CN100345289C - Hot-piping radiator - Google Patents
Hot-piping radiator Download PDFInfo
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- CN100345289C CN100345289C CNB2004100325404A CN200410032540A CN100345289C CN 100345289 C CN100345289 C CN 100345289C CN B2004100325404 A CNB2004100325404 A CN B2004100325404A CN 200410032540 A CN200410032540 A CN 200410032540A CN 100345289 C CN100345289 C CN 100345289C
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Abstract
The present invention discloses a heat pipe radiator which comprises an L-shaped heat pipe, radiation fins and a bottom plate, wherein one end of the L-shaped heat pipe is coupled in a heat pipe fixing groove of the bottom plate for increasing the heat conduction area, so the radiation efficiency of the heat pipe radiator is improved; the radiation fins also comprise upper layer radiation fins and lower layer radiation fins which are respectively coupled with the L-shaped heat pipe through circular holes and slotted holes. Thus, the volume of the heat pipe radiator can be effectively reduced for saving the required occupation space.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of radiator with L type heat pipe.
Background technology
Along with the high development of Information technology, the application of computer industry is day by day popularized.Because computer equipment has the power of handling a large amount of digital informations, and is subjected to liking and extensive use of society.Because the improvement of the technology of integrated circuit, and the requirement of integrate circuit function specification raise day by day, the design of integrated circuit now has been that exquisiteness very is with complicated.
With central processing unit (Central Processing Unit; CPU) be example.Because user and various application software all have powerful demand to it at present, therefore cause its circuit layout to seem complicated many more in early days.Though the integrated circuit (IC) chip of these central processing units provides many strong functions, yet some new problems have also been produced.For example, problem is the consumption of the very big electric energy that complex circuit design causes, and the electric energy of these consumption will cause the rising of chip temperature, and forms the serious problem of the next item up of using.Generally speaking, can bring into play maximum usefulness in order to make computer, it is very important that heat removes fast, because inner and can't dissipate immediately the time at computer when heat accumulation, will make the electronic component can't operate as normal, even make whole computer system deadlock.
Traditional computer radiator when the central processing unit of handle high power, generally speaking, can adopt the radiator that directly is installed on the central processing unit, and its fan directly blows to the radiating fin of central processing unit top, and heat is discharged computer inside.In order effectively the heat that central processing unit produced to be discharged computer inside, adopt the heats that guide central processing unit in the mode of heat pipe and radiating fin at present more, the air-flow by fan removes heat again.
Yet along with the heat that central processing unit produced is more and more higher, the required volume of radiator is also just increasing, removes the ability of heat with raising.How can further improve sink-efficiency, especially can improve the radiating efficiency of heat pipe and radiating fin more further, by computer producer and user are paid close attention to.
Summary of the invention
In view of in above-mentioned background of invention, traditional computer radiator, because the heat that central processing unit produces raising, thereby must do the volume of radiator more big.How can improve the radiating efficiency of radiator further,, not only can make the work of computer more stable, and can reduce the required volume that takies of radiator effectively to reduce the working temperature of central processing unit.
One of purpose of the present invention is to utilize L type heat pipe, to improve the radiating efficiency of radiator, reduces the temperature on central processing unit surface effectively.
Another purpose of the present invention is to utilize L type heat pipe to improve the radiating efficiency of radiator, reduces the volume of radiator effectively.
The object of the present invention is achieved like this, and a kind of heat-pipe type radiator promptly is provided, and comprises at least: a base plate; One L type heat pipe comprises a mutually perpendicular bar portion and a bottom, and a L type bent angle, and wherein said bottom is coupled on the described base plate; And a plurality of radiating fins, be coupled on the described L type heat pipe, described radiating fin comprises at least one lower layer heat sink, described lower layer heat sink has at least one slotted hole, so that make the described L type bent angle of described at least one L type heat pipe pass described lower layer heat sink, wherein said bottom absorbs the heat that comes from a thermal source, is sent to described a plurality of radiating fin via described L type heat pipe, so that described heat is removed.
Also a kind of heat-pipe type radiator of the present invention comprises at least: a base plate has at least one heat pipe holddown groove on the described base plate; A plurality of radiating fins are arranged on the described base plate in the mode that is arranged in parallel with described base plate, and described radiating fin comprises at least one lower layer heat sink, and described lower layer heat sink has a slotted hole; An and L type heat pipe, be coupled on the described base plate in the mode of passing described a plurality of radiating fins, wherein said L type heat pipe comprises a L type bent angle and a mutually perpendicular bar portion and a bottom, the L type bent angle of described L type heat pipe passes the slotted hole of described lower layer heat sink, and the described heat pipe holddown groove coupling of described bottom and described base plate, described heat pipe holddown groove increases the heat transfer area between described L type heat pipe and the described base plate effectively, and then improves the radiating efficiency of described heat-pipe type radiator; Wherein said base plate absorbs the heat that comes from a thermal source, is sent to described a plurality of radiating fin via described L type heat pipe, so that described heat is removed.
The present invention also provides a kind of heat-pipe type radiator, is used to remove the heat that a thermal source is produced, and described heat-pipe type radiator comprises at least: a base plate, be coupled on the described thermal source, and comprise a plurality of heat pipe holddown grooves on the wherein said base plate; A plurality of L type heat pipes are coupled on described a plurality of heat pipe holddown grooves of described base plate, and wherein said a plurality of heat pipe holddown grooves increase the heat transfer area between described a plurality of L type heat pipe and the described base plate effectively, and then improve the radiating efficiency of described heat-pipe type radiator; And a plurality of radiating fins, be coupled on described a plurality of L type heat pipe and parallel with described base plate, described radiating fin comprises at least one lower layer heat sink, and described lower layer heat sink has at least one slotted hole, so that make described at least one L type heat pipe pass described lower layer heat sink; Wherein said base plate absorbs the described heat that comes from described thermal source, is sent to described a plurality of radiating fin via described a plurality of L type heat pipes, to remove described heat.
According to the above purpose, the invention provides a kind of heat-pipe type radiator, be used for removing the heat that a thermal source is produced, the heat that particularly is suitable for being used for integrated circuit removes, and for example is the heat radiation that is used for the central processing unit of computer.This heat-pipe type radiator comprises a base plate, at least one L type heat pipe, and a plurality of radiating fin.Wherein L type heat pipe is coupled in the heat pipe holddown groove of base plate, with the increase heat transfer area, and then the radiating efficiency of raising heat-pipe type radiator.The above-mentioned heat that thermal source produced then absorbs via base plate, is sent to radiating fin via L type heat pipe again, then these heats is got rid of.
Radiating fin also comprises upper layer heat sink and lower layer heat sink, and wherein upper layer heat sink has circular hole, so that L type heat pipe is passed wherein, lower layer heat sink then has slotted hole, so that the bent angle of L type heat pipe is partly passed wherein.This slotted hole can be rectangle slotted hole or slotted hole, all can be coupled with L type heat pipe easily.
Wherein above-mentioned L type heat pipe, base plate and radiating fin all are that the material by high heat-conduction coefficient is constituted, for example metal materials such as copper metal or aluminum metal.
Because L type heat pipe and base plate have increased the area that heat pipe contacts with base plate effectively, make from thermal source to absorb the heat of coming, can be sent to radiating fin via L type heat pipe easily, to get rid of.Therefore, heat-pipe type radiator of the present invention can improve radiating efficiency effectively, and reduces the volume of radiator effectively, to save required occupation space.
Description of drawings
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, especially exemplified by preferred embodiment, and cooperate the following drawings to do to be described in more detail, wherein:
Fig. 1 is the schematic perspective view of L type heat-pipe radiator of the present invention;
Fig. 2 A is the front elevational schematic of the upper layer heat sink of L type heat-pipe radiator of the present invention;
Fig. 2 B is the front elevational schematic of the lower layer heat sink of L type heat-pipe radiator of the present invention; And
Fig. 2 C is the front elevational schematic of the base plate of L type heat-pipe radiator of the present invention.
Description of reference numerals:
100 radiators, 102 central processing units
110 base plates, 120 L type heat pipes
122 bar portions, 124 bottoms
126 L type bent angle portions
130 radiating fins, 140 fans
210 base plates, 212 heat pipe holddown grooves
230 upper layer heat sink, 232 sheet metals
234 circular holes, 240 lower layer heat sink
242 sheet metals, 244 slotted holes
Embodiment
The present invention has improved the radiating efficiency of radiator effectively, and the temperature of central processing unit can be reduced effectively, and reduces the volume of radiator.Below will and describe in detail spirit of the present invention clearly will be described with accompanying drawing, the person skilled in the art after understanding the preferred embodiments of the present invention, when can be by the technology that the present invention instructed, change and modification, it does not break away from spirit of the present invention and scope.
Fig. 1 is the schematic perspective view of L type heat-pipe radiator of the present invention.As shown in FIG., radiator 100 comprises base plate 110, and L type heat pipe 120 and radiating fin 130 are installed on the base plate 110.Wherein the below of base plate 110 and central processing unit 102 or any thermal source are coupled, and absorbing the heat that it is produced, and this heat are sent to radiating fin 130 with base plate 110 parallel installations by L type heat pipe 120.The air-flow that is produced by the fan 140 that is installed on radiator 100 sides removes this heat again.
Simultaneously because L type heat pipe 120 can absorb the heats that come from base plate 110 more, therefore, compare with the heat pipe of the radiator of prior art, L type heat pipe 120 can transmit enough heats to radiating fin 130, so radiator 100 can be is significantly had higher radiating efficiency than the radiator of prior art, takies less spatial volume simultaneously.
Fig. 2 A is the tangent front elevational schematic of the bar portion 122 of the upper layer heat sink of L type heat-pipe radiator of the present invention and L type heat pipe 120, and Fig. 2 B is the front elevational schematic of lower layer heat sink, and Fig. 2 C is the front elevational schematic of base plate.As shown in FIG.,, make heat pipe fully guide heat to radiating fin, via radiating fin heat is got rid of again for giving full play to the heat-sinking capability of radiator of the present invention.The radiating fin that is installed on heat pipe (referring to the L type heat pipe 120 of Fig. 1) top adopts as the upper layer heat sink among Fig. 2 A 230, and be installed on radiating fin below the heat pipe for cooperating the moulding tangent with the L type bent angle 126 of heat pipe, then adopt as the lower layer heat sink among Fig. 2 B 240.Wherein upper layer heat sink 230 is made of the high heat-conduction coefficient material, preferably adopts a sheet metal 232 to constitute, and for example aluminum metal film or copper sheet metal etc. then have circular hole 234, so that make heat pipe by wherein passing on it.Then utilize welding between heat pipe and the upper layer heat sink 230, or the mode of adhesion is with fixedly heat pipe and upper layer heat sink 230, and can improves capacity of heat transmission between the two.And circular hole 234 is for cooperating the appearance and modeling made of heat pipe, it does not limit only for circular, as heat pipe is the moulding of square, oval or other shapes, and then upper layer heat sink 230 also can cooperate the hole with the moulding that forms corresponding square, oval or other shapes.
Therefore, for cooperating the L type bent angle of heat pipe below, radiating fin is adopting lower layer heat sink 240 and heat pipe coupling near the position of L type bent angle.Lower layer heat sink 240 is made of the material with upper layer heat sink 230 similar high heat-conduction coefficients, preferably adopt a sheet metal 242 to constitute, for example aluminum metal film or copper sheet metal etc. then have slotted hole 244, so that make heat pipe by wherein passing on it.Wherein slotted hole 244 can be the slotted hole of a square type slotted hole, slotted hole or other moulding, so that the moulding of heat pipe L type bent angle is passed.Then also can utilize welding between heat pipe and the lower layer heat sink 240, or the mode of adhesion is with fixedly heat pipe and lower layer heat sink 240, and can improves capacity of heat transmission between the two.
210 of base plates among Fig. 2 C make L type heat pipe fix effectively, and provide absorption thermal source heat to be sent to the function of heat pipe.Base plate 210 is that the material by high heat-conduction coefficient is constituted, for example aluminum metal or copper metal etc.Also be formed with the heat pipe bottom 124 of heat pipe holddown groove 212 on the base plate 210 with the absorption heat of effective fixed L type heat pipe.Because L type heat pipe has the heat pipe bottom 124 in the laterally parallel heat pipe holddown groove 212 that is installed on base plate 210, the heat transfer area that it can increase between the two makes heat pipe by absorbing more heat in the base plate 210 and being sent to the radiating fin of coupling with it.Therefore, the radiating efficiency of radiator of the present invention can be enhanced effectively, each radiating fin also can provide the ability of eliminating heat simultaneously more uniformly, even if also can transmit owing to the heat of high efficiency heat pipe at the radiating fin of heat pipe end, and effectively brings into play the function of eliminating heat.So the outward appearance volume of radiator of the present invention is effective Be Controlled also, and bigger heat-sinking capability is provided.
As the person skilled in the art understood, the above only was the preferred embodiments of the present invention, was not in order to limit protection scope of the present invention.All other changes or modifies not breaking away from the equivalence finished under the disclosed spirit, all should be included among the appending claims.
Claims (17)
1. heat-pipe type radiator comprises at least:
One base plate;
One L type heat pipe comprises a mutually perpendicular bar portion and a bottom, and a L type bent angle, and wherein said bottom is coupled on the described base plate; And
A plurality of radiating fins are coupled on the described L type heat pipe, and described radiating fin comprises at least one lower layer heat sink, and described lower layer heat sink has at least one slotted hole, so that make the described L type bent angle of described at least one L type heat pipe pass described lower layer heat sink,
Wherein said bottom absorbs the heat that comes from a thermal source, is sent to described a plurality of radiating fin via described L type heat pipe, so that described heat is removed.
2. heat-pipe type radiator as claimed in claim 1, wherein said base plate also comprise at least one heat pipe holddown groove, to be used for the described bottom coupling of described L type heat pipe and to increase heat transfer area, to improve the radiating efficiency of described heat-pipe type radiator.
3. heat-pipe type radiator as claimed in claim 1, wherein said radiating fin also comprises at least one upper layer heat sink.
4. heat-pipe type radiator as claimed in claim 3, wherein said upper layer heat sink has at least one circular hole, so that make the described bar portion of described L type heat pipe pass described upper layer heat sink.
5. heat-pipe type radiator as claimed in claim 1, wherein said slotted hole comprise a rectangle slotted hole.
6. heat-pipe type radiator as claimed in claim 1, wherein said slotted hole comprises a slotted hole.
7. heat-pipe type radiator as claimed in claim 1, wherein said L type heat pipe are that the metal material by high heat-conduction coefficient is constituted.
8. heat-pipe type radiator comprises at least:
One base plate has at least one heat pipe holddown groove on the described base plate;
A plurality of radiating fins are arranged on the described base plate in the mode that is arranged in parallel with described base plate, and described radiating fin comprises at least one lower layer heat sink, and described lower layer heat sink has a slotted hole; And
One L type heat pipe, be coupled on the described base plate in the mode of passing described a plurality of radiating fins, wherein said L type heat pipe comprises a L type bent angle and a mutually perpendicular bar portion and a bottom, the L type bent angle of described L type heat pipe passes the slotted hole of described lower layer heat sink, and the described heat pipe holddown groove coupling of described bottom and described base plate, described heat pipe holddown groove increases the heat transfer area between described L type heat pipe and the described base plate effectively, and then improves the radiating efficiency of described heat-pipe type radiator;
Wherein said base plate absorbs the heat that comes from a thermal source, is sent to described a plurality of radiating fin via described L type heat pipe, so that described heat is removed.
9. heat-pipe type radiator as claimed in claim 8, wherein said radiating fin also comprises at least one upper layer heat sink.
10. heat-pipe type radiator as claimed in claim 9, wherein said upper layer heat sink has at least one circular hole, so that make the described bar portion of described at least one L type heat pipe pass described upper layer heat sink.
11. heat-pipe type radiator as claimed in claim 8, wherein said slotted hole comprise a rectangle slotted hole.
12. a heat-pipe type radiator is used to remove the heat that a thermal source is produced, described heat-pipe type radiator comprises at least:
One base plate is coupled on the described thermal source, comprises a plurality of heat pipe holddown grooves on the wherein said base plate;
A plurality of L type heat pipes are coupled on described a plurality of heat pipe holddown grooves of described base plate, and wherein said a plurality of heat pipe holddown grooves increase the heat transfer area between described a plurality of L type heat pipe and the described base plate effectively, and then improve the radiating efficiency of described heat-pipe type radiator; And
A plurality of radiating fins, be coupled on described a plurality of L type heat pipe and parallel with described base plate, described radiating fin comprises at least one lower layer heat sink, and described lower layer heat sink has at least one slotted hole, so that make described at least one L type heat pipe pass described lower layer heat sink;
Wherein said base plate absorbs the described heat that comes from described thermal source, is sent to described a plurality of radiating fin via described a plurality of L type heat pipes, to remove described heat.
13. heat-pipe type radiator as claimed in claim 12, wherein said radiating fin also comprises at least one upper layer heat sink.
14. heat-pipe type radiator as claimed in claim 13, wherein said upper layer heat sink has at least one circular hole, so that make described at least one L type heat pipe pass described upper layer heat sink.
15. heat-pipe type radiator as claimed in claim 12, wherein said slotted hole comprise a rectangle slotted hole.
16. heat-pipe type radiator as claimed in claim 12, wherein said slotted hole comprises a slotted hole.
17. heat-pipe type radiator as claimed in claim 12, wherein said L type heat pipe, described base plate, with described a plurality of radiating fins, be that the material by high heat-conduction coefficient is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100325404A CN100345289C (en) | 2004-04-08 | 2004-04-08 | Hot-piping radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100325404A CN100345289C (en) | 2004-04-08 | 2004-04-08 | Hot-piping radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1681112A CN1681112A (en) | 2005-10-12 |
| CN100345289C true CN100345289C (en) | 2007-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100325404A Expired - Fee Related CN100345289C (en) | 2004-04-08 | 2004-04-08 | Hot-piping radiator |
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| CN (1) | CN100345289C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2374299T3 (en) * | 2006-09-29 | 2012-02-15 | Osram Ag | HEAT SINK AND LIGHTING SYSTEM WITH A HEAT SINK. |
| CN101754645B (en) * | 2008-12-10 | 2013-06-26 | 深圳市超频三科技有限公司 | Heat pipe type heat radiator and manufacturing method thereof |
| CN102331832A (en) * | 2011-09-06 | 2012-01-25 | 宁波菲仕电机技术有限公司 | Forced air-cooled heat pipe radiating system for servo driver |
| CN102679778A (en) * | 2012-05-10 | 2012-09-19 | 上海威特力热管散热器有限公司 | Long and short pipe combined heat pipe radiator |
| CN105005367A (en) * | 2015-07-14 | 2015-10-28 | 广东欧珀移动通信有限公司 | Mainboard heat dissipation structure and mobile terminal |
| CN105758237A (en) * | 2016-04-07 | 2016-07-13 | 同度能源科技（江苏）股份有限公司 | Heat radiator with longitudinal and transverse heat tubes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2342407Y (en) * | 1998-04-06 | 1999-10-06 | 鼎沛股份有限公司 | Radiator for central processor |
| CN2514401Y (en) * | 2001-11-26 | 2002-10-02 | 宗敏 | Radiating device for computer |
| CN2515801Y (en) * | 2001-12-28 | 2002-10-09 | 王培清 | Dry passive environmental protection heat-conducitng pipe radiator |
| US20040052051A1 (en) * | 2002-09-17 | 2004-03-18 | Malone Christopher G. | Heat sink with heat pipe and base fins |
-
2004
- 2004-04-08 CN CNB2004100325404A patent/CN100345289C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2342407Y (en) * | 1998-04-06 | 1999-10-06 | 鼎沛股份有限公司 | Radiator for central processor |
| CN2514401Y (en) * | 2001-11-26 | 2002-10-02 | 宗敏 | Radiating device for computer |
| CN2515801Y (en) * | 2001-12-28 | 2002-10-09 | 王培清 | Dry passive environmental protection heat-conducitng pipe radiator |
| US20040052051A1 (en) * | 2002-09-17 | 2004-03-18 | Malone Christopher G. | Heat sink with heat pipe and base fins |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1681112A (en) | 2005-10-12 |
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