CN220914232U - Power module - Google Patents
Power module Download PDFInfo
- Publication number
- CN220914232U CN220914232U CN202322308794.5U CN202322308794U CN220914232U CN 220914232 U CN220914232 U CN 220914232U CN 202322308794 U CN202322308794 U CN 202322308794U CN 220914232 U CN220914232 U CN 220914232U
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- CN
- China
- Prior art keywords
- radiator
- power module
- heat sink
- copper bar
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000003990 capacitor Substances 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 43
- 239000010949 copper Substances 0.000 claims description 43
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- -1 reflow soldering Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the utility model provides a power module, and belongs to the technical field of power semiconductor devices. The power module includes: the radiator is characterized in that the top of the radiator is recessed to the bottom to form a groove, a plurality of cooling channels are arranged in the radiator, and the cooling channels are arranged on two sides of the groove; the power semiconductor devices are arranged on two sides of the radiator; the capacitor device is arranged in the groove; the driving board card is arranged at the top of the radiator and is electrically connected with the power semiconductor device and the capacitor device. The power module is provided with the grooves on the radiator, so that the radiating area of the radiator is increased. Because the capacitor with larger volume is embedded in the groove, the side face of the radiator is provided with the power semiconductor device with smaller thickness, and the structure distribution greatly saves the volume of the power module.
Description
Technical Field
The utility model relates to the technical field of power semiconductors, in particular to a power module.
Background
New energy automobiles and industrial drives, for example: electric vehicles, hydrogen fuel cell vehicles, mining machinery, or combustion engines, etc., have different requirements for corresponding power electronic converters due to different application requirements. In the application of hydrogen fuel cell automobiles, the direct-current voltage generated by the reaction of the hydrogen fuel cell stack needs to be boosted or reduced to be converted into direct-current of the required voltage, and then the direct-current is converted into alternating current to drive an air compressor to work; in electric vehicle applications, it is necessary to convert the dc power output from the battery into ac power for driving the motor; in industrial driving applications, it is necessary to convert the voltage of the power grid into a direct current of a desired voltage, and then convert the direct current into an alternating current to drive the motor to work.
At present, for the condition of the application, voltage and current conversion needs to adopt different platforms and different types of power electronic converters, which is not beneficial to reducing production and maintenance cost, and meanwhile, in order to ensure that the bus capacitor works at a proper temperature, an indirect heat dissipation mode is often adopted, and the volume of the bus capacitor needs to be increased, which is not beneficial to improving the power density of the power electronic converter and the reliability of the bus capacitor.
Disclosure of utility model
An objective of the present utility model is to provide a power module having a smaller design volume.
In order to achieve the above object, an embodiment of the present utility model provides a power module, including:
The radiator is characterized in that the top of the radiator is recessed to the bottom to form a groove, a plurality of cooling channels are arranged in the radiator, and the cooling channels are arranged on two sides of the groove;
the power semiconductor devices are arranged on two sides of the radiator;
The capacitor device is arranged in the groove;
the driving board card is arranged at the top of the radiator and is electrically connected with the power semiconductor device and the capacitor device.
Optionally, the power module further includes a busbar disposed between the drive board card and the heat sink.
Optionally, the busbar is a multilayer copper busbar, and the multilayer copper busbar comprises an input copper busbar and an output copper busbar.
Optionally, the input copper bar is disposed on one side of the radiator, and the output copper bar is disposed on the other side of the radiator.
Optionally, the input copper bar is disposed at one end of the radiator, and the output copper bar is disposed at the other end of the radiator.
Optionally, the input copper bar is disposed at one end of the radiator, and the output copper bar is disposed at the other side of the radiator.
Optionally, a heat dissipation layer is disposed between the heat spreader and the power semiconductor device.
Optionally, the heat dissipation layer is made of heat conduction silicone grease or heat insulation glue.
Optionally, the radiator is a liquid-cooled radiator.
Through the technical scheme, the power module provided by the utility model improves the heat dissipation area of the radiator by arranging the grooves on the radiator. Because the capacitor with larger volume is embedded in the groove, the side face of the radiator is provided with the power semiconductor device with smaller thickness, and the structure distribution greatly saves the volume of the power module.
Additional features and advantages of embodiments of the utility model will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain, without limitation, the embodiments of the utility model. In the drawings:
FIG. 1 is a cross-sectional view of a power module according to one embodiment of the utility model;
FIG. 2 is a schematic diagram of a power module according to one embodiment of the utility model;
FIG. 3 is a schematic diagram of an arrangement of input copper bars and output copper bars according to one example of the utility model;
FIG. 4 is a schematic diagram of an arrangement of input copper bars and output copper bars according to an example of the utility model;
fig. 5 is a schematic diagram of an arrangement of input copper bars and output copper bars according to an example of the utility model.
Description of the reference numerals
1. Radiator 2 and power semiconductor device
3. Capacitor device 4 and driving board card
5. Busbar 5-1, input busbar
5-2, Output busbar 6 and heat dissipation layer
Detailed Description
The following describes the detailed implementation of the embodiments of the present utility model with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the utility model, are not intended to limit the utility model.
In the embodiments of the present utility model, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the positional relationship of the various components with respect to one another in the vertical, vertical or gravitational directions.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
A cross-sectional view of a power module according to one embodiment of the utility model is shown in fig. 1. Fig. 2 is a schematic diagram of a power module according to an embodiment of the utility model. In fig. 1 and 2, the power module may include a heat sink 1, a power semiconductor device 2, a capacitor device 3, and a driving board 4. Wherein the top of the heat sink 1 is recessed toward the bottom to form a recess. The radiator 1 is provided with a plurality of cooling channels inside, which can be arranged on both sides of the groove, so that the heat on the side surface of the groove and on both sides of the radiator can be taken away conveniently.
In fig. 1, the power semiconductor device 2 has a large area but a small thickness, and therefore, may be provided on the side surface of the heat sink 1. The capacitor 3 is formed to have a larger volume and a larger thickness, and thus may be provided on the top of the heat sink 1 for saving the volume. The driving board 4 needs to be electrically connected with the capacitor device 3 and the power semiconductor device 2 at the same time, so that the driving board 4 can be arranged on the top of the heat sink 1 to reduce wiring difficulty.
In the power module, the driving board card 4 needs to be electrically connected with the power semiconductor 2 and the capacitor 3 at the same time, and in consideration of connection stability and connection difficulty, as shown in fig. 1 and 2, the power module may include a busbar 5. The busbar 5 may be arranged between the drive board 4 and the heat sink 1. Further, the busbar 5 may be a multi-layered copper busbar in view of wiring requirements of the power module.
In this embodiment, the power semiconductor device 2 may be a module including one or more of various types known to those skilled in the art, including but not limited to a single tube (MOS tube, etc.), a half-bridge module, a Boost module, a Buck module, etc. Similarly, the capacitive device 3 may also be a module comprising a variety of types known to those skilled in the art, including but not limited to one or more of bus bar capacitance, X capacitance, Y capacitance, and the like.
In addition, the specific structure of the cooling channel may be various as known to those skilled in the art, including but not limited to one or more heat dissipation structures of Pin-fin, offset-fin, oval, drop-shaped, etc.
In this embodiment, the specific connection between the heat sink 1 and the power semiconductor device 2 may be various as known to those skilled in the art, including, but not limited to, screw fixation, solder fixation, and/or spring press fixation. Similarly, the connection between the drive board 4 and the capacitive device 3 may be a variety of ways known to those skilled in the art, including but not limited to bolts, laser welding, and/or resistance welding. While the connection between the drive board 4 and the power semiconductor 2 may be in a variety of ways known to those skilled in the art, including, but not limited to, laser welding and/or resistance welding.
The specific arrangement of the multilayer copper bar may be a variety known to those skilled in the art. In this embodiment, the multi-layered copper bar may be divided into an input copper bar 5-1 and an output copper bar 5-2. The input copper bar 5-1 may be a dc input copper bar, and the output copper bar 5-2 may be an ac output copper bar. To facilitate external wiring, the input copper bar 5-1 and the output copper bar 5-2 may be provided at the end or both sides of the heat sink 1, respectively. In one example of the present utility model, as shown in fig. 3, the input copper bar 5-1 may be disposed at one side of the heat sink 1, and the output copper bar 5-2 may be disposed at the other side of the heat sink 1. In another example of the present utility model, as shown in fig. 4, the input copper bar 5-1 may be disposed at one end of the heat sink 1, and the output copper bar 5-2 may be disposed at the other end of the heat sink 1. In still another example of the present utility model, as shown in fig. 5, an input copper bar 5-1 may be provided at one end of the heat sink 1, and an output copper bar 5-2 may be provided at one side of the heat sink 1.
The capacitive device 3 is arranged in a recess of the heat sink 1. In one example of the present utility model, a heat dissipation layer 6 may be provided between the capacitive device 3 and the heat sink 1 in order to improve the heat conduction efficiency between the capacitive device and the heat sink 1. Further, in order to ensure the heat conduction efficiency of the heat dissipation layer 6, the material of the heat dissipation layer 6 may be heat conductive silicone grease, heat insulating glue, reflow soldering, silver/copper sintering, or the like.
The power semiconductor device 2 is arranged in a recess of the heat sink 1. In one example of the present utility model, in order to improve the heat conduction efficiency between the power semiconductor device 2 and the heat sink 1, a heat dissipation layer may be provided between the power semiconductor device 2 and the heat sink 1. Further, in order to ensure the heat conduction efficiency of the heat dissipation layer, the material of the heat dissipation layer may be a heat conductive silicone grease or a heat insulating adhesive.
Through the technical scheme, the power module provided by the utility model improves the heat dissipation area of the radiator by arranging the grooves on the radiator. Because the capacitor with larger volume is embedded in the groove, the side face of the radiator is provided with the power semiconductor device with smaller thickness, and the structure distribution greatly saves the volume of the power module.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (9)
1. A power module, the power module comprising:
The radiator is characterized in that the top of the radiator is recessed to the bottom to form a groove, a plurality of cooling channels are arranged in the radiator, and the cooling channels are arranged on two sides of the groove;
the power semiconductor devices are arranged on two sides of the radiator;
The capacitor device is arranged in the groove;
the driving board card is arranged at the top of the radiator and is electrically connected with the power semiconductor device and the capacitor device.
2. The power module of claim 1, further comprising a busbar disposed between the drive board card and the heat sink.
3. The power module of claim 2, wherein the busbar is a multi-layer copper bar comprising an input copper bar and an output copper bar.
4. A power module according to claim 3, wherein the input copper bar is disposed on one side of the heat sink and the output copper bar is disposed on the other side of the heat sink.
5. A power module according to claim 3, wherein the input copper bar is disposed at one end of the heat sink and the output copper bar is disposed at the other end of the heat sink.
6. A power module according to claim 3, wherein the input copper bar is disposed at one end of the heat sink and the output copper bar is disposed at the other side of the heat sink.
7. The power module of claim 1, wherein a heat sink layer is disposed between the heat sink and the power semiconductor device.
8. The power module of claim 7, wherein the heat dissipation layer is made of a thermally conductive silicone or a thermally insulating adhesive.
9. The power module of claim 1 wherein the heat sink is a liquid cooled heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322308794.5U CN220914232U (en) | 2023-08-25 | 2023-08-25 | Power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322308794.5U CN220914232U (en) | 2023-08-25 | 2023-08-25 | Power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220914232U true CN220914232U (en) | 2024-05-07 |
Family
ID=90911685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322308794.5U Active CN220914232U (en) | 2023-08-25 | 2023-08-25 | Power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220914232U (en) |
-
2023
- 2023-08-25 CN CN202322308794.5U patent/CN220914232U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |