substrate under increasing and air contact area.
Described heat abstractor is characterized in that, described perforation arm and described last heat-radiating substrate are one-body molded.
Described heat abstractor is characterized in that, described perforation arm and described following heat-radiating substrate are one-body molded.
Compared with prior art, the utlity model has following effect:
Because the utility model offers radiating opening and is provided with upper and lower heat-radiating substrate in the circuit board below on the circuit board of electronic devices and components below; Be provided with an extension that runs through radiating opening on the following heat-radiating substrate again; Like this, the conduction of accelerated heat and diffusion are protected electronic devices and components effectively greatly.
Conjunction with figs. and embodiment are described in detail as follows heat abstractor of the present utility model:
The accompanying drawing simple declaration:
Fig. 1 is a kind of schematic perspective view of the known heat abstractor that is used for electronic devices and components.
Fig. 2 is the schematic perspective view of the known heat abstractor that is used for electronic devices and components of another kind.
Fig. 3 is the stereogram of heat abstractor first embodiment of the present utility model.
Fig. 4 is the three-dimensional exploded view of heat abstractor second embodiment of the present utility model.
Fig. 5 is the generalized section of heat abstractor the 3rd embodiment of the present utility model.
Fig. 6 is the generalized section of heat abstractor the 4th embodiment of the present utility model.
See also shown in Figure 3ly, a kind of heat abstractor that is used for electronic devices and components of the present utility model is mainly used in being located at electronic devices and components 2 heat radiation on the circuit board 1, and wherein circuit board 1, has certain thickness, and it includes a upper surface and a lower surface; Electronic devices and components 1, a plurality of pins 23 of its bottom surface are positioned at the upper surface top of circuit board 1; Heat abstractor of the present utility model is characterised in that: locate below the bottom surface of electronic devices and components 2, circuit board 1 is provided with a radiating opening 11 that runs through circuit board 1 thickness, and that radiating opening 11 can be is square, fence shape, ellipse or other do not influence the shape that electronic devices and components 2 are provided with.
As shown in Figure 3, first embodiment of the present utility model, heat abstractor promptly utilize the air heat radiation of 11 pairs of electronic devices and components 2 belows of radiating opening, because of electronic devices and components 2 belows are a space of opening wide, help circulation of air, that is convenient cross-ventilation, so heat easily spreads.
See also shown in Figure 4, second embodiment of the present utility model, below the electronic devices and components 2 and between the upper surface of circuit board 1, can be provided with again just like the last heat-radiating substrate 4 in the known heat abstractor, it is made by the good metal of thermal conductivity, can traverse above radiating opening 11, with the heat rapid diffusion that electronic devices and components 2 are produced; The area of last heat-radiating substrate 4 is more preferably greater than the area of electronic devices and components 2 bottom surfaces, can be provided with pin groove 41 on the last heat-radiating substrate 4 and pass through for the pin 23 of electronic devices and components 2.
As shown in Figure 4, among the utility model second embodiment, the heat that electronic devices and components 2 are produced can carry out heat exchange with air by the outer rim and the root edge (seeing through radiating opening 11) of last heat-radiating substrate 4; For increasing the area of dissipation of going up heat-radiating substrate 4, last heat-radiating substrate 4 can be provided with a plurality of radiating grooves 43 again, in order to enlarge the contact area that goes up heat-radiating substrate 4 and air, more helps the diffusion of heat.
As shown in Figure 5, in the 3rd embodiment of the present utility model, the heat abstractor of electronic devices and components 2 can comprise heat-radiating substrate 5 again, it is arranged at the lower surface below of circuit board 1, and extension 13 on having, in order to pass radiating opening 11 to contact with electronic devices and components 2 bottom surfaces 25, conduct to circuit board 1 below with the heat that electronic devices and components 2 are produced, and by the surface radiating that descends heat-radiating substrate 5; And under the optimum of this embodiment, the lower surface of following heat-radiating substrate 5 and circuit board 1 is separated with a distance between answering, to enlarge area of dissipation and to avoid interfering with the setting of electronic devices and components 2 and other parts, it also can be fixedlyed connected in appropriate location by one group of retaining element and circuit board 1, and this retaining element can be as the fixed screw among the figure 51, fastener, insert or other likes.
As shown in Figure 5, among the utility model the 3rd embodiment, the heat that electronic devices and components 2 are produced, can be by the full surface and the air of heat-radiating substrate 5 carry out heat exchange down, its advantage is that area of dissipation is big, and can rapidly heat be brought to below, with of the influence of effective reduction heat to electronic devices and components 2 away from the circuit board 1 of electronic devices and components 2; In like manner, for increasing the area of dissipation of heat-radiating substrate 5 down, following heat-radiating substrate 5 can comprise a plurality of radiating grooves 43 again, in order to the contact area of heat-radiating substrate 5 under enlarging once more with air, more helps the carrying out of dispelling the heat.
As shown in Figure 6, among the 4th embodiment of the present utility model, heat abstractor can comprise simultaneously that above-mentioned last heat-radiating substrate 4 reaches heat-radiating substrate 5 down; Wherein, following heat-radiating substrate 5 is provided with a roughly the same aforementioned perforation arm 53 of going up extension again, in order to pass radiating opening 11, to be connected in the joint seat 45 of heat-radiating substrate 4, by this, the heat that electronic devices and components 2 can be produced, rapidly by last heat-radiating substrate 4, connect arm 53 and heat-radiating substrate 5 diffusions down, again by last heat-radiating substrate 4, connect arm 53 and down the surface that contacts with air of heat-radiating substrate 5, with heat release to surrounding environment.
In the present embodiment, the major function that connects arm 53 is heat-radiating substrate 4 and heat-radiating substrate 5 down on heat is communicated with, and is transmitted to down rapidly on the heat-radiating substrate 5 will go up the heat that heat-radiating substrate 4 absorbed, and reaches the heat purpose of dispersion fast; As shown in Figure 6, among the embodiment, connect arm 53 and be shaped in down on the heat-radiating substrate 5; Among another embodiment, this jockey can also one be located on the heat-radiating substrate 4 or with independent armite and be replaced.
In of the present utility model, for reaching the purpose that enlarges area of dissipation, all can construct the device in order to the groove that increases radiating surface, lines, overshooting shape on the upper and lower heat-radiating substrate, to strengthen the heat conduction function of heat abstractor, the metal material that the material of its made should be the high heat conduction efficiency of tool is good.
The above describes architectural feature of the present utility model in detail for utilizing preferred embodiment, and unrestricted scope of the present utility model.
Claims (11)
1, a kind of heat abstractor that is used for electronic devices and components comprises:
One circuit board, it has a upper surface and a lower surface;
One electronic devices and components, a plurality of pins of its bottom surface are located at the upper surface top of circuit board;
Heat-radiating substrate on one;
It is characterized in that: circuit board is provided with a radiating opening that runs through circuit board thickness, and radiating opening is positioned at place, electronic devices and components below.
2, heat abstractor according to claim 1 is characterized in that, the described heat-radiating substrate of going up is arranged between described electronic devices and components and the described circuit board, traverses above described radiating opening.
3, heat abstractor according to claim 2 is characterized in that, the described area of going up the area of heat-radiating substrate greater than described electronic devices and components bottom surface, and last heat-radiating substrate also has the pin groove that the pin of the sub-components and parts of powering passes through.
4, heat abstractor according to claim 3 is characterized in that, also comprises heat-radiating substrate, be arranged at the below of described circuit board, following heat-radiating substrate is provided with an extension, and extension is in order to charging into described radiating opening, and contacts with the bottom surface of described electronic devices and components.
5, heat abstractor according to claim 3 is characterized in that, also comprises heat-radiating substrate, is arranged at the below of described circuit board; Be provided with a perforation arm that passes described radiating opening between last heat-radiating substrate and the following heat-radiating substrate.
6, according to claim 4 or 5 described heat abstractors, it is characterized in that, be separated with a distance between described down heat-radiating substrate and circuit board, following heat-radiating substrate is also fixedlyed connected with circuit board by one group of retaining element.
7, heat abstractor according to claim 6 is characterized in that, described retaining element is a screw.
According to each the described heat abstractor in claim 3 or 4 or 5, it is characterized in that 8, the described heat-radiating substrate of going up is provided with at least two in order to increase the radiating groove of going up heat-radiating substrate and air contact area.
According to claim 4 or 5 described heat abstractors, it is characterized in that 9, described heat-radiating substrate down is provided with at least two radiating grooves in order to heat-radiating substrate under increasing and air contact area.
10, heat abstractor according to claim 5 is characterized in that, described perforation arm and described last heat-radiating substrate are one-body molded.
11, heat abstractor according to claim 5 is characterized in that, described perforation arm and described following heat-radiating substrate are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98249217 CN2362257Y (en) | 1998-12-03 | 1998-12-03 | Cooling device for electronic element and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98249217 CN2362257Y (en) | 1998-12-03 | 1998-12-03 | Cooling device for electronic element and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2362257Y true CN2362257Y (en) | 2000-02-02 |
Family
ID=33994030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98249217 Expired - Fee Related CN2362257Y (en) | 1998-12-03 | 1998-12-03 | Cooling device for electronic element and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2362257Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN108174075A (en) * | 2018-02-28 | 2018-06-15 | 信利光电股份有限公司 | A kind of TOF camera modules and electronic equipment |
| CN108650789A (en) * | 2018-07-19 | 2018-10-12 | 珠海格力电器股份有限公司 | Circuit board assemblies, controller and electrical installation |
| CN109951992A (en) * | 2017-12-21 | 2019-06-28 | 苏州旭创科技有限公司 | Radiating module and optical module |
-
1998
- 1998-12-03 CN CN 98249217 patent/CN2362257Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951992A (en) * | 2017-12-21 | 2019-06-28 | 苏州旭创科技有限公司 | Radiating module and optical module |
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN108174075A (en) * | 2018-02-28 | 2018-06-15 | 信利光电股份有限公司 | A kind of TOF camera modules and electronic equipment |
| CN108650789A (en) * | 2018-07-19 | 2018-10-12 | 珠海格力电器股份有限公司 | Circuit board assemblies, controller and electrical installation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1300633C (en) | Backlight module and heat sink structure | |
| CN2763976Y (en) | Heat radiator | |
| CN1321337A (en) | Heat sink including heat receiving surface with protruding portion | |
| CN2362257Y (en) | Cooling device for electronic element and device | |
| WO2014134929A1 (en) | A printed circuit board (pcb) structure | |
| CN100345289C (en) | Hot-piping radiator | |
| CN2819289Y (en) | Radiator | |
| CN2671119Y (en) | Radiator | |
| CN2514400Y (en) | Radiating device for computer | |
| CN1681113A (en) | Hot-piping radiator | |
| CN2909365Y (en) | Heat sink structure | |
| CN2514397Y (en) | Radiator | |
| CN200965871Y (en) | CPU heat dissipation device | |
| CN2909797Y (en) | Heat sink | |
| CN2875002Y (en) | Assembling type heat radiator structure | |
| CN1314111C (en) | Functional module with built-in radiating fin | |
| CN214960777U (en) | Heat radiator | |
| CN2553514Y (en) | Improved radiator | |
| CN2585412Y (en) | Honey-comb like heat sink structure | |
| CN2547004Y (en) | Radiator of CPU | |
| CN2696125Y (en) | Plate heat sink | |
| CN215494920U (en) | Heat dissipation arrangement structure | |
| CN2394406Y (en) | Heat radiator | |
| CN206451113U (en) | A kind of bionical radiator aluminum alloy material of high-termal conductivity | |
| CN2772023Y (en) | Radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |