CN221010545U

CN221010545U - Aluminum-based PCB

Info

Publication number: CN221010545U
Application number: CN202322811974.5U
Authority: CN
Inventors: 许胜文; 何文波; 黄甘光
Original assignee: Shenzhen Changyingda Yingdong Electronics Co ltd
Current assignee: Shenzhen Changyingda Yingdong Electronics Co ltd
Priority date: 2023-10-19
Filing date: 2023-10-19
Publication date: 2024-05-24
Anticipated expiration: 2033-10-19

Abstract

The application provides an aluminum-based PCB which comprises a mounting plate, wherein a PCB body is arranged on the upper side of the mounting plate, an assembly mechanism is arranged between the mounting plate and the PCB body, and a fixing mechanism is arranged in the assembly mechanism. According to the application, through the use of the assembly mechanism and the fixing mechanism, the PCB body is placed in the groove, the mounting hole on the surface is clamped with the fixing cylinder on the surface of the groove, so that the assembly is conveniently completed, and as the surface of one side of the stop block protruding from the surface of the fixing cylinder is obliquely arranged, when the PCB body moves downwards, the stop block is conveniently extruded, so that the stop block moves towards the inside of the fixing cylinder, the first spring deforms, and after the PCB body is clamped in the groove, the PCB body is positioned at the lower side of the stop block, the first spring ejects the stop block through the self elasticity, so that the stop block blocks the PCB body, the PCB body is conveniently fixed, the condition that screw connection is loose is avoided, and the practicability is improved.

Description

Aluminum-based PCB

Technical Field

The utility model relates to the related field of PCB boards, in particular to an aluminum-based PCB board.

Background

The PCB board, namely a printed circuit board, is also called a printed circuit board, is a provider for electric connection of electronic components, has been developed for many years, and the design is mainly a layout design; the main advantage of using circuit boards is that the errors in wiring and assembly are greatly reduced, and before the appearance of printed circuit boards, the interconnections between electronic components are directly connected by wires to form complete circuits, and in the present generation, circuit boards exist only as effective experimental tools, and the printed circuit boards have become an absolute dominant place in the electronic industry.

The aluminum-based PCB is fixed through screws when being installed, is easy to loosen after long-time use, is complex when being installed, is inconvenient to disassemble and assemble, affects personnel to maintain, and the more wiring on the PCB is, the larger the heat possibly generated is, the worse the heat resistance of the existing aluminum-based PCB is, the corresponding work in a long-term high-temperature environment, the service life of the PCB can be affected to a certain extent, so that improvement is made by the aluminum-based PCB.

Disclosure of utility model

The utility model aims at: the problem that the aluminum-based PCB is easy to loosen after long-time use, is complex during installation of the aluminum-based PCB, is inconvenient to disassemble and assemble, influences personnel to maintain, and the larger the wiring on the PCB is, the larger the heat possibly generated is, the worse the heat resistance of the existing aluminum-based PCB is, the corresponding problem that the service life of the PCB is affected to a certain extent when the aluminum-based PCB works in a long-term high-temperature environment is solved.

In order to achieve the above object, the present utility model provides the following technical solutions:

aluminum-based PCB board to improve the above problems.

The application is specifically as follows:

Including the mounting panel, the upside of mounting panel is provided with the PCB board body, and is provided with equipment mechanism between mounting panel and the PCB board body, and the inside of equipment mechanism is provided with fixed establishment, the inside cooling mechanism that is provided with of mounting panel, the PCB board body includes the aluminium base board layer, and the surface bonding of aluminium base board layer is connected with the circuit board layer to the surface of circuit board layer evenly scribbles the green paint surface course, the downside fixedly connected with heat-resisting layer of aluminium base board layer, and the downside bonding connection of heat-resisting layer has the heat-conducting layer.

As the preferable technical scheme of the application, the assembly mechanism comprises a groove, the groove is formed on the surface of the mounting plate, the connection mode of the PCB body and the groove is a clamping connection, a clamping structure is formed between the PCB body and the mounting plate, a fixed cylinder is fixedly arranged in the groove, the surface of the PCB body is provided with a mounting hole, and the connection mode of the fixed cylinder and the mounting hole is a clamping connection.

As a preferable technical scheme of the application, the fixing mechanism comprises a first fixing plate and a second fixing plate, wherein the first fixing plate and the second fixing plate are fixedly arranged in the fixing cylinder, a stop block is connected between the first fixing plate and the second fixing plate in a sliding manner, a first spring is fixedly arranged between the stop block and the inner wall of the fixing cylinder, and the surface of one side of the fixing cylinder is obliquely arranged.

According to the preferred technical scheme, the sliding plate is connected inside the fixed cylinder in a sliding mode, the fixed block is fixedly arranged on the surface of the sliding plate, the second spring is fixedly arranged between the surface of the sliding plate and the second fixed plate, the pressing block is fixedly arranged on the upper surface of the sliding plate, and the pressing block is connected with the fixed cylinder in a sliding mode.

According to the preferred technical scheme, the limiting holes are formed in the surface of the second fixing plate, the fixing blocks are connected in a sliding mode in the limiting holes, the surface of one side of each fixing block is obliquely arranged, the inclined grooves are formed in the surface of each stop block, and the inclined surfaces of the fixing blocks are attached to the inclined surfaces of the inclined grooves.

As a preferable technical scheme of the application, the cooling mechanism comprises a mounting groove, the mounting groove is formed on the surface of the groove, a heat conducting plate is fixedly arranged in the mounting groove, and heat radiating fins are fixedly arranged on the surface of the heat conducting plate.

According to the preferred technical scheme, the heat-resistant layer comprises a high-temperature-resistant mica layer and a graphite layer, the high-temperature-resistant mica layer and the graphite layer are fixedly connected, the high-temperature-resistant mica layer is a high-temperature-resistant mica pad, and the graphite layer is a graphite plate.

As a preferable technical scheme of the application, the heat conduction layer comprises a carbon fiber layer and a heat conduction silica gel layer, the carbon fiber layer and the heat conduction silica gel layer are connected in an adhesive mode, the carbon fiber layer is a carbon fiber plate, and the heat conduction silica gel layer is heat conduction silica gel.

Compared with the prior art, the utility model has the beneficial effects that:

in the scheme of the application:

1. through the use of equipment mechanism and fixed establishment, place the PCB board body in the recess, make the mounting hole on surface and the fixed cylinder looks block of recess surface, conveniently accomplish the equipment, because the surface of fixed cylinder surface outstanding dog one side is the slope setting, conveniently when the PCB board body downstream, extrude the dog, make the dog remove to fixed cylinder inside, and make first spring take place deformation, after the recess is advanced to the PCB board body card, the PCB board body is in the downside of dog, first spring can be ejecting the dog through self elasticity, make the dog block the PCB board body, the convenience is fixed the PCB board body, avoid appearing screwed connection and appear not hard up condition, promote its practicality.

2. Through setting up heat-resisting layer and heat conduction layer, the heat-resisting layer comprises high temperature resistant mica layer and graphite layer, high temperature resistant mica layer is high temperature resistant mica pad, graphite layer is the graphite board, high temperature resistant mica pad and graphite board all possess good high temperature resistance, can promote the high temperature resistance of PCB board body by a wide margin, the heat conduction layer comprises carbon fiber layer and heat conduction silica gel layer, carbon fiber layer is carbon fiber board, and the heat conduction silica gel layer is heat conduction silica gel, carbon fiber board and heat conduction silica gel all have good heat conduction effect, the heat that conveniently produces the PCB board is derived, indirectly promote the high temperature resistance of aluminium base sheet layer and circuit board layer, promote its practicality.

Description of the drawings:

fig. 1 is a schematic structural diagram of an aluminum-based PCB board provided by the present application;

fig. 2 is a schematic cross-sectional structure of an aluminum-based PCB board according to the present application;

Fig. 3 is an enlarged schematic structural view of a portion a in fig. 2 of an aluminum-based PCB board provided by the present application;

fig. 4 is a schematic perspective view of the inside of the aluminum-based PCB board fixing cylinder provided by the application;

Fig. 5 is a schematic structural diagram of a heat conducting plate and heat dissipating fins of an aluminum-based PCB board provided by the present application;

fig. 6 is a schematic structural diagram of a cross section of an aluminum-based PCB board provided by the present application;

Fig. 7 is a schematic cross-sectional structure of a heat-resistant layer and a heat-conducting layer of an aluminum-based PCB board provided by the application.

The figures indicate:

1. A mounting plate; 2. a PCB body; 201. an aluminum substrate layer; 202. a wiring board layer; 203. a green paint surface layer; 204. a heat-resistant layer; 2041. a high temperature resistant mica layer; 2042. a graphite layer; 205. a heat conducting layer; 2051. a carbon fiber layer; 2052. a thermally conductive silicone layer; 3. an assembly mechanism; 301. a groove; 302. a fixed cylinder; 303. a mounting hole; 4. a fixing mechanism; 401. a first fixing plate; 402. a second fixing plate;

403. A stop block; 404. a first spring; 405. an inclined groove; 406. a limiting hole; 407. a fixed block;

408. A sliding plate; 409. pressing blocks; 410. a second spring; 5. a cooling mechanism; 501. a mounting groove; 502. a heat conductive plate; 503. and the heat dissipation fins.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described examples are some, but not all, embodiments of the utility model.

Thus, the following detailed description of the embodiments of the utility model is not intended to limit the scope of the utility model, as claimed, but is merely representative of some embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, the terms "upper", "lower", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or a positional relationship conventionally put in use of the inventive product, or an azimuth or a positional relationship conventionally understood by those skilled in the art, such terms are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

As shown in fig. 7, this embodiment provides an aluminum-based PCB board, including mounting panel 1, the upside of mounting panel 1 is provided with PCB board body 2, and be provided with equipment mechanism 3 between mounting panel 1 and the PCB board body 2, and the inside of equipment mechanism 3 is provided with fixed establishment 4, the inside cooling mechanism 5 that is provided with of mounting panel 1, PCB board body 2 includes aluminum-based board layer 201, and the surface bonding of aluminum-based board layer 201 is connected with circuit board layer 202, and the surface of circuit board layer 202 evenly scribbles green paint surface layer 203, the downside fixedly connected with heat-resisting layer 204 of aluminum-based board layer 201, and the downside bonding of heat-resisting layer 204 is connected with heat-conducting layer 205.

As a preferred embodiment, on the basis of the above mode, the assembly mechanism 3 further includes a groove 301, the groove 301 is formed on the surface of the mounting plate 1, the connection mode between the PCB body 2 and the groove 301 is a clamping connection, a clamping structure is formed between the PCB body 2 and the mounting plate 1, a fixing cylinder 302 is fixedly mounted in the groove 301, the surface of the PCB body 2 is opened and closed with a mounting hole 303, and the connection mode between the fixing cylinder 302 and the mounting hole 303 is a clamping connection, so that the PCB body 2 is convenient to mount.

As a preferred embodiment, on the basis of the above mode, the fixing mechanism 4 further includes a first fixing plate 401 and a second fixing plate 402, the first fixing plate 401 and the second fixing plate 402 are fixedly installed inside the fixing cylinder 302, a stop block 403 is slidably connected between the first fixing plate 401 and the second fixing plate 402, a first spring 404 is fixedly installed between the stop block 403 and the inner wall of the fixing cylinder 302, and the surface on one side of the fixing cylinder 302 is inclined, so that the stop block 403 conveniently supports the stop block 403 through the elastic force of the first spring 404, so that the PCB board body 2 is blocked by the stop block 403, and the PCB board body 2 is fixed.

As a preferred embodiment, based on the above manner, further, the inside of the fixed cylinder 302 is slidably connected with the sliding plate 408, the surface of the sliding plate 408 is fixedly provided with the fixed block 407, the second spring 410 is fixedly provided between the surface of the sliding plate 408 and the second fixed plate 402, the upper surface of the sliding plate 408 is fixedly provided with the pressing block 409, the pressing block 409 is slidably connected with the fixed cylinder 302, and the sliding plate 408 and the fixed block 407 on the surface are conveniently driven to move downwards by pressing the pressing block 409, and can be propped against the sliding plate 408 by the elastic force of the second spring 410.

As a preferred embodiment, on the basis of the above manner, further, the surface of the second fixing plate 402 is provided with the limiting hole 406, the fixing block 407 is slidably connected in the limiting hole 406, the surface of one side of the fixing block 407 is obliquely arranged, the surface of the stop block 403 is provided with the inclined groove 405, and the inclined surface of the fixing block 407 is attached to the inclined surface of the inclined groove 405, so that the stop block 403 is conveniently driven to move towards the inside of the fixing cylinder 302 when the fixing block 407 moves downwards.

As a preferred embodiment, on the basis of the above manner, the cooling mechanism 5 further includes a mounting groove 501, the mounting groove 501 is formed on the surface of the groove 301, the heat conducting plate 502 is fixedly mounted in the mounting groove 501, and the heat radiating fins 503 are fixedly mounted on the surface of the heat conducting plate 502, so that heat of the PCB board body 2 is conveniently conducted through the heat conducting plate 502, the contact area between the heat conducting plate 502 and air is conveniently increased by the heat radiating fins 503, and the heat radiating efficiency is improved.

As a preferred embodiment, based on the above manner, the heat-resistant layer 204 further includes a high temperature-resistant mica layer 2041 and a graphite layer 2042, the high temperature-resistant mica layer 2041 and the graphite layer 2042 are fixedly connected, the high temperature-resistant mica layer 2041 is a high temperature-resistant mica pad, the graphite layer 2042 is a graphite plate, the high temperature-resistant mica pad and the graphite plate have good high temperature resistance, and the high temperature resistance of the PCB body 2 can be greatly improved.

As a preferred embodiment, on the basis of the above manner, further, the heat conducting layer 205 includes the carbon fiber layer 2051 and the heat conducting silica gel layer 2052, and the bonding connection between the carbon fiber layer 2051 and the heat conducting silica gel layer 2052, the carbon fiber layer 2051 is a carbon fiber plate, and the heat conducting silica gel layer 2052 is a heat conducting silica gel, both the carbon fiber plate and the heat conducting silica gel have good heat conducting effect, so that the heat generated by the PCB is conveniently led out, the high temperature resistance of the aluminum substrate layer 201 and the circuit board layer 202 is indirectly improved, and the service life of the PCB is prolonged.

Specifically, the working principle of this scheme is: when the PCB body 2 is required to be installed, the PCB body 2 is placed into the groove 301 on the surface of the mounting plate 1, the mounting hole 303 on the surface is clamped with the fixed cylinder 302 on the surface of the groove 301, assembly is convenient to complete, the surface on one side of the stop block 403 protruding from the surface of the fixed cylinder 302 is obliquely arranged, when the PCB body 2 moves downwards, the stop block 403 is conveniently extruded to the inside of the fixed cylinder 302, the first spring 404 is enabled to deform, after the PCB body 2 is clamped into the groove 301, the PCB body 2 is positioned on the lower side of the stop block 403, the stop block 403 is enabled to block the PCB body 2 through the elastic force of the first spring 404, the PCB body 2 is conveniently fixed, when disassembly is required, the stop block 409 on the surface of the fixed cylinder 302 is pressed downwards, the stop block 407 can drive the sliding plate 408 and the fixed block 407 on the surface to move, and the stop block 403 is conveniently driven to move towards the inside of the fixed cylinder 302 due to the fact that the inclined surface of the fixed block 407 is attached to the inclined plane of the inclined groove 405, and the stop block 403 is conveniently moved downwards, so that the PCB body 403 is inconvenient to take down the PCB body 2.

The heat-resistant layer 204 comprises high temperature resistant mica layer 2041 and graphite layer 2042, high temperature resistant mica layer 2041 is high temperature resistant mica pad, graphite layer 2042 is the graphite plate, high temperature resistant mica pad and graphite plate all possess good high temperature resistant performance, can promote the high temperature resistant performance of PCB board body 2 by a wide margin, heat conduction layer 205 comprises carbon fiber layer 2051 and heat conduction silica gel layer 2052, carbon fiber layer 2051 is the carbon fiber board, and heat conduction silica gel layer 2052 is heat conduction silica gel, carbon fiber board and heat conduction silica gel all have good heat conduction effect, the heat that the PCB board produced is conveniently derived, the heat resistant performance of aluminium base board layer 201 and circuit board layer 202 is indirectly promoted, heat dissipation fin 503 on the surface can absorb the heat of PCB board body 2, the area that heat dissipation fin 502 and air contact is conveniently promoted to the heat dissipation of PCB board body 2, just above just is the working process of whole device, and the content that does not make detailed in this specification all belongs to the well known prior art of expert in the art of the field.

The above embodiments are only for illustrating the present utility model and not for limiting the technical solutions described in the present utility model, and although the present utility model has been described in detail in the present specification with reference to the above embodiments, the present utility model is not limited to the above specific embodiments, and thus any modifications or equivalent substitutions are made to the present utility model; all technical solutions and modifications thereof that do not depart from the spirit and scope of the utility model are intended to be included in the scope of the appended claims.

Claims

1. An aluminum-based PCB board, includes mounting panel (1), its characterized in that: the utility model discloses a PCB board, including mounting panel (1), PCB board body (2), and mounting panel (1) and PCB board body (2) between be provided with equipment mechanism (3), and the inside of equipment mechanism (3) is provided with fixed establishment (4), inside cooling mechanism (5) that are provided with of mounting panel (1), PCB board body (2) are including aluminium base board layer (201), and the surface bonding of aluminium base board layer (201) is connected with circuit board layer (202) to the surface of circuit board layer (202) evenly scribbles green paint surface layer (203), the downside fixedly connected with heat-resisting layer (204) of aluminium base board layer (201), and the downside bonding of heat-resisting layer (204) has heat-conducting layer (205).

2. The aluminum-based PCB panel of claim 1, wherein: the assembly mechanism (3) comprises a groove (301), the groove (301) is formed in the surface of the mounting plate (1), the connection mode of the PCB body (2) and the groove (301) is a clamping connection mode, a clamping structure is formed between the PCB body (2) and the mounting plate (1), a fixed cylinder (302) is fixedly arranged in the groove (301), the surface of the PCB body (2) is provided with a mounting hole (303), and the connection mode of the fixed cylinder (302) and the mounting hole (303) is a clamping connection mode.

3. The aluminum-based PCB panel of claim 2, wherein: the fixing mechanism (4) comprises a first fixing plate (401) and a second fixing plate (402), the first fixing plate (401) and the second fixing plate (402) are fixedly installed inside the fixing cylinder (302), a stop block (403) is connected between the first fixing plate (401) and the second fixing plate (402) in a sliding mode, a first spring (404) is fixedly installed between the stop block (403) and the inner wall of the fixing cylinder (302), and the surface on one side of the fixing cylinder (302) is obliquely arranged.

4. An aluminum-based PCB as recited in claim 3, wherein: the inside sliding connection of fixed section of thick bamboo (302) has sliding plate (408), and the fixed block (407) is installed to the surface fixed mounting of sliding plate (408), fixed mounting has second spring (410) between the surface of sliding plate (408) and second fixed plate (402), the upper surface fixed mounting of sliding plate (408) has according to piece (409), and according to the connected mode between piece (409) and the fixed section of thick bamboo (302) for sliding connection.

5. The aluminum-based PCB panel of claim 4, wherein: limiting holes (406) are formed in the surface of the second fixing plate (402), the fixing blocks (407) are connected in a sliding mode in the limiting holes (406), the surface of one side of each fixing block (407) is obliquely arranged, an inclined groove (405) is formed in the surface of each stop block (403), and the inclined surface of each fixing block (407) is attached to the inclined surface of each inclined groove (405).

6. The aluminum-based PCB panel of claim 2, wherein: the cooling mechanism (5) comprises a mounting groove (501), the mounting groove (501) is formed in the surface of the groove (301), a heat conducting plate (502) is fixedly mounted in the mounting groove (501), and heat radiating fins (503) are fixedly mounted on the surface of the heat conducting plate (502).

7. The aluminum-based PCB panel of claim 1, wherein: the heat-resistant layer (204) comprises a high-temperature-resistant mica layer (2041) and a graphite layer (2042), the high-temperature-resistant mica layer (2041) and the graphite layer (2042) are fixedly connected, the high-temperature-resistant mica layer (2041) is a high-temperature-resistant mica pad, and the graphite layer (2042) is a graphite plate.

8. The aluminum-based PCB panel of claim 7, wherein: the heat conduction layer (205) comprises a carbon fiber layer (2051) and a heat conduction silica gel layer (2052), the carbon fiber layer (2051) and the heat conduction silica gel layer (2052) are connected in an adhesive mode, the carbon fiber layer (2051) is a carbon fiber plate, and the heat conduction silica gel layer (2052) is heat conduction silica gel.