CN108650789A - Circuit board assembly, controller and electrical device - Google Patents
Circuit board assembly, controller and electrical device Download PDFInfo
- Publication number
- CN108650789A CN108650789A CN201810797768.4A CN201810797768A CN108650789A CN 108650789 A CN108650789 A CN 108650789A CN 201810797768 A CN201810797768 A CN 201810797768A CN 108650789 A CN108650789 A CN 108650789A
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- Prior art keywords
- circuit board
- electronic component
- component
- controller
- board assemblies
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- 239000003507 refrigerant Substances 0.000 claims abstract description 45
- 230000000712 assembly Effects 0.000 claims description 29
- 238000000429 assembly Methods 0.000 claims description 29
- 238000010616 electrical installation Methods 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000005070 sampling Methods 0.000 claims description 5
- 238000004378 air conditioning Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 206010037660 Pyrexia Diseases 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 210000004209 hair Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009421 internal insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to a circuit board assembly, a controller and an electrical device, and belongs to the technical field of circuit boards. The circuit board assembly of the application includes: the circuit board comprises a first surface and a second surface which are oppositely arranged; the refrigerant pipe is arranged on one side of the first surface of the circuit board; the electronic components comprise a first type of electronic components and a second type of electronic components, and the heat productivity of the first type of electronic components is larger than that of the second type of electronic components; the first type of electronic components are arranged on one side of the first surface of the circuit board, and the second type of electronic components are arranged on one side of the second surface of the circuit board; each electronic component of the first type of electronic component is respectively close to or attached to the refrigerant pipe. Through the application, the heat dissipation problem of the electronic component with large heat productivity on the circuit board can be effectively solved, and the overall working performance of the circuit board and the controller is further ensured.
Description
Technical field
The application belongs to circuit board technology field, and in particular to circuit board assemblies, controller and electrical installation.
Background technology
As application of the frequency-variable controller in electrical installation is more and more wider, for example, it is applied to air-conditioning, frequency-variable controller hair
Heat problem becomes the key factor for influencing controller reliability.To find out its cause, on the circuit board of frequency-variable controller, exist very much
High-voltage great-current electronic component, and the heat that these electronic components are sent out at work is larger, in frequency-variable controller
Leading factor is played in terms of fever, for the big electronic component of these calorific values, the amount of heat sent out is accumulated in frequency conversion
In controller, the working performance of circuit board entirety can be influenced, and then influences the reliability of controller.
Therefore, for the big electronic component of calorific value on circuit board, there is improved demands in terms of heat dissipation.
Invention content
To solve the heat dissipation problem of the big electronic component of calorific value on circuit board at least to a certain extent, the application carries
For a kind of circuit board assemblies, controller and electrical installation.
In order to achieve the above object, the application adopts the following technical scheme that：
In a first aspect, this application provides a kind of circuit board assemblies, including：
Circuit board, including the first surface and second surface that are oppositely arranged；
Refrigerant pipe is arranged in the first surface side of the circuit board；
Electronic component, including first kind electronic component and the second electron-like component, the first electron-like member device
The calorific value of part is more than the calorific value of the second electron-like component；
The first kind electronic component is arranged in the first surface side of the circuit board, second electron-like
Component is arranged in the second surface side of the circuit board；
Each electronic component of the first kind electronic component respectively close to or the fitting refrigerant pipe be arranged.
Further, the first kind electronic component is arranged on the first surface of the circuit board, second class
Electronic component is arranged on the second surface of the circuit board opposite with the first surface.
Further, part electronic component is arranged far from the first surface in the first kind electronic component, and
It is connect with the circuit board by connecting line.
Further, further include：
Cooling fin, fitting are arranged on the part electronic component in the first kind electronic component.
Further, when the circuit board assemblies are applied in frequency-variable controller, the first kind electronic component includes
At least one of in following item：
Electrolytic capacitor, relay, inductance and IPM modules.
Further, when the circuit board assemblies are applied in frequency-variable controller, the second electron-like component includes
At least one of in following item：
Patch capacitor, Chip-R, control chip, sampling A/D chip and filtering device.
Further, the circuit board is pcb board.
Second aspect, this application provides a kind of controllers, including：Circuit board assemblies as described in any one of the above embodiments, with
And electrical appliance kit, the circuit board assemblies are some or all of to be arranged in the electrical appliance kit.
Further, if the circuit board assemblies are provided entirely in the electrical appliance kit, the circuit board is by the electricity
Device box is isolated into two independent sealed spaces.
Further, the second surface of the electrical appliance kit and the circuit board forms a sealing space, and the circuit
The first surface of plate is contacted with external environment.
The third aspect, this application provides a kind of electrical installations, including：Controller as described in any one of the above embodiments.
Further, the electrical installation is air-conditioning.
The application uses above technical scheme, at least has following advantageous effect：
Electronic component is divided into first kind electronic component and the second class by the application according to the calorific value of electronic component
Electronic component, the calorific value of first kind electronic component are more than the calorific value of the second electron-like component, by two electron-likes member
Device is separately positioned on the two sides of circuit board, and refrigerant pipe serpentine pattern is utilized refrigerant around first kind electronic component
Refrigerant in pipe, which is absorbed and conducted, takes away the heat that first kind electronic component is sent out, and can efficiently solve calorific value on circuit board
The heat dissipation problem of big electronic component, and then ensure the working performance of circuit board and controller entirety.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
The application can be limited.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram for the circuit board first surface that the application one embodiment provides；
Fig. 2 is the structural schematic diagram for the circuit board that the application one embodiment provides；
Fig. 3 is the schematic diagram that the electronic component of frequency-variable controller is classified according to calorific value；
Fig. 4 is the structural schematic diagram for the circuit board that the application another embodiment provides；
Fig. 5 is the structural schematic diagram for the controller that the application one embodiment provides；
Fig. 6 is the structural schematic diagram for the controller that the application another embodiment provides；
In figure,
1- circuit boards；
2- refrigerant pipes；
3- electronic components；
31- first kind electronic components；
31a- electrolytic capacitors；31b- relays；31c-IPM modules；31d- inductance；
32- the second electron-like components；
32a- patch capacitors；32b- controls chip；32c- Chip-Rs；32d- sampling A/D chips；32e- filtering devices；
4- holders；
5- connecting lines；
6- cooling fins；
7- electrical appliance kits.
Specific implementation mode
To keep the purpose, technical scheme and advantage of the application clearer, the technical solution of the application will be carried out below
Detailed description.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.Base
Embodiment in the application, those of ordinary skill in the art are obtained all without making creative work
Other embodiment belongs to the range that the application is protected.
Fig. 1 is the structural schematic diagram for the circuit board first surface that the application one embodiment provides；Fig. 2 is the application one
The structural schematic diagram for the circuit board that embodiment provides；As depicted in figs. 1 and 2, the circuit board assemblies, including：
Circuit board 1, including the first surface and second surface that are oppositely arranged；
Refrigerant pipe 2 is arranged in the first surface side of the circuit board 1；
Electronic component 3, including first kind electronic component 31 and the second electron-like component 32, first electron-like
The calorific value of component 31 is more than the calorific value of the second electron-like component 32；
The first kind electronic component 31 is arranged in the first surface side of the circuit board 1, second class
Electronic component 32 is arranged in the second surface side of the circuit board 1；
Each electronic component 3 of the first kind electronic component 31 respectively close to or the fitting refrigerant pipe 2 set
It sets.
Said program is further elaborated below in conjunction with concrete application example, by taking frequency-variable controller as an example, is become
On the circuit board of frequency controller, forceful electric power circuit is related to the big electronic component of calorific value, such as electrolytic capacitor, relay, electricity
The high power devices such as sense, IPM modules are the big component of calorific value, wherein IPM modules, i.e. intelligent power module, IPM are
The abbreviation of Intelligent Power Module, IPM modules its device for power switching and driving circuit are not only integrated in one
It rises, is also integrated with overvoltage, the fault detection circuits such as overcurrent and overheat.Control circuit on the circuit board of frequency-variable controller relates to
And electronic component that calorific value is small, such as patch capacitor, Chip-R, control chip, sampling A/D chip and filter element etc.
It is the small component of calorific value Deng, these electronic components.
Fig. 3 is the schematic diagram that the electronic component of frequency-variable controller is classified according to calorific value；As shown in figure 3, by electric
Calorific value size when sub- component 3 is according to work is classified, and first kind electronic component 31 and the second electron-like member are divided into
Device 32, first kind electronic component 31 may include electrolytic capacitor 31a, relay 31b, IPM module 31c and inductance 31d etc.；
Second electron-like component 32 may include patch capacitor 32a, control chip 32b, Chip-R 32c, sampling A/D chip 32d and
Filtering device 32e etc..Wherein, the calorific value of first kind electronic component 31 is more than the fever of the second electron-like component 32
Amount.
After the different electronic component of these calorific values is distinguished, electronic component layout is carried out, such as Fig. 1 and figure
Shown in 2, first kind electronic component 31 therein is arranged in the first surface side of circuit board 1, by the second class therein electricity
Sub- component 32 is arranged in the second surface side of circuit board 1；Result in formation of the first surface of frequency-variable controller circuit board this
Side is provided with the electronic component of frequency-variable controller forceful electric power circuit, these electronic components are power device, and calorific value is larger；
This side of the second surface of frequency-variable controller circuit board is provided with the electronic component of frequency-variable controller control circuit, control circuit
For light current circuit, the electronic component calorific value in light current circuit is wanted relative to the electronic component calorific value in forceful electric power circuit
It is small.
The forceful electric power circuit and control circuit of frequency-variable controller are separately positioned on circuit board two sides for above-mentioned, realize forceful electric power
Circuit and light current circuit are separately laid out, and the electronic component of the two is isolated by circuit board, on the one hand, can avoid forceful electric power electricity
The calorific value that electronic component is larger in road influences the working performance of electronic component in control circuit, for example, if control electricity
The electronic component for the forceful electric power circuit for having a calorific value big beside chip, part caused by electronic component fever are controlled in road
Wen Sheng is likely to that the output of the control chip on side will be influenced；On the other hand, forceful electric power circuit and light current circuit are separately laid out, and two
The electronic component of person is isolated by circuit board, by the control element in the power component and control circuit in forceful electric power circuit
After separating, it may be possible to which the reliability for preferably promoting control element, being no longer influenced by the strong electromagnetic of power component influences, and becomes
It can effectively be promoted in terms of the reliability of frequency controller entirety.
Fig. 1 is the structural schematic diagram for the circuit board first surface that one embodiment provides；As shown in Figure 1, according to the first kind
The specific layout of electronic component 31, by 2 serpentine pattern of refrigerant pipe first kind electronic component 31 each electronic component
Around.
Using the endothermic character of refrigerant pipe 2, and according to the layout characteristics of Current electronic component, reasonably it is bent refrigerant
Refrigerant pipe 2 is deep into first kind electronic component 31 among each electronic component by 2 angle of pipe, absorbs each electronics member
The heat that device is sent out.It, can be according to the specific of each electronic component in first kind electronic component 31 in specific design
Calorific value, refrigerant pipe 2 can be close to the electronic component settings in first kind electronic component 31, alternatively, refrigerant pipe 2 can also
The electronic component setting being bonded in first kind electronic component 31.For example, situation as shown in Figure 1, electrolytic capacitor 31a and
Relay 31b is to be arranged close to refrigerant pipe 2, and IPM modules 31c is to be bonded setting with refrigerant pipe 2.
In a particular application, refrigerant conveying device can will be accessed outside refrigerant pipe 2, for example, compressor, is conveyed by refrigerant and filled
It sets control refrigerant to flow in refrigerant pipe 2, in the first kind 31 work once electrified of electronic component, first kind electronic component 31 is sent out
Go out higher heat, carries out heat exchange with refrigerant pipe 2, absorbed using the refrigerant in refrigerant pipe 2 and take away first kind electronic component
31 heats sent out, can efficiently solve the heat dissipation problem for the electronic component that calorific value is big on circuit board, to ensure circuit
The working performance of plate entirety.
As shown in Fig. 2, in one embodiment, the first kind electronic component 31 is arranged the of the circuit board 1
On one surface, the second table in the circuit board 1 opposite with the first surface is arranged in the second electron-like component 32
On face.
It is understood that above-described embodiment scheme, by first kind electronic component 31 and the second electron-like component 32
It is in direct contact setting with circuit board 1, under the example scheme, each electronic component 3 can form with circuit board 1 and be bonded fixation,
So that circuit board assemblies overall stability in structure and on electric property is preferable.
As shown in Fig. 2, in another embodiment, part electronic component is separate in the first kind electronic component 31
The first surface setting, and connect with the circuit board 1 by connecting line.
By above-described embodiment scheme, can solve the problems, such as follows --- in first electronic component, some fevers
If measuring prodigious electronic component is in direct contact circuit board setting, because the heat that it sends out is very big, it is sufficient to cause to contact
Circuit board section temperature rise, and then influence the working performance of the electronic component on the second face of circuit board, even
Service life.
Meanwhile in the first kind electronic component 31, by taking frequency-variable controller as an example, the first kind electronic component 31
As power device, not only calorific value is big for some electronic components, but also sufficiently bulky, these electronic components and circuit board are straight
The area that contact setting also just necessarily occupies larger circuit board can be formed by above-described embodiment scheme to circuit board
Optimization design, enough electronic components are laid out on limited area by may be implemented in extension spatially.
Above-described embodiment in a particular application, in order to realize part electronic component in the first kind electronic component 31
It is arranged far from the first surface, the mode that can be fixed by the bracket, holder 4 is set on the first surface of circuit board 1, by institute
It is sufficiently bulky to state some in first kind electronic component 31, and calorific value also prodigious electronic component, it is mounted on holder 4,
Then it is connect with the circuit board 1 by connecting line 5.
Fig. 4 is the structural schematic diagram for the circuit board that the application another embodiment provides, as shown in figure 4,1 group of the circuit board
Part further includes：
Cooling fin 6, fitting are arranged on the part electronic component 3 in the first kind electronic component 31.
It is sent out it is understood that absorbing each electronic component in the first kind electronic component 31 using refrigerant pipe 2
The heat gone out, but because the heat that each electronic component is sent out in the first kind electronic component 31 is different, for some hairs
The prodigious electronic component of heat, there is the possibility for being difficult to absorb these 3 heats of electronic component in time in refrigerant pipe 2, remaining
Heat may be still relatively large, in this regard, by above-described embodiment scheme, it can be in the prodigious electronic component of some calorific values
Further cooling fin 6 is arranged in fitting on 3, further to promote the heat dissipation effect to the prodigious electronic component of calorific value.
In a particular application, the electronic component big for some volumes, calorific value is big, can be remote by electronic component 3
It is arranged from the first surface, and is connect with the circuit board 1 by connecting line, while using 2 radiation fin of refrigerant pipe, 6 side
Refrigerant pipe 2 and cooling fin 6 are bonded electronic component setting, realize and further solve the prodigious electronics member device of calorific value by formula
The heat dissipation problem of part, and then promote the integral heat sink performance of circuit board.
In one embodiment, the circuit board 1 is pcb board, and PCB points are obverse and reverse, and baseplate material can rise
To preferable heat isolation effect, the electricity for making calorific value big can be selected according to different base site controller or electrical appliance kit design requirement
The setting of sub- component is at front or aspect, and the small element of calorific value is realized in opposite one side and carries out heat by pcb board
Isolation.
It should be pointed out that in above-mentioned specific embodiment, although carrying out embodiment by taking the circuit board of frequency-variable controller as an example
Illustrate, but the application is not limited to apply the design aspect in frequency-variable controller, can also be applied to other circuit boards Wen Sheng
In design scheme, the heat dissipation problem for the electronic component that calorific value is big on circuit board can be efficiently solved, to ensure circuit board
Whole working performance.
Fig. 5 is the structural schematic diagram for the controller that the application one embodiment provides；Fig. 6 is another embodiment of the application
The structural schematic diagram of the controller of offer；As shown in Figure 5 and Figure 6, which includes：
Circuit board assemblies and electrical appliance kit 7 as described in any one of the above embodiments, the circuit board assemblies are some or all of to be set
It sets in the electrical appliance kit 7.
In the related technology, electrical appliance kit can provide a sealing space for circuit board, realize the protection to circuit board.Its advantage
The electronic component that can be prevented from circuit board is influenced by extraneous factor, but sealing space often leads to high-power member
It after part fever, can not effectively be radiated, therefore become a contradiction point.
The above problem can effectively solve the problem that using the above embodiments of the present application scheme, as shown in figure 5, in Figure 5, the electricity
Road board group part is provided entirely in the electrical appliance kit 7, and the electrical appliance kit 7 forms the Global Macros to 1 component of the circuit board.
In concrete application, existing electrical appliance kit design may be used, it is only necessary to the outlet that refrigerant pipe 2 is reserved on electrical appliance kit, by institute
Circuit board assemblies are stated in the electrical appliance kit 7,2 both ends of refrigerant pipe of the circuit board assemblies on electrical appliance kit 7 by reserving
Outlet is pierced by so that 2 both ends of refrigerant pipe are exposed at 7 outside of the electrical appliance kit, for outer access refrigerant conveying device.It can pacify
Increase sealing ring at dress hole to act on the seal protection for further improving the electrical appliance kit 7.
By above-described embodiment scheme, when controller works, the first kind electronic component 31 hair on circuit board 1
Go out amount of heat, although amount of heat in the sealing space of electrical appliance kit 7 can not by the timely and effective heat dissipation of electrical appliance kit 7 itself,
But refrigerant is controlled by refrigerant conveying device and is flowed in refrigerant pipe 2, the first kind electronic component 31 sends out a large amount of
Heat forms heat exchange with refrigerant pipe 2, and the refrigerant flowed in refrigerant pipe 2 absorbs heat, and takes heat out of controller, realization pair
Effective heat dissipation of controller.
Compared with radiator heat-dissipation in the related technology and electrical appliance kit trepanning radiating mode, the above embodiments of the present application scheme tool
There is following advantage：
The leakproofness that can keep electrical appliance kit, so as to accomplish insect prevention, moisture-proof, Anti-corrosion design, it is not necessary to worry patch device
Part and precise control circuit are influenced by external environment；
It is laid out using refrigerant pipe 2 and is radiated in the big component ambient of calorific value, effectively reduce component temperature and electrical appliance kit
Interior temperature, and then effectively improve component reliability.
As shown in figure 5, in an example, it is described if the circuit board assemblies are provided entirely in the electrical appliance kit
The electrical appliance kit is isolated into two independent sealed spaces by circuit board.
It is understood that electronic component, which is carried out classification, is arranged in circuit board two sides, using circuit board by electrical appliance kit
Internal insulation farthest reduces by 31 place space pair the second class electricity of first kind electronic component at two independent sealed spaces
Heat exchange between refrigerant pipe 2 and air is defined in the first electron-like member device by the air conduction in 32 place space of sub- component
The high efficiency and heat radiation to controller by reducing heat exchange space come raising heat exchanging efficiency, and then is realized in 31 place space of part.
As shown in fig. 6, in figure 6, in one embodiment, the second surface shape of the electrical appliance kit 7 and the circuit board 1
At a sealing space, and the first surface of the circuit board 1 is contacted with external environment.
It is understood that the example scheme realizes that 1 components of circuit board are arranged in the electrical appliance kit 7.
The second surface of the electrical appliance kit 7 and the circuit board 1 forms a sealing space, it can be achieved that 1 second table of the circuit board
The second electron-like component 32 on face forms seal protection, and 32 calorific value of the second electron-like component is smaller, although sealing
Space, but can effectively be radiated by electrical appliance kit 7 itself.
In a particular application, the electrical appliance kit 7 of above-described embodiment scheme needs to have there are one opening, and electrical appliance kit 7 is opened by this
The second surface of mouth and the circuit board 1 cooperatively forms a sealing space.
Through the above scheme, 1 first surface of the circuit board is contacted with external environment, namely made on first surface
First kind electronic component 31 is exposed in external environment, in a particular application, for example, in forceful electric power circuit in frequency-variable controller
Electronic component, these usual components are stronger to the resistance of external environment, it is not easy to be interfered and influence, by these
Electronic component is directly exposed in external environment, is radiated by refrigerant pipe 2 and is directed out the combination of portion air environment heat dissipation,
Further promote the heat dissipation effect of first kind electronic component 31.Meanwhile also completely cutting off what first kind electronic component 31 was sent out
The influence of the second electron-like of heat pair component 32.
About the controller, the specific implementation of the circuit board assemblies carries out in above-mentioned related embodiment
Detailed description, will be not set forth in detail explanation herein.
In the application, a kind of electrical installation is also provided, including：
Controller as described in any one of the above embodiments.
It is understood that electrical installation can realize having when controller works using after above-mentioned controller scheme
Effect heat dissipation, and then can guarantee the working performance that electrical installation is stablized.
Further, the electrical installation is air-conditioning.
About the electrical installation, the specific implementation of the controller carries out in above-mentioned related embodiment
Detailed description, will be not set forth in detail explanation herein.
It is understood that same or similar part can mutually refer in the various embodiments described above, in some embodiments
Unspecified content may refer to same or analogous content in other embodiment.
It should be noted that in the description of the present application, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indicating or implying relative importance.In addition, in the description of the present application, unless otherwise indicated, the meaning of " multiple "
Refer at least two.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the application includes other realization, wherein can not press shown or discuss suitable
Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be by the application
Embodiment person of ordinary skill in the field understood.
It should be appreciated that each section of the application can be realized with hardware, software, firmware or combination thereof.Above-mentioned
In embodiment, software that multiple steps or method can in memory and by suitable instruction execution system be executed with storage
Or firmware is realized.It, and in another embodiment, can be under well known in the art for example, if realized with hardware
Any one of row technology or their combination are realized：With the logic gates for realizing logic function to data-signal
Discrete logic, with suitable combinational logic gate circuit application-specific integrated circuit, programmable gate array (PGA), scene
Programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that realize all or part of step that above-described embodiment method carries
Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium
In matter, which includes the steps that one or a combination set of embodiment of the method when being executed.
In addition, each functional unit in each embodiment of the application can be integrated in a processing module, it can also
That each unit physically exists alone, can also two or more units be integrated in a module.Above-mentioned integrated mould
The form that hardware had both may be used in block is realized, can also be realized in the form of software function module.The integrated module is such as
Fruit is realized in the form of software function module and when sold or used as an independent product, can also be stored in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the application.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiments or example in can be combined in any suitable manner.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (12)
1. a kind of circuit board assemblies, which is characterized in that including：
Circuit board, including the first surface and second surface that are oppositely arranged；
Refrigerant pipe is arranged in the first surface side of the circuit board；
Electronic component, including first kind electronic component and the second electron-like component, the first kind electronic component
Calorific value is more than the calorific value of the second electron-like component；
The first kind electronic component is arranged in the first surface side of the circuit board, the second electron-like member device
Part is arranged in the second surface side of the circuit board；
Each electronic component of the first kind electronic component respectively close to or the fitting refrigerant pipe be arranged.
2. circuit board assemblies according to claim 1, which is characterized in that
The first kind electronic component is arranged on the first surface of the circuit board, the second electron-like component setting
On the second surface of the circuit board opposite with the first surface.
3. circuit board assemblies according to claim 1, which is characterized in that
Part electronic component is arranged far from the first surface in the first kind electronic component, and passes through connecting line and institute
State circuit board connection.
4. according to claim 1-3 any one of them circuit board assemblies, which is characterized in that further include：
Cooling fin, fitting are arranged on the part electronic component in the first kind electronic component.
5. circuit board assemblies according to claim 1, which is characterized in that when the circuit board assemblies are applied in frequency control
When device, the first kind electronic component includes at least one in following item：
Electrolytic capacitor, relay, inductance and IPM modules.
6. circuit board assemblies according to claim 5, which is characterized in that when the circuit board assemblies are applied in frequency control
When device, the second electron-like component includes at least one in following item：
Patch capacitor, Chip-R, control chip, sampling A/D chip and filtering device.
7. according to claim 1-3,5-6 any one of them circuit board assemblies, which is characterized in that the circuit board is pcb board.
8. a kind of controller, which is characterized in that including：Such as claim 1-7 any one of them circuit board assemblies and electric appliance
Box, the circuit board assemblies are some or all of to be arranged in the electrical appliance kit.
9. controller according to claim 8, which is characterized in that if the circuit board assemblies are provided entirely in the electricity
In device box, the electrical appliance kit is isolated into two independent sealed spaces by the circuit board.
10. controller according to claim 8, which is characterized in that the second surface of the electrical appliance kit and the circuit board
A sealing space is formed, and the first surface of the circuit board is contacted with external environment.
11. a kind of electrical installation, which is characterized in that including：Such as claim 8-10 any one of them controllers.
12. electrical installation according to claim 11, which is characterized in that the electrical installation is air-conditioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810797768.4A CN108650789A (en) | 2018-07-19 | 2018-07-19 | Circuit board assembly, controller and electrical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810797768.4A CN108650789A (en) | 2018-07-19 | 2018-07-19 | Circuit board assembly, controller and electrical device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108650789A true CN108650789A (en) | 2018-10-12 |
Family
ID=63759828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810797768.4A Pending CN108650789A (en) | 2018-07-19 | 2018-07-19 | Circuit board assembly, controller and electrical device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108650789A (en) |
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| CN109357329A (en) * | 2018-10-31 | 2019-02-19 | 珠海格力电器股份有限公司 | Heat radiation structure and air conditioner |
| CN109855229A (en) * | 2019-03-01 | 2019-06-07 | 珠海格力电器股份有限公司 | Oil return control method for segmented oil return and multi-split system |
| CN111200358A (en) * | 2018-11-19 | 2020-05-26 | 广东美的白色家电技术创新中心有限公司 | System for restraining electromagnetic interference of refrigerant radiator and household appliance |
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